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CERAMICS INTERNATIONAL · 2025 · IF 5.6

Effect of filling strategy on surface topography and strength of 3D–printed dense zirconia ceramics

Tingting Xu,Wei Wang

A novel 3D printing process based on material extrusion has recently been developed for the preparation of high-quality zirconia-based ceramics with complex configurations. Nevertheless, the attainment of the optimal mechanical properties of 3D-printed zirconia ceramics for advanced engineering applications remains a significant challenge, largely due to the considerable variability in process conditions. In this study, zirconia ceramics with different filling strategies were prepared using direct ink writing technology. The impact of various filling parameters, including nozzle diameter and printing direction, on the sintering shrinkage evolution, surface topography and mechanical properties was examined. To ensure the accuracy of mechanical tests, all the zirconia ceramics were densely sintered to a relative density of above 98 %. The utilization of thinner needles and printing along short distances has been demonstrated to markedly reduce the surface roughness of the printed ceramics. Furthermore, the flexural strength of the ceramics printed along the long-distance direction was found to be the highest, while all the ceramics printed with a medium diameter of nozzle achieved the optimal flexural strength under the same printing paths. These results suggest that optimizing the printing accuracy and path is an effective method for obtaining dense ceramics with superior surface topography and mechanical performance through direct ink writing technology.

研究领域: 材料科学 · 机械工程
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Applied Materials Today · 2024 · IF 7.2

Synergistic enhancement of dielectric strength and thermal conductivity in meta-aramid-based composite films via honeycomb cavities filling strategy

Wenqi Zhang,Xuanyue Qi,Kaixuan Sun,Rui Yang,Sidi Fan,Fangcheng Lv,Xiang Yu

Owning superior dielectric and mechanical properties, poly (m-phenylene isophthalamide) (PMIA) fiber is an ideal insulation material for next-generation electric and electronic devices. However, its low thermal conductivity poses a risk of thermal breakdown. Moreover, PMIA films prepared using the unique protonation method exhibit a honeycomb-like structure with numerous air pockets, further reducing heat transfer efficiency. Herein, we propose a strategy of honeycomb cavities filling to synergistically improving the dielectric strength and thermal conductivity of PMIA-based composite films. To achieve a denser configuration, the nanodiamond (ND) fillers modified by polydopamine (PDA) are uniformly filled in the cavities within the PMIA skeleton, serving as thermally conductive reinforcements. In the 15 wt% composite film, the breakdown strength and thermal conductivity measure 334 kV/mm and 1.12 W/(m·K), respectively, which are 42.3 % and 833 % higher than that of the pure one. Furthermore, the underlying mechanisms are studied based on density functional theory and multi-physics simulations.

研究领域: 材料科学 · 电气工程
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