Electrogenerated chemical polishing of copper
Stress free polishing method is preferred for a damage free surface of copper with ultra-flatness and ultra-smoothness. Such a surface offers a perfect substrate for integrated circuits and micro-electromechanical systems fabrication. A new polishing method, called electrogenerated chemical polishing (EGCP), is proposed based on the principle of the scanning electrochemical microscope (SECM) and the diffusion controlled chemical reaction. Roughness of a Cu surface is reduced from 100.5 nm to 3.6 nm by the proposed method. To demonstrate the planarization capability of this new method, a patterned Cu surface with an array of micro-columns is planarized with a peak-valley (PV) value from 4.7 μm to 0.059 μm.
研究领域:
材料科学
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表面工程
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微纳加工
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半导体制造
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电化学
✓ 已验证
DOI
高影响因子
危险品化学品经营许可证（带存储）