Nanomaterials
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2022
·Vol. 12
·期 16
·2862
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IF 5.719
Yuewei Li,Ranjith Kumar Kankala,Ai-Zheng Chen,Shi-Bin Wang
Liquid crystal display (LCD)-based 3D printing, a facile and cost-effective manufacturing technique, is often applied when fabricating objects with porcelain structures using photosensitive resins (PSRs). Currently, 3D printed constructions are typically used as models for demonstration purposes rather than industrial applications because of their poor performance. In this study, we prepared nanocomposites by incorporating Ti3C2MXene nanosheets to enhance the overall characteristics of a PSR, including mechanical properties and thermal resistance. Notably, the designed nanocomposites showed optimum performance at an MXene loading of 0.5%w/w. The mechanical properties of the designed nanocomposites confirmed the enhanced ultimate tensile and flexural strengths (by 32.1% and 42.7%, respectively), at 0.5%w/wMXene loading. Moreover, the incorporated MXene presented no substantial influence on the toughness of the PSR. The glass transition and thermal degradation temperatures at 5% weight loss increased by 7.4 and 10.6 °C, respectively, resulting predominantly from the hydrogen bonding between the PSR and MXene. Together, the experimental results indicate that the designed PSR/MXene nanocomposites are expected to replace pristine resins for LCD printing in various practical applications.Keywords:3D printing;photosensitive resin;mechanical property;thermal resistance
研究领域:
材料科学
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工程学
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DOI
PubMed
高影响因子
POLYMER
·
2025
·
IF 4.5
Zehua Zhuo,Rui Wang,Shaoyun Chen,Jianhong Gao,Cuifang Cai,Yanyu Zheng,Xiaoying Liu,Bo Qu,Qinghui Chen,Dongxian Zhuo
To advance the application of stereolithography (SLA) 3D printing in demanding environments, there is an urgent need for photopolymers that simultaneously achieve flame retardancy and structural robustness. In this study, a photosensitive branched prepolymer (TTH) with phosphorus-sulfur co-synergistic flame suppression and rigid heat-resistant heterocyclic ring structure was synthesized through molecular topology design, followed by its application in SLA printing. The branched structure endows TTH with substantial photosensitivity, which not only imparts superior 3D printing performance to the photosensitive resin but also enhances its mechanical properties and flame retardancy upon incorporation. The tensile strength, impact strength and storage modulus of photosensitive resin containing 80 wt% TTH are 187 %, 84 %, and 346 % higher than those of commercial photosensitive resin matrix (TTH-0). Meanwhile, the optimized resin achieved a limiting oxygen index (LOI) of 27.2 %, UL-94 V-0 rating, and 74 %/27 % reductions in peak heat release rate (PHRR)/total heat release (THR) compared to TTH-0. These results demonstrate that the TTH system combines branched molecular design with dual fire-safety reinforcement, positioning it as a high-performance candidate for functional 3D-printed components requiring stringent flame and mechanical compliance.
研究领域:
材料科学
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高分子化学
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消防安全
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增材制造
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DOI
高影响因子
Journal of Science-Advanced Materials and Devices
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2024
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IF 6.7
Hang Ning,Shaoyun Chen,Yan'e Liu,Bo Qu,Yanyu Zheng,Xiaoying Liu,Wenjie Li,Rui Wang,Nairong Chen,Dongxian Zhuo
High-performance resins that can withstand temperature changes are required to expand the application potential of additive manufacturing (3D printing) in response to increasing demand from various fields. In this study, a novel 3D-printing polybutadiene polyurethane acrylate photosensitive resin named HTPBMA was prepared by mixing hydroxyl-terminated polybutadiene (HTPB) as the base material with other active diluent monomers and photoinitiators, including hydroxypropyl methacrylate (HPMA). The resulting resins exhibited good rheological properties and rapid photocuring ability, depending on the type and proportion of diluent monomer. In particular, the tensile strength and elongation at break of the sample with a 65:35 HTPBMA:HPMA ratio at −25 °C were 32.9 MPa and 246.1%, respectively, being 2.13 and 1.58 times the values at room temperature, respectively. These results indicate that HTPBMA exhibits excellent low-temperature performance and physical properties. The enhancement mechanism can likely be attributed to introducing of a flexible carbon chain as well as increased cross-linking density (υ e ). These advantages suggest that the novel photosensitive resin designed and prepared in this study can be used for photocuring 3D printing and maintain excellent performance under extreme climatic conditions. Thus, the proposed HTPBMA has broad application prospects in aerospace and materials science, especially in shoe materials and tires.
研究领域:
材料科学
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化学工程
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航空航天
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DOI
高影响因子
Advanced Science
·
2024
·
IF 14.3
Junyu Cai,Songhua Ma,Wenbin Yi,Jieping Wang
Current additive manufacturing (AM) techniques for tungsten, such as powder bed fusion and directed energy deposition, often generate parts with rough surfaces. Vat photopolymerization presents a promising alternative for fabricating tungsten structures with high shape fidelity and low surface roughness. However, existing vat photopolymerization approaches suffer from surface defects and low final density, leading to compromised mechanical properties. Therefore, achieving high-density tungsten structures using vat photopolymerization remains a crucial challenge. This work presents a straightforward and reliable method for fabricating complex, micro-architected tungsten structures with superior density and hardness. The approach utilizes a water-based photoresin with exceptional tungsten ion loading capacity. The photoresin is then patterned using digital light processing (DLP) to create tungsten-laden precursors. A three-step debinding and sintering process subsequently achieves 3D tungsten structures with dense surface morphology and minimal internal defects. The microstructures achieve a minimum feature size of 35 µm, a low surface roughness of 2.86 µm, and demonstrate exceptional mechanical properties. This new method for structuring tungsten opens doors to a broad range of applications, including micromachining, collimators, detectors, and metamaterials.
研究领域:
材料科学
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增材制造
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产品关联
DOI
PubMed
高影响因子
CERAMICS INTERNATIONAL
·
2024
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IF 5.1
Yongkang Yang,Boran Wang,Jie Li,Jianglin Wang,Ke Wang,Yue Wang,Shuxin Niu,Xin Li,Xiqing Xu
In the vat photopolymerization (VPP) 3D printing of ceramic cores, the solid loading is generally conducive to the microstructure and performance of products, owing to the improved bonding between adjacent layers and enhanced dimensional accuracy with increasing solid loading. In this work, the content of ceramic powder in photosensitive resin was optimized, the solid loading increased from 56 vol% to 68 vol%, and a novel curing model was established to explain the impact of solid loading on the printing precision. During sintering, the shrinkage is regulated to approximately 3 %, demonstrating a more homogeneous structure. The interlayer strength increased to 11.43 MPa while maintaining an apparent porosity of 23.47 %. Furthermore, the anisotropy of VPP-3D printed ceramic cores dependent on the solid loading was investigated. The ratio of vertical strength to horizontal strength (σ V /σ H ) increased from 0.57 to 0.68 when the solid loading grew from 56 vol% to 68 vol%. At 1540 °C, the value of σ V /σ H was further enhanced to 0.81. This value met the precision casting criteria for ceramic cores effectively. This work can provide a reference for the investigation of high-solid-loading ceramic cores.
研究领域:
材料科学
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制造工程
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产品关联
DOI
高影响因子
PROGRESS IN ORGANIC COATINGS
·
2023
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IF 6.6
Yuying Liu,Baolong Xue,Shuheng Liang,Jiadeng Zhu,Yuanyuan Yu,Yulin Zhou,Mengjin Jiang,Junhua Zhang
Since the invention of movable type in ancient times, relief printing, often called flexographic printing, has been performed to mass-produce artifacts ranging from decorative graphics to printed media. Polyvinyl alcohol (PVA) substrates are soluble in water with low toxicity but have the disadvantages of poor elasticity and brittleness . Thus, this study aims to improve the resilience of water-developable photopolymer resin plates by modifying PVA with allyl polyoxyethylene ether (APEG) in solution polymerization . In order to better control polymerization, the reactivity ratios of both were investigated (r VAC = 0.32 and r APEG = 0.12). Impressively, the lowest glass transition temperature (T g ) of the modified PVA ( m -PVA) can reach −49.98 °C, which is significantly lower than that of PVA0599 (degree of polymerization = 500, degree of hydrolysis = 99 mol%) (T g = 52.02 °C). Moreover, this resultant m -PVA exhibits superior elongation at break (443.23 ± 37.65 %) than PVA0599 (9.98 ± 3.95 %). It is found that photopolymer plates of m -PVA have maintained a 98 % elasticity recovery rate even after water washing. Due to the better elasticity of m -PVA, the clarity of the photopolymer plate is higher than that of traditional PVA. This water-soluble self-plasticized m -PVA is expected to be applied to the fine flexographic printing industry, such as electronic devices, components, and sensors.
研究领域:
材料科学
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印刷技术
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DOI
高影响因子
POLYMERS FOR ADVANCED TECHNOLOGIES
·
2024
·Vol. 35
·期 11
·e6598
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IF 3.1
Lingmei Jiang,Chenghao Wang,Changhong Xiao,Guangsheng Zhang,Yibo Wang,Haoran Liu,Kuanyu Yuan,Lishuai Zong,Jinyan Wang,Xigao Jian
For large-area electronic and high shape complexity structure applications, various solution-processable materials are chosen as dielectric layer due to their simple molding process via spin-coating, casting, or 3D printing at room temperature. Herein, the acrylic-ended fluorinated hyperbranched polyaryletherketone ( hb -P6FAEK-Ace) was used as the prepolymer and then, the composition of photosensitive resin formula was regulated by adjusting the addition ratio of hb -P6FAEK-Ace and diluents (acrylimorpholine [ACMO] 1,6-Hexanediol diacrylate [HDDA]). These photosensitive resin solutions showed the relative low viscosities ranged ranging from 18 to 253 mPa S at 100°C which was in favor of the future 3D printing method and printing accuracy. Then, the obtained UV-cured films show the maximum tensile strength up to 71.9 MPa and superior thermal properties with the T g of 157°C–177°C and T 5% of 314°C–351°C. Moreover, they also exhibited the good dielectric performance with dielectric constants of 2.43–2.20 and dielectric loss of 0.013–0.014 at 1 MHz–1 GHz. These abovementioned satisfactory performance could be ascribed to the aromatic skeleton of hb -P6FAEK-Ace, introduced polarizability-CF 3 groups and the inner cavities for the hyperbranched structures, also the precise control of formula composition. Additionally, the curing degree, shrinkage of solid, and moisture properties were also researched thoroughly. This work provides a simple formula design though to construct the high performance and low dielectric photosensitive resin for the requirements of microelectronic applications.
研究领域:
材料科学
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电子工程
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DOI
高影响因子
MATERIALS & DESIGN
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2024
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IF 7.6
Dongmei Wang,Rui Wang,Shaoyun Chen,Jianhong Gao,Cuifang Cai,Yanyu Zheng,Xiaoying Liu,Bo Qu,Nairong Chen,Dongxian Zhuo
Flexible sensors show the wide range of applications in electronic products. However, challenges remain in developing sensors with internal complex construction, excellent flexibility, elasticity and strength. In this paper, a prepolymer (PU-PDMS-OH-HEMA) contain polyurethane (PU) segments and polysiloxane (PDMS) segments was synthesized, and the photosensitive resins with low viscosity for 3D printing were prepared by mixing prepolymers with diluents and photoinitiators. The resultant cured photosensitive resins showed the improved mechanical properties. The PDMS-OH-30 sample exhibit the excellent mechanical properties, with tensile strength and elongation at break of 10.03 MPa and 1046.15 %, respectively, and the resin viscosity of 62 cP. Conductive ionic liquids were added to the above photosensitive resins to prepare flexible sensors, which show the electrical sensitivity and stability. The findings in the work propose a contribution to the development of highly flexible 3D printing resins for fabricating flexible sensors.
研究领域:
材料科学
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电子工程
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产品关联
DOI
高影响因子
POLYMER
·
2022
·
IF 4.432
Shujun Tan,Yao Wu,Yang Hou,Haoyu Deng,Xiaoxuan Liu,Shoujuan Wang,Hongping Xiang,Minzhi Rong,Mingqiu Zhang
UV-curing 3D printing has shown extensive applications, but its crucial photosensitive resin is still challenged by poor toughness and high brittleness . This study is to improve the toughness of 3D printing resin by modified waste nitrile rubber powders (WNRP). Component analysis of WNRP indicates that volatile compounds , rubber polymers and inorganic fillers are 11, 44 and 43 wt%, respectively. The thiol contents grafted on WNRP range from 18 to 58 μmol/g via thiol-ene reaction. The incorporation of modified WNRP into 3D printing photosensitive resin slightly improves viscosity and decreases conversion, but it still can be printed out high-precision items. A little of modified WNRP significantly improves the toughness from 1.9 to 3.4 kJ/cm 2 by 80%, depending on cavitation and deformation effect. This strategy not only greatly improve the toughness of 3D printing resin, but also reutilize waste rubber powders enabling to decrease resource waste.
研究领域:
材料科学
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环境科学
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化学工程
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产品关联
DOI
高影响因子
JOURNAL OF POLYMER RESEARCH
·
2023
·Vol. 30
·期 8
·1-9
·
IF 2.8
He Dan,Zhu Dandan,Zheng Zhen,Wang Xinling
In recently years, polyol prepared from biobased renewable resources has attracted researchers' attention to synthesize green environmental polyurethane. Among numerous polyols, poly (trimethylene ether glycol) (PO3G) is used to prepare polyurethane due to outstanding performances. This paper aims to prepare photosensitive polyurethane acrylate based on 100% renewable PO3G with low viscosity, great flexibility and fast curing speed. The physical and thermal properties of materials were characterized by FTIR, ATR, DSC and DMA. The mechanical properties were measured emphatically. All the results suggest the prepared PO3G-based resins exhibit excellent strength and flexibility with low viscosity. On the other hand, the blocking agent with dynamic covalent bond was introduced to ensure the low viscosity of resins under UV curing. With the break of blocking agent, the isocyanate group could be fully released and carry out chain extension with amine during secondary curing to form polyurethane network and comprehensive performance of resins. Furthermore, the prepared materials have significant advantage and show good application potential in UV-curing 3D printing.
研究领域:
材料科学
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化学工程
✓ 已验证
产品关联
DOI
高影响因子
ADVANCED ENGINEERING MATERIALS
·
2025
·
IF 3.3
Lai Wei,Jing Li,Shuai Zhang,Kai Fu,Ning Li,Zhanwen Zhang
This study systematically investigates the ultraviolet-assisted direct ink writing (UV-DIW) process, focusing on the influence of critical parameters, including UV intensity, the ratio of printing speed to ink extrusion rate ( v P / v E $v_{P} / v_{E}$ ), and relative nozzle height ( H / h ), on filament fusion and structural morphology. The rheological behavior of photosensitive resin ink is analyzed, revealing that UV irradiation induces a fluid-to-solid transition critical for shape retention and structural integrity. The results demonstrate that UV intensity plays a pivotal role in controlling filament fusion, with insufficient curing causing filament sagging and excessive fusion, while higher UV intensities improve structural fidelity. Additionally, printability (Pr), calculated from cross-sectional analysis, is used as a quantitative metric to assess filament fusion quality and structure preservation. Parameter phase diagrams are developed to visually map the relationships among printing variables, providing a framework for optimizing UV-DIW conditions. The successful fabrication of dense solid blocks without filament interfaces highlights the potential of UV-DIW for producing high-quality, defect-free 3D structures. This work provides valuable insights into parameter tuning, paving the way for advanced applications in manufacturing, biomedical engineering, and material science.
研究领域:
制造工程
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材料科学
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生物医学工程
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产品关联
DOI
高影响因子
COMPOSITES PART B-ENGINEERING
·
2025
·
IF 14.2
Tongyi Wu,Qiaoling Zhang,Zhongbiao Xie,Xiangqin Ding,Tianhua Liu,Haisheng Hu,Xiaomin Zhang,Guoqiao Lai,Qiu Chen
Additive manufacturing is advancing rapidly and gaining widespread adoption across various industries. Although ZnO nanoparticles (ZnO-NPs) hold significant promise, their tendency to agglomerate in photosensitive resins presents a challenge, obstructing the UV-curing process in 3D printing. In response to this, we have innovatively developed a PUA-based functional photosensitive resin for 3D printing, which incorporates highly dispersible Organosilicon@ZnO-NPs. These nanoparticles exhibit smaller sizes and a more uniform distribution, achieved through the spray sedimentation method. Using Digital Light Processing (DLP), the resin demonstrated enhanced mechanical properties, including a tensile strength of 75.188 MPa (a 96.34 % improvement), a flexural modulus of 2223.276 MPa (a 71.81 % improvement), as well as high-precision 3D-printed material. The material also exhibited efficient broad-spectrum antimicrobial properties (99.64 % against E. coli and 98.93 % against S. aureus ) and strong UV-shielding performance (97.32 % UV-blocking rate). Mechanistically, the improvement in mechanical properties is attributed to the role of Organosilicon@ZnO-NPs, which function similarly to an amine chain extender. This allows them to establish a robust hydrogen bonding network within the PUA-based photosensitive resin and react with free –NCO groups in the system. The antimicrobial and UV-shielding effects stem from the combined actions of Organosilicon@ZnO-NPs, which disrupt bacterial cell membranes, release Zn 2 ⁺ ions, and scatter and absorb UV light. This study paves the way for novel applications of ZnO-NPs in UV-curing 3D printing, opening new avenues for innovation.
研究领域:
材料科学
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生物医学工程
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产品关联
DOI
高影响因子
危险品化学品经营许可证（带存储）