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RSC Advances · 2017 ·Vol. 7 ·期 58 ·36382-36391 · IF 3.108

Improving interface adhesion of magnetic particle modified EVA hot melt adhesive through introduction of a thermodynamically compatible component

Xiaobin Lu,Hongguo Zhao,Chunhui Feng,Qian Chen,Zhao Zhang,Chunhua Yang,Xianru He,Xin Wang

In order to improve the compatibility of Fe3O4 particles with ethylene vinyl acetate copolymers (EVA) composite hot melt adhesives (HMAs), Fe3O4 magnetic particles were surface coated with polyvinyl acetate (PVAc). The PVAc-coated Fe3O4 modified EVA composite HMAs were characterized by SEM, DSC, XRD, optical contact angle measuring, infrared dichroism and parallel-plate rheometer measurements. The results showed that Fe3O4 particles were successfully coated by PVAc, leading to better dispersion of the particles in EVA composite HMAs. It was also found that the orientation structure, interfacial property and the flow properties of the modified HMAs were all changed, and the segment orientation degree and crystallinity of the modified EVA composite HMAs clearly increased with the increase of PVAc-coated Fe3O4 particles content. Importantly, the peel strength of the modified HMAs was further enhanced. For the modified HMAs with 15 phr (parts per hundred resins) of PVAc-coated Fe3O4 particles, the peel strength reached 6.6 kN m−1 and was increased by 247% compared with the unmodified HMAs.

CAS / MDL: 1321-74-0 1317-61-9
研究领域: 材料科学 · 高分子化学
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ACS Applied Materials & Interfaces · 2025 · IF 8.2

A Bending-Resistant Epoxy PSLC Film with Ultrahigh Peel Strength via Well-Controlled Rapid Cationic Polymerization for Smart Window Applications

Zhexu Song,Yingjie Shi,Tianfu Zhou,Meiqi Yang,Meina Yu,Yanzi Gao,Cheng Zou,Huai Yang

The polymer-stabilized liquid crystal (PSLC) dimming film has garnered widespread attention due to its energy-saving features and good electro-optical performance, making it highly suitable for smart windows in automotive and architectural applications. However, its poor mechanical properties severely limit its large-scale flexible film production and wide application due to its internal fine and fragile polymer network. Enhancing the processability and peel strength of PSLC films remains particularly challenging because electro-optical performance degrades rapidly with increasing polymer content. Herein, a PSLC film with ultrahigh peel strength and good electro-optical performance is attained through well-controlled rapid photopolymerization of epoxy monomers using photoinitiators 1173 and 1176. The polymerization time is greatly shortened from hours to a few minutes, and the polymer content of this composite film is increased to over 20 wt % by carefully controlling light intensity, photoinitiator, and monomer composition, while retaining good electro-optical performance. The peel strength and contrast ratio are improved by over 40 times and 3 times, respectively, compared to epoxy PSLCs prepared by normal cationic polymerization. The peel strength of this film is incredibly high, about 500 times that of a traditional PSLC device, and is even higher than those of some polymer-dispersed liquid crystal films. The cycle stability and thermal stability of PSLC films have also been significantly improved a lot. The dependence of monomer composition on the microstructures, electro-optical, and mechanical properties of the PSLC film has been systematically studied. This research provides a novel strategy for the fabrication of high-performance PSLC films toward next-generation energy-efficient smart windows.

CAS / MDL: 7473-98-5
研究领域: 材料科学 · 高分子化学 · 光电工程
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Materials Research Express · 2018 ·Vol. 5 ·期 6 ·066409 · IF 1.151

Finely balanced high heat conductivity, peel strength and breakdown voltage in polymer composites with binary hybrid inorganic fillers

Cheng Peng,Yefeng Feng

Nowadays, the demand of polymer based composites with high thermal conductance is rapidly increasing. Thermal conductive acrylate pressure sensitive adhesives are widely studied due to their excellent ageing resistance, light resistance, water resistance, oil resistance and broad application field. In this work, thermal conductive pressure sensitive adhesives with excellent comprehensive performances have been prepared from acrylate pressure-sensitive adhesive (matrix) and aluminum oxide/aluminum nitride particles (fillers). The influences of the class, loading content and grain size of fillers on heat conductivity, electric insulation and mechanical features of composites were deeply researched. High dispersion of fillers in matrix could be obtained by surface modification of fillers using silane coupling agent and polymethyl methacrylate. Heat conductivity of composites was improved with increasing of filler content and sharply elevated at a critical filler content. As filler content was increased, electric insulation trait was reduced but still kept at a relatively high level. High filler content was harmful to mechanical property. Fortunately, the composites with hybrid fillers of varied grain sizes were found to have significantly promoted thermal conducting, electric insulating and mechanical performances in comparison with single filler of one size. That might be ascribed to synergistic effect of both fillers with varied grain sizes. Finely balanced comprehensive features were achieved at a weight ratio of 3:7 (small size filler/large one). High heat conductivity (∼0.83 W m−1K−1), breakdown voltage (∼1.9 kV) and 180° peel strength (∼8.3 kN m−1) were obtained. This work might open the door to the large-scale fabrication of high-performance thermal conductive acrylic pressure sensitive adhesives based on size effect of hybrid fillers.

CAS / MDL: 2530-85-0
研究领域: 材料科学 · 高分子化学
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JOURNAL OF APPLIED ELECTROCHEMISTRY · 2025 · IF 3

Effects of multi-component additives on the microstructure and mechanical performance of HVLP copper foil for high-speed electronic devices

Zhou Meng-ran,Sun Wan-chang,Liu Er-yong,Xiao Yan,Xu Yi-fan,Zhang Bo,Jia Tian-ze,Cai Hui,Zhang Jing-li

With the emergence of 5th Generation Mobile Communication Technology, the global demand for high volume low pressure (HVLP) copper foil is experiencing continuous growth. In order to obtain HVLP copper foil with excellent performance, it is crucial to reconcile the contradiction between low profile and high peel resistance. Additives play a pivotal role in determining the quality of copper foil. Sodium phenyldithiopropane (BSP), 3,3′-Dithiobis-1-Propanesulfonic Acid Disodium Salt (SPS), Hydroxyethyl cellulose (HEC), and Gelatin are common additives that can function independently or synergistically with each other. Therefore, it is imperative to explore an improved combination of additives that can enhance the electrolysis process of copper foil. This paper investigates a novel multi-component additive formulation using orthogonal experimental design. The effects of composite additive combinations including SPS + HEC + Gelatin (SHG), BSP + HEC + Gelatin (BHG), and BSP + SPS + HEC + Gelatin (BSHG) on the morphology and performance of the coarsening layer in copper foil were examined. Among these combinations, BSHG-5 (20 mg L −1 BSP, 40 mg L −1 SPS, 7 mg L −1 HEC, 20 mg L −1 gelatin) exhibited optimal results. Under this composite additive system, copper particles were uniformly and finely deposited in the coarsened layer, resulting in significantly enhanced peel strength (0.72 N mm −1 ) and favorable surface roughness. Graphical abstract

CAS / MDL: 9000-70-8 9004-62-0
研究领域: 材料科学 · 电子工程
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IONICS · 2024 ·Vol. 30 ·期 7 ·4281-4295 · IF 2.4

Functional additives inhibit crystal growth to achieve low-roughness and high-peel strength of micro-coarsening copper foil

Li Lanchen,Peng Xuesong,Jiang Jie,Li Ruopeng,Zhang Jinqiu,Yang Peixia,An Maozhong

With the global proliferation of 5G technology, advancing electronic interconnection technologies has become critically important. The development of high-quality electrolytic copper foils, essential for efficient signal transmission, has garnered considerable attention. To mitigate the "skin effect" that could impair signal transmission and to ensure robust adhesion of electrolytic copper foils to the substrate, it's necessary to roughen the copper foils. This roughening process aims to substantially enhance the peel strength of the copper foils without exceeding the bounds of acceptable roughness. An effective strategy to achieve this involves the use of additives to refine the micro-coarsened surface of the copper foils. In this context, we have explored the impact of additives such as carrageenan, guar gum, and SPS on the surface morphology, roughness, and peel strength of electrolytic copper foils. Three types of additives can improve the performance of micro-roughened copper foil. Through electrochemical tests, it was found that all three types of additives have the effect of increasing cathodic polarization. The adsorption behavior of different additives was studied through theoretical calculations. By hybriding the three additives, two micro-coarsening systems were screened to obtain the lowest roughness and the highest peel strength, respectively. At the same time, the relationship between peel strength and surface area was verified, with the larger surface area resulting in greater peel strength. Finally, the synergistic effect of the three additives on increasing cathodic polarization was verified through chronopotentiometry. Graphical Abstract

研究领域: 材料科学 · 电子工程
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JOURNAL OF APPLIED POLYMER SCIENCE · 2015 ·Vol. 133 ·期 8 · IF 1.768

Siloxane-modified polyacrylate low-residual pressure-sensitive adhesive with high peeling strength

Pengjuan Li,Fuwei Nian,Min Zhang,Minmin Shen,Yongqiang Dai,Hao Pang,Bing Liao

A low-residual siloxane-modified polyacrylate pressure-sensitive adhesive (PSA) with a high peeling strength was prepared by seeded semicontinuous emulsion polymerization. 3-Glycidyloxypropyltrimethoxysilane was introduced into the acrylic (AC) PSA through a thermal posttreatment method to crosslink with AC. To improve the adhesion properties, a polymeric emulsifier, 2-acrylamido-2-methyl-1-propanesulfonic acid, was introduced into the system with the conventional emulsifier. Several key polymerization conditions, such as the initiator concentration, mass ratio of soft monomer to hard monomer, the content of polymeric emulsifier, and siloxane dosages were examined in detail. Then, the optimal conditions and a proper preparation process were established. The results show that we achieved not only a low repeeling residue with high tack and peeling strength but also excellent properties of high-temperature aging resistance and water resistance. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016 , 133 , 42975.

研究领域: 材料科学 · 化学工程
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JOURNAL OF APPLIED ELECTROCHEMISTRY · 2023 ·Vol. 53 ·期 12 ·2331-2346 · IF 2.9

Effect of additives on microstructure and properties of the coarsened layer of very low profile (HVLP) copper foil

Xiao Yan,Sun Wan-chang,Bai Zhong-bo,Liu Er-yong,Du Liang-liang,Cai Hui,Wang Li-ping,Liu Jing-pei,Jia Ya-peng,Zhang Jie

Additives are a cost-effective method to improve the performance of the very low profile (HVLP) copper foil coarsened layer. In this paper, the effects of 3,3’-Dithiobis-1-propanesulfonic acid disodium salt (SPS), gelatin, and sodium thiazoline dithiopropane sulfonate (SH110) concentration on the morphology, roughness, and peel strength of HVLP copper foil was reported. The results show that SH110 contributes significantly to the reduction of copper foil roughness, improvement of peel strength, and refinement of coarsened layer grains. In addition, the linear scanning voltammetry and AC impedance spectroscopy of the solution were carried out to understand the action mechanism of additives on the copper foil surface. The results demonstrate that SPS promotes the copper deposition process due to the presence of sulfonic acid groups(–SO 3 ). The amino group(–NH 2 ) of gelatin inhibits copper deposition. SH110 has both promoter (Sodium 3-Mercapto-1-Propane Sulfonate, MPS) and inhibitor (Tetrahydrothiazolidinone, H1) fragments, which achieve synergistic or competitive effects consistent with the composite additive. Graphical abstract

CAS / MDL: 9000-70-8
研究领域: 材料科学 · 电化学
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COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS · 2024 · IF 4.9

Mechanistic insight into the Janus Green B on electrochemical roughening layer of copper foil

Xuesong Peng,Lanchen Li,Jie Jiang,Yaqiang Li,Xin Li,Guangzhao Wang,Anmin Liu,Meijuan Zhang,Ruopeng Li,Maozhong An

This study explores the impact of the electroplating additive JGB the surface characteristics and peel strength of electrolytic copper foils used in printed circuit boards . Utilizing Scanning Electron Microscopy and Atomic Force Microscopy , we found that optimal JGB concentrations enhance the morphology and roughness of the copper foil roughening layer while maintaining high peel strength. The ideal concentration of 3 mg/L achieved an average roughness of 0.953 µm and a peel strength of 0.946 N/mm. JGB's effectiveness in inhibiting copper deposition was confirmed through cyclic voltammetry , linear sweep voltammetry, and electrochemical impedance spectroscopy . Density Functional Theory calculations and in situ infrared spectroscopy elucidated JGB's adsorption and coordination actions, which have a synergistic effect on its inhibitory performance. Further investigations with molecular dynamics simulations and finite element analysis demonstrated JGB's preferential adsorption in areas of high electric field intensity, effectively controlling the copper grain morphology in the roughening layer. This research highlights the potential of dye-type additives in improving copper foil roughening for printed circuit boards applications. Future research should explore the long-term stability and environmental impact of JGB in industrial applications, while investigating other dye-type additives may further optimize the roughening process to meet diverse printed circuit boards manufacturing needs.

研究领域: 材料科学 · 电化学 · 表面工程
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ACS Applied Polymer Materials · 2024 · IF 4.4

π–π Interactions for Dramatically Enhanced Cohesion and Underwater Adhesion in Pressure-Sensitive Adhesives

Yafang Han,Jun Shi,Jiwen Hu,Renjie Zhou,Ziyang Gong,Weile Li

The achievement of underwater bonding and maintaining bond stability are significant challenges due to interfacial water and hydration weakening adhesive bonds. In this study, a dry pressure-sensitive adhesive (PSA) was successfully developed through a one-step synthesis involving the random copolymerization of ethylene glycol phenyl ether acrylate (PEA), 2-ethylhexyl acrylate (2-EHA), and acrylic acid (AA). This PSA displayed good hydrophobicity, moderate Young’s modulus, and tensile strength, forming strong interfacial bonds with various substrates in water. The effect of the aromatic monomer PEA content on the adhesive properties, shear properties, and heat resistance of PSA was systematically investigated. Notably, at 10 mol % PEA content (P-AEP10), the PSA exhibited remarkable mechanical strength and bond strength, with an elastic modulus of 0.5353 MPa and tensile strength of 0.6882 MPa. The underwater peel strengths were 936.7 N/m (SS) and 1569.3 N/m (PET). The results indicate that π–π interactions significantly enhance the cohesive strength of the copolymer, enabling P-AEP10 to maintain excellent adhesive performance in water at 80 °C, with the static shear failure time extended to 880 h at room temperature. Additionally, the results obtained from underwater repair experiments demonstrated that the PSA did not exhibit secondary leakage for a period of 100 days following the repair procedure, thereby further substantiating its suitability for underwater repair and bonding applications. In conclusion, this study offers significant theoretical support and a practical foundation for the development and utilization of dry PSAs.

研究领域: 材料科学 · 化学工程
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Materials · 2025 ·Vol. 18 ·期 7 ·1505 · IF 3.2

Enhanced Electro-Optical Properties and Peel Strength of Epoxy-Based Polymer-Stabilized Liquid Crystal Films Enabled by Rapid Cationic Polymerization and Polymer-Network Morphology Regulation

Zhexu Song,Guangyang Shang,Yingjie Shi,Meiqi Yang,Tianfu Zhou,Meina Yu,Yanzi Gao,Cheng Zou

Polymer-stabilized liquid crystal (PSLC) dimming film has attracted widespread attention due to its normally transparent state, energy-saving capability, and excellent electro-optical performance, which has promising applications in smart cars and building windows. However, achieving good electro-optical performance and high peel strength simultaneously still remains challenging. In this study, a PSLC film based on monoepoxy and diepoxy monomers was prepared through rapid cationic polymerization, showing low driving voltages and high peel strength simultaneously. The influence of the content and composition of two epoxy monomers on the microstructures, mechanical properties, and electro-optical performance of the PSLC films were systematically studied. The polymer morphology of PSLC could be effectively modulated by doping monoepoxy monomers. The PSLC film with total monomer content of ≤15 wt% showed enhanced electro-optical properties and peel strength when doping monoepoxy monomers due to the lateral polymer in the networks and denser polymer on the substrate. When the ratio of E6M to E6PM was 12:3, compared with pure E6M, the threshold voltage decreased from 18.2 V to 12.6 V, and the peel strength increased from 62.53 kPa to 136.37 kPa. These PSLC films can adapt to the requirements of different application scenarios by changing the content and proportion of two epoxy monomers, and the strategy has good prospects in the actual production and application of PSLC films.

CAS / MDL: 7473-98-5
研究领域: 材料科学 · 光学工程
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INDUSTRIAL CROPS AND PRODUCTS · 2025 · IF 6.2

Modular assembly of TA-Fe3+ functionalized PVAc/PS emulsion particles with SiO2 particles: Enhancing the bond strength of waterborne wood adhesives

Liping Rong,Xiaohui Fan,Gang Wang,Huanhuan Li,Dayong Zhang,Danni Luo,Sheng Li,Zhiguo Li

Improving the bond strength of wood emulsion adhesives is an ongoing challenge for the wood-processing industry. In this study, PVAc/PS core-shell emulsion particles are functionalized by forming coordination complexes between natural biomaterial tannic acid (TA) and Fe 3+ . The functionalized emulsion particles are assembled on the surface of the core template SiO 2 to form a “superstructure” through hydrogen bonding between the phenolic hydroxyl groups in the TA and the hydroxyl groups on the surface of SiO 2 , which can enhance the cohesive strength of the emulsion adhesive layer, thereby increasing the peel strength of wood adhesives. The results indicated that the functionalized emulsion particles were most effectively assembled on core template SiO 2 particles when the ratio of TA to Fe 3+ was 1:1 and the encapsulation rate of the assembled SiO 2 particles was 150 %. The glass transition temperatures (Tg1 and Tg2), storage modulus, tensile strength, and hardness of the assembled PVAc/PS emulsion film were measured by DSC, DMA, tensile testing machine, and durometer. These properties increased by 11.6 %, 5.3 %, 14.9 %, 127.6 %, and 46.3 %, respectively, compared to those of the PVAc/PS emulsion film. Further, the shear strength of the assembled PVAc/PS emulsion for bonding wood blocks and the peel strength for bonding thin veneers increased by 33.8 and 35.7 %, respectively, compared to those of the PVAc/PS emulsion. This study confirmed that using a modular assembly to improve PVAc/PS emulsion bonding properties can help formulate high-performance waterborne emulsion adhesives with promising applications in the field of thin-wood veneer bonding. This strategy provides an effective method to design and build environmentally friendly, low-cost, and high-performance water-based emulsion adhesives.

研究领域: 材料科学 · 林业工程
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POLYMER · 2022 · IF 4.432

Construction of a strong, fast self-healing adhesive for propellants based on the synergy of weak hydrogen bond array reorganization and disulfide exchange reactions

Tu Jing,Xu Heng,Tian Jingqing,Li Haozhe,Liang Li,Li Pingyun,Guo Xiaode

Internal damage of propellant, especially interfacial debonding, can easily cause major accident and consume a lot of costs. Although some literatures describe the application of self-healing adhesives in the field of propellant, the mechanical properties are usually poor, and the application of self-healing adhesives on debonded interfaces has never been studied. In this work, a high-strength polyurethane adhesive with tensile strength greater than 10 MPa and rapid self-healing ability (recovery at room temperature for 24 h) was constructed based on multiple weak hydrogen bond arrays and highly active disulfide bonds. Importantly, we ground breakingly tested the self-healing effect for interfacial debonding. Benefiting from the high-strength adhesion of a large number of hydrogen bond arrays, the peel strength of the adhesive at the propellant interface is 140% higher than that of traditional adhesives. At the same time, it can effectively heal the debonded interface, and the peel strength is still higher than that of traditional adhesives even undergo secondary healing. Our work has implications for solving the industry's thorny - propellant interface debonding.

研究领域: 材料科学 · 航空航天工程
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