JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
·
2023
·Vol. 34
·期 16
·1-8
·
IF 2.8
Tang Jingwen,Tang Haifeng,Tian Zhihua,Wu Fushuo,Zhang Peigen,Sun ZhengMing
Ti 2 InB 2 , a typical member of MAB phases (a family of layered transition metal borides), has gained wide attention due to its excellent properties. However, in this work, Ti 2 InB 2 is found to share a similar A-site metal whisker growth phenomenon with MAX phases (a family of layered carbides/nitrides), which casts doubt on its reliability, and therefore would hinder its applications in advanced technologies. Specifically, the weaker bond between Ti and In atoms in Ti 2 InB 2 leads to the exfoliation of In atomic layers under mechanical damage. It is proposed that the In atoms released by the mechanochemically decomposed Ti 2 InB 2 have high chemical potentials and are inclined to crystallize, which is responsible for the In whisker growth. Furthermore, it is observed that the decomposition degree of Ti 2 InB 2 affects the whisker growth propensity and morphology. Understanding the In whisker growth mechanism is meaningful to ensure the reliability as Ti 2 InB 2 is finding technological applications.
研究领域:
材料科学
·
力学
✓ 已验证
DOI
高影响因子
ACS Applied Electronic Materials
·
2021
·
IF 3.314
Zhiqiang Lai,Tao Zhao,Pengli Zhu,Dan Liu,Xianwen Liang,Rong Sun
Recently, improving the reliability of silver nanowire (AgNW) has become an interesting topic for promoting working performance and service life of portable electronic devices. In this work, flexible, transparent, and highly conductive AgNW-based films are fabricated by electroplating Cu, Co, or Ni on polyethylene terephthalate. The AgNW network deposited by metal shell (Metal@AgNW) via electroplating exhibits improved conductivity with acceptable transmittance. The Metal@AgNW effectively enhances the chemical reliability of AgNW concerning the electrochemical migration and the UV degradation of Ag, maintaining a superior mechanical property. For the sulfurizing degradation of AgNW, only Ni@AgNW holds a relatively strong resistance. In addition, a high electromagnetic interference (EMI) shielding effectiveness (SE) up to 30 dB of Metal@AgNW with a good stability in the frequency range of 8.2–12.5 GHz is obtained, which is higher than that of pristine AgNW network. Theoretical calculations in combination with the corresponding experiments are employed to investigate the mechanism of electroplating Cu, Co, or Ni on AgNW. As a result, electroplated Ni on AgNW is the densest and most reliable coating in comparison to other metals due to the relatively strong interaction between electroplated Ni particles and the Ag surface. Therefore, electroplating Ni on AgNW is the preferred approach to obtain flexible, transparent, and high-conductivity films with superior reliability.
研究领域:
材料科学
·
电子工程
✓ 已验证
产品关联
DOI
高影响因子
Sustainable Cities and Society
·
2018
·
IF 3.073
Li Yang,Xiaoling Cao,Nan Zhang,Bo Xiang,Zhaoli Zhang,Bin Qian
The thermal reliability of phase change materials (PCMs) is an important factor for the successful application of latent heat thermal energy storage. In this work, 10,000 thermal cycles have been firstly carried out to investigate the thermal reliability of four typical fatty acids (lauric acid, myristic acid, palmitic acid and stearic acid) as PCMs. The thermal properties before and after cycles were tested by differential scanning calorimeter. It was found that with increasing number of thermal cycles, both the phase transition temperature and the latent heat tended to decrease. In the experiment, the maximum change in the melting temperature was −0.37 °C and change rate of latent heat was −7.57%. The freezing temperature decreased obviously with increasing number of thermal cycles, which led to a maximum increase of 4.15 °C in the degree of supercooling. In addition, the specific heat and thermal conductivity of the PCMs after 10,000 thermal cycles had no significant change. FT-IR showed that the chemical structure of fatty acids had not changed after thermal cycles. The experimental results showed that these fatty acids can function as admirable PCMs with high thermal reliability for long-term applications.
研究领域:
材料科学
·
热能工程
✓ 已验证
产品关联
DOI
高影响因子
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
·
2019
·Vol. 30
·期 6
·5526-5535
·
IF 2.195
Yang Fan,Hu Bo,Peng Ye,Hang Chunjin,Chen Hongtao,Lee Changwoo,Wei Jun,Li Mingyu
A silver (Ag) composite paste was fabricated based on Ag nanoparticles (NPs) and Ag microflakes (MFs). Robust interconnections were achieved after sintering in the temperature range of 150–225 °C. The shear strengths of the Ag MF + NP joints before and after thermal shock from − 50 to 150 °C for 1000 cycles were 155.7 ± 14.5 MPa and 78.4 ± 20.8 Mpa, respectively. The results show that the Ag composite paste not only has similar sintering properties to the Ag NP pastes but also exhibited superior mechanical reliability due to the addition of the Ag MFs. In addition, the sintered properties of different Ag pastes were discussed in terms of the coating organics, thermal behaviour and microstructure. The fracture modes after the shearing tests were analysed in detail. The Ag composite paste provides a potential solution for high-temperature applications.
研究领域:
材料科学
·
电子工程
✓ 已验证
DOI
高影响因子
ACS Applied Materials & Interfaces
·
2014
·
IF 5.9
Yu Chang,Chao Yang,Xin-Yao Zheng,Dong-Yu Wang,Zhen-Guo Yang
A novel patterning–adsorption–plating process to additively fabricate copper patterns is developed. Functional ink with ion-adsorption nanoparticles was inkjet printed on PET substrate to form the patterned adsorption film. Catalytic ion was adsorbed by amino groups in the adsorption film, and catalyzed the electroless plating of copper. The mercapto groups introduced to the film enhance the reliability of the patterns. Specific solvent used in the ink increase the surface roughness of the adsorption film, leading to a better adhesion of the patterns. The prepared copper patterns show excellent conductivity about the same with bulk copper and good adhesion on PET.
研究领域:
材料科学
·
电子工程
✓ 已验证
产品关联
DOI
PubMed
高影响因子
MICROELECTRONICS RELIABILITY
·
2023
·
IF 1.6
Weiwei Zhang,Zhijun Yao,Hao Liu,Jiahao Liu,Mingyu Li,Fuquan Li,Hongtao Chen
For electrically conductive adhesives (ECAs) interconnection, adequate electrical, mechanical and thermal performance are crucial for long-term service reliability. The work focused primarily on analyzing the effects of environmental aging on the reliability and failure mechanism of ECAs joints. In this paper, high temperature and humidity (85 °C, 85%RH, 1000 h), thermal shock (−40 °C to 125 °C, 1000 cycles) and thermal aging (125 °C, 1000 h) tests were performed to study the reliability of the ECAs. Additionally, the fracture modes were investigated by mechanical shear strength testing before and after the reliability tests. The interfacial microstructure of the ECAs was investigated and the fracture mechanism of ECAs was characterized. The study showed that the reliability of the ECAs was improved compared with conventional ECA1 and ECA2.
研究领域:
材料科学
·
电子工程
✓ 已验证
产品关联
DOI
高影响因子
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
·
2024
·Vol. 35
·期 10
·1-12
·
IF 2.8
Xue Tiange,Huang Zeya,Zhang Xiaotian,Meng Meng,Yu Shixiang,Chen Tian,Fu Renli
In this paper, the effects of the composition and sintering process of the conductive silver paste on the packaging and electrical interconnection performance of the silicon carbide high temperature pressure sensor are studied in detail. At the same time, a self-built high temperature reliability test platform is used to test the electrical interconnection reliability of the conductive silver paste under high temperature environments. The results show that flake silver powder can not only effectively promote the density of the conductive silver paste, but also improve the grain boundary migration behavior of the conductive silver paste, thereby improving the electromigration resistance of the sintered silver. The prepared conductive silver paste has good compatibility with high temperature pressure sensor materials such as SiC, AlN, and Pt, and the adhesion strength reach 23.12 MPa, 26.35 MPa, and 19.22 MPa, respectively. When the silver paste does not contain flake silver, the sheet resistance of the sintered silver paste is the lowest at 650 °C, which is only 2.58 mΩ/□, and there is still room for improvement. The high temperature stability test shows acceptable performance, but in the high current test with a current density of 125 A/mm 2 , the failure time is only 105 min. After adding 20 wt% of flake silver powder, the sheet resistance of the silver paste can be further reduced to 1.50 mΩ/□ by 41.9%, and the failure time can be extended to 158 min, with a 50.5% increase.
研究领域:
材料科学
·
电子工程
✓ 已验证
产品关联
DOI
高影响因子
Nature Communications
·
2025
·Vol. 16
·期 1
·1-9
·
IF 15.7
Kong Xi,Yang Letao,Meng Fanqi,Zhang Tao,Zhang Hejin,Lin Yuan-Hua,Huang Houbing,Zhang Shujun,Guo Jinming,Nan Ce-Wen
Ceramic capacitors with ultrahigh power density are crucial in modern electrical applications, especially under high-temperature conditions. However, the relatively low energy density limits their application scope and hinders device miniaturization and integration. In this work, we present a high-entropy BaTiO 3 -based relaxor ceramic with outstanding energy storage properties, achieving a substantial recoverable energy density of 10.9 J/cm 3 and a superior energy efficiency of 93% at applied electric field of 720 kV/cm. Of particular importance is that the studied high-entropy composition exhibits excellent energy storage performance across a wide temperature range of −50 to 260 °C, with variation below 9%, additionally, it demonstrates great cycling reliability at 450 kV/cm and 200 °C up to 10 6 cycles. Electrical and in-situ structural characterizations revealed that the high-entropy engineered local structures are highly stable under varying temperature and electric fields, leading to superior energy storage performance. This study provides a good paradigm of the efficacy of the high-entropy engineering for developing high-performance dielectric capacitors.
研究领域:
材料科学
·
电气工程
✓ 已验证
产品关联
DOI
PubMed
高影响因子
ENVIRONMENTAL SCIENCE & TECHNOLOGY
·
2022
·
IF 11.357
Lei Wang,Boqiang Li,Dionysios D. Dionysiou,Baiyang Chen,Jie Yang,Juan Li
Hydroxyl radical (•OH) is an active species widely reported in studies across many scientific fields, and hence, its reliable analysis is vitally important. Currently, alcohols are commonly used as scavengers for •OH determination. However, the impacts of alcohols on the reliability of •OH detection remain unknown. In this study, we found that adding different types and different amounts of alcohols in water samples treated with ultraviolet irradiation undesirably produced substantial amounts of hydrogen peroxide (H2O2), which is a known •OH precursor. This means that the conventional •OH determination method using alcohols is likely unreliable or even misleading. Through careful investigation, we revealed an overlooked reaction pathway during H2O2 and •OH transformations. Varying oxygen concentrations, pHs, alcohol dosages, and types altered H2O2 formation, which can affect •OH determination accuracy. Among alcohols, n-butanol is the best scavenger because it quenches •OH rapidly but re-forms little H2O2.
研究领域:
环境科学
·
化学
✓ 已验证
产品关联
DOI
PubMed
高影响因子
PHYSICA SCRIPTA
·
2025
·Vol. 100
·期 6
·065603
·
IF 2.6
Yashuai Zhang,Honghua Liao,Congkui Tian,Xu Yang,Jingwen Cui,Zhuo Liu
A double quartz dielectric barrier discharge with water falling film (WF-D-DBD) reactor is designed to reduce electrode galvanic corrosion for longer life. In order to investigate the influence of high-voltage electrode configuration on the synthesis rate and energy consumption of plasma gas–liquid nitrogen fixation, four different external high-voltage electrodes, namely, mesh electrode, sheet electrode, multi-electrode, and copper wire electrode, were studied and dependence of the electrical parameters (e.g., volt-ampere characteristic, dielectric equivalent capacitance, and power factor), the emission spectra on the electrode configuration was obtained. The results show a nitrogen fixation reactor with a mesh-electrode structure can achieve a faster synthesis rate and higher energy efficiency, while the one with the multi-electrode structure can reduce the discharge current and ensure safe operation and long-time running. The selectivity of nitrogen fixation to nitrate was 100% in all four reactors. It is concluded that the production of OH carboxyl groups from water decomposition plays an important role in the reaction, and the presence of hydrogen peroxide and ozone improves the selectivity. The reticulated reactor exhibited the most favorable performance, with synthesis rate of 160.9 μmol min−1 and energy consumption of 43.2 MJ mol−1. This result is expected to fulfil the need for green, distributed and sustainable nitrogen fixation.
研究领域:
化学工程
·
环境科学
✓ 已验证
产品关联
DOI
高影响因子
Materials
·
2024
·Vol. 17
·期 22
·5405
·
IF 3.1
Wenjie Li,Zhe Li,Fang-Yuan Zeng,Qi Zhang,Liwei Guo,Dan Li,Yong-Hui Ma,Zhi-Quan Liu
With the advancement of high-integration and high-density interconnection in chip manufacturing and packaging, Cu bumping technology in wafer- and panel- level packaging is developed to micrometer-sized structures and pitches to accommodate increased I/O numbers on high-end integrated circuits. Driven by this industrial demand, significant efforts have been dedicated to Cu electroplating techniques for improved pillar shape control and solder joint reliability, which substantially depend on additive formulations and electroplating parameters that regulate the growth morphology, crystal structure, and impurity incorporation in the process of electrodeposition. It is necessary to investigate the effect of an additive on Cu pillar electrodeposition, and to explore the Kirkendall voids formed during the reflowing process, which may result from the additive-induced impurity in the electrodeposited Cu pillars. In this work, a self-synthesized polyquaterntum (PQ) was made out with dual suppressor and leveler effects, and was combined with prototypical accelerator bis- (sodium sulfopropyl)-disulfide (SPS) for patterned Cu pillar electroplating. Then, Sn96.5/Ag3.0/Cu0.5 (SAC305) solder paste were screen printed on electroplated Cu pillars and undergo reflow soldering. Kirkendall voids formed at the joint interfaces were observed and quantified by SEM. Finally, XRD, and EBSD were employed to characterize the microstructure under varying conditions. The results indicate that PQ exhibits significant suppressive and levelled properties with the new structure of both leveler and suppressor. However, its effectiveness is dependent on liquid convection. PQ and SPS work synergistically, influencing the polarization effect in various convective environments. Consequently, uneven adsorption occurs on the surface of the Cu pillars, which results in more Kirkendall voids at the corners than at the center along the Cu pillar surface.
研究领域:
材料科学
·
电子工程
✓ 已验证
产品关联
DOI
PubMed
高影响因子
APPLIED OPTICS
·
2018
·Vol. 57
·期 21
·6213-6218
·
IF 1.791
Lin Wang,Yungang Zhang,Xue Zhou,Zhiguo Zhang
This paper investigated a potential instrument for carbon disulfide in situ measurement with high precision and strong anti-interference capability. A compact and automated carbon disulfide detection system was developed using a fiber opto-electronic sensing device. A custom software interface based on LabVIEW was developed. The multi-wavelength least-squares method based on differential optical absorption spectroscopy was employed for improved detection and the anti-interference capabilities of the system. The detection limit of the system (signal-to-noise ratio=3) was determined to be 1 ppb per meter. Using this scheme, the reliability of a liquid-seal was verified to have carbon disulfide leakage. Although the liquid level of the liquid-sealed carbon disulfide showed no significant change over 24 h, a residue concentration of over 30 ppm remained detectable on the surface.
研究领域:
环境科学
·
分析化学
✓ 已验证
产品关联
DOI
PubMed
高影响因子
危险品化学品经营许可证（带存储）