Materials
·
2023
·Vol. 16
·期 16
·5511
·
IF 3.4
Anyu Yue,Yong Cao,Yi Zhang,Shenggang Zhou
The Mg-Li alloy stands as the lightest metallic structural material known to date, finding a wide range of applications. However, its development has been hindered by its susceptibility to oxidation and corrosion. In this study, we aimed to address this issue by employing electroless deposition to form a protective zinc layer on the surface of a magnesium–lithium alloy. The optimization of the zinc layer was achieved through varying parameters such as the zinc dipping time (1~10 min), temperature (20~70 °C), and zinc content (20~200 g/L). Surface characterization was performed using scanning electron microscopy (SEM) and X-ray diffraction, while electrochemical tests and scratch tests were conducted to evaluate corrosion resistance and coating adhesion. The results demonstrated the successful formation of a uniform and dense pure zinc layer on the surface of the Mg-Li alloy when the zinc-dipping time was set at 5 min, the temperature was at 30 °C, and the zinc content was at 50 g/L. Under these conditions, the corrosion potential of the Mg-Li alloy experienced the greatest positive shift, reaching as high as −1.38 V. Additionally, the corrosion current was minimized, measuring at 2.78 × 10−6A/cm2. Furthermore, the maximum arc tolerance radius was observed. Consequently, the electroless deposition of zinc onto Mg-Li alloys significantly improves their corrosion resistance and bonding, opening up new prospects for the application of zinc-plated Mg-Li alloys.Keywords:Mg-Li alloy;electroless-deposited;zinc coating;corrosion resistance
研究领域:
材料科学
·
腐蚀工程
·
表面工程
✓ 已验证
DOI
PubMed
高影响因子
Electronics
·
2022
·Vol. 11
·期 19
·3254
·
IF 2.69
Ran Zhang,Qinyi Wang,Ya Chen,Chen Jiao,Fuxi Liu,Junwei Xu,Qiuwei Zhang,Jiantao Zhao,Lida Shen,Changjiang Wang
With the growing emphasis on medical testing, people are seeking more technologies to detect indexes of the human body quickly and at a low cost. The electrochemical biosensors became a research hotspot due to their excellent properties. In this study, dicopper hydroxide phosphate (Cu2(OH)PO4) was incorporated in resin, and the resin sheets were prepared by digital light processing (DLP). The copper base points were activated on the resin sheet surface by Nd: YAG laser and then covered by the electroless copper plating and the electroless silver plating. The laser could effectively activate copper base points on the resin surface. Furthermore, silver electrodes on the detection chips could distinguish glucose solutions of different concentrations well. Finally, a novel detection kit with a three-electrode chip was designed for rapid health testing at home or in medical institutions in the future.Keywords:biosensor;DLP;laser activation;electroless plating;glucose testing
研究领域:
医学检测
·
材料科学
✓ 已验证
DOI
高影响因子
CERAMICS INTERNATIONAL
·
2017
·
IF 2.986
Juan Xie,Chen Yang,Ming Duan,Junlei Tang,Yingying Wang,Hu Wang,Jérémie Courtois
As a new photocatalyst , the photocatalytic hydrogen production performance of strontium titanate (SrTiO 3 , STO) modified by amorphous NiP was studied. The main purpose was to study the effect of amorphous NiP on hydrogen generation of STO under ultraviolet (UV) light irradiation. In this paper, STO catalysts were synthesized by hydrothermal method and the amorphous NiP was modified on the surface of STO by chemical plating method. The photocatalysts were characterized by X-ray diffraction (XRD), ultraviolet visible diffuse reflectance spectroscopy (DRS), transmission electron microscope (TEM) and X-ray photoelectron spectroscopy (XPS). The results show that hydrogen generation rate of STO modified by amorphous NiP (NiP/STO) is much higher than that of STO. Furthermore, the deposition time of chemical plating affects the hydrogen generation performance a lot. The results demonstrate that when the deposition time is 10 s, the hydrogen generation rate reaches almost 3 times higher than the other deposition time. The DRS results indicate that NiP/STO has narrower band gap than STO. Combination of the results of DRS, Mott-schottky (M-S) and XPS, the mechanism of photocatalytic hydrogen generation was obtained. The cause of higher hydrogen generation rate may be ascribed to the different electronic migration path in NiP/STO.
研究领域:
材料科学
·
能源科学
✓ 已验证
产品关联
DOI
高影响因子
OPTICS EXPRESS
·
2022
·Vol. 30
·期 11
·19544-19556
·
IF 3.833
Yajun Huang,Yajun Huang,Xiaozhu Xie,Xiaozhu Xie,Xiaozhu Xie,Jiaqi Cui,Wenqian Zhou,Wenqian Zhou,Jianqiang Chen,Jianqiang Chen,Jiangyou Long,Jiangyou Long
Quartz glass has a wide range of application and commercial value due to its high light transmittance and stable chemical and physical properties. However, due to the difference in the characteristics of the material itself, the adhesion between the metal micropattern and the glass material is limited. This is one of the main things that affect the application of glass surface metallization in the industry. In this paper, micropatterns on the surface of quartz glass are fabricated by a femtosecond laser-induced backside dry etching (fs-LIBDE) method to generate the layered composite structure and the simultaneous seed layer in a single-step. This is achieved by using fs-LIBDE technology with metal base materials (Stainless steel, Al, Cu, Zr-based amorphous alloys, and W) with different ablation thresholds, where atomically dispersed high threshold non-precious metals ions are gathered across the microgrooves. On account of the strong anchor effect caused by the layered composite structures and the solid catalytic effect that is down to the seed layer, copper micropatterns with high bonding strength and high quality, can be directly prepared in these areas through a chemical plating process. After 20-min of sonication in water, no peeling is observed under repeated 3M scotch tape tests and the surface was polished with sandpapers. The prepared copper micropatterns are 18 µm wide and have a resistivity of 1.96 µΩ·cm (1.67 µΩ·cm for pure copper). These copper micropatterns with low resistivity has been proven to be used for the glass heating device and the transparent atomizing device, which could be potential options for various microsystems.
研究领域:
材料科学
·
光学工程
✓ 已验证
产品关联
DOI
PubMed
高影响因子
Water
·
2021
·Vol. 13
·期 11
·1543
·
IF 3.103
Cancan Xu,Rui Liu,Wei Zheng,Lichu Lin,Lvjun Chen
Pd/Fe bimetallic particles were synthesized by chemical deposition and used to remove absorbable organic halogens (AOX) in the activated sludge of a chemical dyestuff wastewater treatment plant. Bath experiments demonstrated that the Pd/Fe bimetallic particles could effectively remove AOX. It indicated several factors, such as Pd loading, the amount of Pd/Fe used, initial activated sludge pH, and reaction time, which could affect the removal effect. The results showed that increasing the Pd content in Pd/Fe particles, from 0.01 to 0.05 wt %, significantly increased the removal efficiency of AOX in activated sludge. The Pd/Fe particles had a much higher removal efficiency of AOX in the activated sludge than bare Fe particles. A slightly acidic condition with a Pd content of 0.05% and 10 g/L of Pd/Fe was beneficial to the process of removing AOX in activated sludge. In detail, the removal efficiency of AOX in the activated sludge could reach 50.7% after 15 days of reaction with 10 g/L of Pd/Fe (Pd loading 0.05 wt %) and at an initial pH of 6.0 during the experiments. It also showed that the control samples without Fe0and Fe/Pd additions only removed 7.9% of AOX under the same conditions. Meanwhile, the concentrations of AOX in the supernatant of activated sludge were lower than the initial AOX concentration in the supernatant during the activated sludge remediation with Pd/Fe bimetallic particles. The results indicated that the AOX removal from the activated sludge matrix might be mainly due to the Pd/Fe bimetallic particles, and not just by phase transfer.
研究领域:
环境科学
·
废水处理
·
材料科学
✓ 已验证
DOI
高影响因子
POLYMERS FOR ADVANCED TECHNOLOGIES
·
2024
·Vol. 35
·期 9
·e6563
·
IF 3.1
Maojiang Zhang,Kexin Cui,Xinwei Zhang,Jinghua Wang,Minglei Wang,Yanfu Wu,Chunlei Dong,Jie Gan,Jiangtao Hu,Guozhong Wu
The construction of flexible circuits is a crucial and challenging aspect in the design and fabrication of fabric-based flexible electronics, which hold significant potential for various applications. In this study, we successfully developed high-precision and durable fabric-based flexible circuits by ingeniously combining ultraviolet light (UV)-curing technology with chemical plating. Specifically, a UV coating containing Ag/Fe 3 O 4 catalysts was applied onto polyester fabric surface, followed by printing the designed circuit structure diagram onto the fabric using UV light-directed curing of the coating, and fabric-based flexible circuits were then fabricated through chemical plating process. The fabric-based flexible circuits exhibit only minimal increases in resistance following durability testing, including bending (8000 times), abrasion (2000 times), high and low temperature stability (−30 to 60°C), and high temperature/humidity stability (65°C, RH = 95%, 48 h), which remains consistently stable. This developed technology holds immense potential across various applications for smart wearable devices.
研究领域:
材料科学
·
电子工程
·
纺织科学
✓ 已验证
产品关联
DOI
高影响因子
RSC Advances
·
2016
·Vol. 6
·期 85
·81767-81773
·
IF 3.289
Jiaxun Hu,Shuqing Wu,Qin Cao,Wenda Zhang
A facile approach was developed to synthesize core–shell structured alumina/Cu microspheres by means of activation by silver nanoparticles in situ deposited on the polydopamine-coated alumina microsphere surface. This approach takes advantage of both the sufficient reductive capacity of polydopamine towards silver ions and the high activation of silver nanoparticles towards copper deposition. The chemical compositions of composite microspheres were characterized by energy dispersive X-ray spectroscopy (EDS) and Fourier transform infrared spectroscopy (FTIR). The surface morphologies and crystalline structures of the coated alumina were studied by field-emission scanning electron microscopy (FESEM) and X-ray diffraction (XRD), respectively. The adhesion strength between the copper layer and the substrate was evaluated by ultrasonic exposure and thermal shock test. The results showed that silver nanoparticles effectively catalyzed the copper deposition reaction on the polydopamine-coated surface, which led to a faster and more reliable plating process compared with the process without activation. The compact and continuous copper layer obtained showed strong adhesion on the substrate surface.
研究领域:
材料科学
·
纳米技术
·
表面工程
·
复合材料
·
功能材料
✓ 已验证
DOI
高影响因子
POLYMER
·
2024
·
IF 4.1
Tingting Liu,Baijun Liu,Mingyao Zhang
Anisotropic conductive adhesives (ACAs) provide an efficient and easy method of interconnecting small electronic devices compared to traditional solder joint connections. In this paper, PS@Ni/Au metal composite microspheres with excellent electrical conductivity in the size of 2.76 μm were prepared by chemical plating technique and in situ redox method. The effects of PS@Ni metal composite microspheres with different shell thicknesses and compactness on the preparation of Ni–Au bimetallic shell layers were investigated, and the effects of different Au:PS@Ni mass ratios on the volumetric conductivity of PS@Ni/Au metal composite microspheres were discussed. The composite microspheres were characterized by scanning electron microscopy (SEM), thermogravimetric analysis (TGA), energy spectrometry (EDS), and X-ray diffraction (XRD). Thick and compact Ni metal shells are the key to preparing PS@Ni/Au metal composite microspheres with the complete degree of encapsulation. When the mass ratio of Au:PS@Ni was 0.15:1, the conductivity was as high as 1.3 × 10 5 S cm −1 . The acrylate pressure-sensitive containing 3.1–8.3 vol% conductive particles presented an obvious anisotropy. When the mass ratio of the conductive particles was higher than 8.3 vol%, the conductive particles appear to be significantly aggregated. The research ideas and methods have great application potential for replacing the traditional solder joint connections.
研究领域:
材料科学
·
电子工程
✓ 已验证
DOI
高影响因子
APPLIED ORGANOMETALLIC CHEMISTRY
·
2025
·Vol. 39
·期 8
·e70290
·
IF 0
Miao Zhang,Yutong Zheng,Tongyu Zhou,Xiyu Song,Jianhan Hong,Yu Wang
High-efficiency electromagnetic interference (EMI) shielding fabrics with strong absorption and low reflection characteristics are urgently demanded to address the increasing electromagnetic radiation pollution, but it is still challenging to integrate these features onto single fabric. Herein, an all-in-one asymmetric conductive structure was constructed on 3D polyester fiber-based spacer fabric through a successive in situ polymerization of polyaniline and followed by localized electroless Ni–P plating process. Thanks to the synergistic effect of microwave absorbing layer of low-conductivity polyaniline coating and shielding reflection layer of highly conductive Ni-P plating, the incident electromagnetic waves undergo a process of “absorption–reflection–reabsorption” and are dissipated as much as possible when they propagate into the composite fabric. The resultant composite fabric shows a superior EMI SE over 60 dB within 18–40 GHz, whereas the EMI SE from reflection is only 1.6 dB, and the average reflectivity is as low as 0.31, which indicates that 69% of electromagnetic waves are absorbed in the fabric. Interestingly, the porous structure of substrate and highly conductive Ni–P plating also endow this fabric with good thermal insulation and low infrared emissivity, resulting in an excellent infrared stealth performance. This study provides a facile and feasible approach for the development of high-efficiency and multifunctional EMI shielding fabric with low-reflection characteristics that holds great promise for application in civil and military fields.
研究领域:
材料科学
·
纺织工程
·
电磁学
✓ 已验证
产品关联
DOI
ChemElectroChem
·
2018
·Vol. 5
·期 13
·1683-1690
·
IF 4.446
Yu-Xue Mo,You-Hong Jiang,Jin-Xia Lin,Yao Zhou,Jun-Tao Li,Qi-Hui Wu,Ling Huang,Hong-Gang Liao,Shi-Gang Sun
Graphical Looking for the silver lining : In-situ encapsulation of sulfur within a highly conductive metallic shell with desirable thickness and pore sizes is achieved for the first time using the chemical plating method, which provides a new avenue to suppress the polysulfide shuttling issue and improves the internal conductivity for the S cathode in lithium-sulfur batteries. The lithium-sulfur system is considered as one of the next-generation batteries owing to its low-cost and high theoretical energy density. However, the poor conductivity of sulfur, undesirable dissolution, and shuttling of lithium polysulfides are still main challenges for a practical application. Herein, a chemical plating method was developed to encapsulate sulfur microspheres within a porous Ag-based thin shell of ca. 67 nm in thickness (denoted as S@Ag microcomposites). The sulfur content in the S@Ag particles is 89 wt%. With such structural and compositional merits, the core-shell composites can effectively facilitate the electron transfer and alleviate the polysulfide dissolution. When utilized as cathode in Li−S batteries, the S@Ag microcomposites exhibit good electrochemical performance, featured by an initial charge capacity of 1231 mAh g −1 and a capacity of 922 mAh g −1 after 100 cycles at 0.2 C. The electrochemical performance of commercial S particles was also improved after treated by this chemical plating method. This study provides a simple and novel approach to fabricate S composite cathodes with high S content and promising electrochemical properties.
研究领域:
材料科学
·
能源技术
✓ 已验证
DOI
高影响因子
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
·
2024
·Vol. 35
·期 7
·1-11
·
IF 2.8
Li Xinwei,Zhao Wenxia,Cheng Yi,Liu Xin,Hui Kaihong,Zhao Wei,Song Yifan,Zhu Qian,Chen Huaijun,Cui Yubo
In the processing technology of printed circuit boards, the common electroless copper plating technology of ethylenediaminetetraacetic acid disodium (EDTA-2Na) has the problems of large surface stress, uneven crystal particles, and large surface roughness of the copper plating layer. To remedy the above shortcomings and meet the current requirements for copper interconnects in printed circuit boards (PCBs), the present study has investigated a chemical copper plating system that combines a high deposition rate with low stress. An electroless copper plating was then performed on a polyacrylonitrile-butadiene-styrene (ABS) plastic resin plate with 2,6-diaminopyridine (2,6-DAP), 2,2-bipyridine, sodium hydroxyethyl sulfonate (SHES) and NiSO 4 ·6H 2 O as supplementary additives. By using scanning electron microscopy (SEM), electrochemical, atomic force microscopy (AFM), and X-ray diffraction (XRD) analyses, it has been shown that the average surface roughness Ra became reduced from 202 nm to 76.1 nm when using additives in the chemical copper plating process. Also, the internal stresses of the deposited copper layer on the (220) and (311) planes of a crystalline copper layer decreased from − 70.48 and − 53.03 to − 27.31 and − 27.16 MPa, respectively. The composite additive improved the quality of the copper layer of the EDTA-2Na-based chemical copper plating system, increasing the practical range of industrial applications and facilitating the subsequent application of higher-precision processing.
研究领域:
化学镀
·
材料科学
·
表面工程
·
微电子制造
·
化学添加剂
✓ 已验证
DOI
高影响因子
JOURNAL OF ELECTRONIC MATERIALS
·
2024
·Vol. 53
·期 6
·3089-3099
·
IF 2.2
Zhao Wenxia,Hui Kaihong,Zhao Wei,Chen Huaijun,Cui Yubo,Li Xinwei,Liu Xin,Song Yifan,Hui Kaining,Yan Yani,Qiao Liang,Wang Zenglin
The effects of additives on the deposition rate, surface morphology, Ni and P elemental content of the electroless plating layer, and roughness of the electroless plating Ni-P layer were investigated. In an electroless plating Ni-P system, ethylenediaminetetraacetic acid disodium salt (EDTA-2Na) and sodium hypophosphite monohydrate were used as the complexing agent and reductant, respectively. The linear sweep voltammetry (LSV) polarization curve results showed that the compound addition of 1.0 mg L −1 L-tyrosine, 2.0 g L −1 saccharin, and 6.0 mg L −1 sodium dodecyl sulfate (SDS) could inhibit sodium hypophosphite oxidation and nickel ion reduction, which eventually reduced the Ni-P deposition rate. The Tafel polarization curves indicated that the compound additives obviously improved the corrosion resistance of the Ni-P electroless plating layer. Field emission scanning electron microscopy (SEM) images showed that the composite additives generated fine and uniform Ni-P electroless plating particles and enhanced the density, eliminated the surface cracks, and reduced the pinholes on the electroless plating layer surface. Atomic force microscopy (AFM) tests showed that the addition of complex additives improved the smoothness of the plated layer, the R a value was reduced from 135.0 nm to 53.2 nm, and the R q value was reduced from 164.0 nm to 93.0 nm. The final composition and implementation conditions of the EDTA-2Na-based Ni-P electroless plating system were determined. The deposition rate was 10.44 μm h −1 , the P content of the electroless plating layer was 2.2%, and the electroless plating player was silver-white and bright. Graphical Abstract
研究领域:
材料科学
·
电化学
·
表面工程
✓ 已验证
DOI
高影响因子
危险品化学品经营许可证（带存储）