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INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES · 2025 · IF 3.5

Cardanol-induced surface rearrangement of fluorine in polyurethane acrylic coatings to achieve self-cleaning and anti-graffiti properties

Jiaxing Zhang,Zhao Zhang,Hui Chang,Yangyi Chen

In this paper, a UV-curable solvent-free biomass polyurethane acrylic material was prepared by a two-step method, including the synthesis of cardanol-based polymerizable monomer and cardanol-based resins. This resin could form excellent self-cleaning and anti-fingerprint coatings after suffering from UV curing. It was found that the cardanol alkyl chain broke the hydrogen-fluorine (H⋅⋅⋅F) bond between the F atom of perfluoroalkyl acrylate and H-N of polyurethane in the coating. And cardanol alkyl chain synergistically induced the directional arrangement of F atoms to the surface, which improved the hydrophobic properties of the coating. This coating has good resistance to common pollutants such as water, ethanol, milk, coffee, dust, and fingerprints, and is suitable for various substrates such as sheet iron, and PET sheet. Due to the high degree of crosslinking in the coating, it can effectively prevent the penetration of acidic and alkaline substances, maintaining good self-cleaning performance even after immersion in a solution of strong acids or alkalis (pH 1–13) for 72 h. The use of cardanol-induced coating fluorine atom surface rearrangement technology can significantly reduce the amount of fluorine and also provide new ideas for the design of self-cleaning and anti-graffiti materials.

研究领域: 材料科学 · 化学工程
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Nanoscale Advances · 2023 ·Vol. 6 ·期 5 ·1380-1391 · IF 4.7

Atomic surface of quartz glass induced by photocatalytic green chemical mechanical polishing using the developed SiO2@TiO2 core–shell slurry

Yuanhang Fan,Zhenyu Zhang,Jiaxin Yu,Xingqiao Deng,Chunjing Shi,Hongxiu Zhou,Fanning Meng,Junyuan Feng

High-performance devices of quartz glass demand an atomic surface, which induces a challenge for chemical mechanical polishing (CMP) with a high material removal rate (MRR). Moreover, traditional CMP usually employs toxic and corrosive slurries, leading to the pollution of the environment. To overcome these challenges, a novel green photocatalytic CMP is proposed. In the CMP, SiO2@TiO2 core–shell abrasives were developed, and the CMP slurry included the developed abrasives, sodium carbonate, hydrogen peroxide and sorbitol. After photocatalytic CMP, the surface roughness Sa of quartz glass is 0.185 nm, with a scanning area of 50 × 50 μm2, and the MRR is 8.64 μm h−1. To the best of our knowledge, the MRR is the highest on such a big area of atomic surface for quartz glass. X-ray photoelectron spectroscopy reveals that SiO2@TiO2 core–shell abrasives were used as photocatalysts motivated by simulated solar light, generating electrons and holes and producing hydroxyl radicals through hydrogen peroxide. As a result, OH− could combine with Si atoms on the surface of quartz glass, forming Si–OH–Si bonds. Then the formed bonds were removed based on the balance between chemical and mechanical functions. The proposed CMP, developed SiO2@TiO2 abrasives and slurry provide new insights to achieve an atomic surface of quartz glass with a high MRR.

研究领域: 材料科学 · 环境科学 · 表面工程
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Journal of Manufacturing Processes · 2024 · IF 6.1

Atomic surface induced by novel green chemical mechanical polishing for aspheric thin-walled crucibles with large diameters

Xiangxiang Cui,Zhenyu Zhang,Chunjing Shi,Qibo Peng,Xiaoyu Liu,Xiuqing Liu,Hongxiu Zhou,Junyuan Feng,Wei Wen

Aspheric thin-walled crucibles with large diameters are widely used for photovoltaics and semiconductor industries, while they have hard-brittle and aspheric characteristics. Nevertheless, these crucibles strictly require atomic surfaces and high material removal rate (MRR). This is a challenge for chemical mechanical polishing (CMP). To break this challenge, a novel green CMP was developed for fused silica, containing ceria, lanthana, hydrogen peroxide, diethylene triaminepentaacetic acid pentasodium, carboxymethyl cellulose sodium and guanidine carbonate. After CMP, surface roughness Ra of 0.115 is obtained at a scanning area of 5 × 5 μm 2 measured by atomic force microscopy, and MRR is 563 nm/min. In such an atomic surface, the MRR is the highest compared with those published previously. Transmission electron microscopy confirms that the thickness of damaged layer after CMP is only 2.63 nm. A novel approach of robot floating polishing is proposed for aspheric crucibles with a diameter of 810 mm and a height of 580 mm. Using the developed CMP, surface roughness Sa of 0.178 nm on inner surface of an aspheric thin-walled crucible is achieved under a measurement area of 50 × 50 μm 2 . X-ray photoelectron spectroscopy (XPS) and electron paramagnetic resonance reveal that the content of Ce 3+ increased from 28.54 to 43.76 %. Through Raman, XPS and Fourier transform infrared spectroscopy, CMP mechanisms are elucidated. Densified damaged layer on the surface of fused silica was induced by the transformation of surface structure from six-membered to four- or three-membered network. Ce-OH and Si-OH were formed between fused silica and ceria abrasives, forming Ce-O-Si by condensation reaction of dehydration. The developed green CMP and approach provide new pathway to polish and manufacture atomic surfaces for aspheric thin-walled crucibles with large diameters.

研究领域: 材料科学 · 表面工程
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Surfaces and Interfaces · 2024 · IF 5.7

Atomic surface on fused silica induced by novel green photochemical mechanical polishing

Chunjing Shi,Zhenyu Zhang,Leilei Chen,Qiyuan Li,Hongxiu Zhou,Shenghua He,Jie Liu,Qingxiong Wang,Shiqiang Yu

Photochemical mechanical polishing (PCMP) exhibits excellent photochemical properties for polishing diverse materials from alloys to resins and quartz. However, comprehensive research on large atomic surfaces, slurry reusing, and post-treatments is rare and challenging. Thus, we have designed Prussian blue and cerium oxide (PB-CeO 2 ) composites and subsequently developed reusable, neutral, and environmentally friendly PCMP slurries. Enhanced with photocatalysis, the developed slurries can own more active species, which not only boost CMP efficiency but also eliminate the need for pH regulators that might cause excessive etching. The slurry only consists of water, composite abrasives, sodium carboxymethylcellulose and hydrogen peroxide, without any other additives. Atomic surfaces of fused silica are achieved with surface roughness of 0.113 nm at measurement areas of 100 × 100 μm 2 , and the MRR is 34.920 μm/h, which was performed by developed recycled slurry of PCMP. These are unprecedented results for atomic surfaces at large areas for such a high MRR through reused PCMP. X-ray photoelectron, Fourier transform infrared and Raman spectra reveal that designed composite abrasives generate active species ( e − , h + and •OH), under simulated solar irradiation. The active species weaken Si O bonds, forming Si O Ce bridges and facilitating the extraction of additional silicon ions. Our proposed cleaner polishing method and recycled slurry effectively reduce the manufacturing cost and save energy, promoting environmental protection and ecological benefit.

研究领域: 材料科学 · 环境科学 · 表面工程
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