APPLIED SURFACE SCIENCE
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2024
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IF 6.3
Peng Sun,Xixun Shen,Pei Xu,Wei Huang,Qunjie Xu
At present, the electroless copper is widely used to achieve the hole conductivity in printed circuit boards (PCBs), but this process contains carcinogenic formaldehyde and uses the precious metals for activation. Here, the conductive polyaniline as a seed layer of PCB is attempted to achieve the hole metallization. The polyaniline is formed on the hole through an in-situ oxidation polymerization method. The formation process of polyaniline was analyzed by SEM, FTIR, and XPS and an uniform polyaniline film with spherical cluster is revealed. The deposition behavior of copper on the polyaniline layer is analyzed by the LSV and Tafel where the deposition potential of Cu is about −0.18 V. The filling tests showed that the copper super-filling can be achieved on the polyaniline layer and the filling time is about 150 min and 90 min for the blind hole with a depth to width ratio of 0.75 and of 0.67, respectively. Thermal shock experiments showed that the copper layer on the polyaniline has good adhesion. These results demonstrate that the polyaniline can serve as an effective seed layer instead of the electroless copper to achieve the hole metallization, which provides a new solution for exploring friendly hole metallization processes for PCB.
研究领域:
材料科学
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电子工程
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环境科学
✓ 已验证
产品关联
DOI
高影响因子
POLYMER
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2025
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IF 4.5
Xiao Zhang,Xixun Shen,Runlin Wang,Zihao Zhang,Wei Huang,Qunjie Xu,Zhenni Kang,Junfeng He
At present, the hole metallization of printed Circuit Boards (PCBs) is achieved through using traditional electroless copper as a conductive seed, accompanied by an electroplating copper filling process. This method has serious environmental issues due to the carcinogenic formaldehyde and recalcitrant chelating agents in the electroless plating solution. To address this issue, a green polymer polypyrrole conductive film is proposed to replace traditional electroless copper as a conductive seed layer for the metallization of PCB. The polypyrrole film is formed via in-situ polymerization of pyrrole monomers on blind-hole walls. The cross-sectional SEM and EDS analysis confirmed that the polypyrrole film was uniformly formed on the walls of blind holes. The polypyrrole conductive layer exhibits a low sheet resistance of 1.45 kΩ/sq. Electrochemical characterizations demonstrate rapid copper electrodeposition on this conductive polymer layer. The contact angle measurements also demonstrate that the polypyrrole conductive film enhances substrate wettability, facilitating electrolyte infiltration into the vias. The filling experiment shows that dense super filling of copper in blind holes can be achieved within about 70 min. Thermal shock experiments confirm excellent adhesion of the plated copper. These results demonstrate that the polypyrrole conductive film represents a highly promising material to replace traditional electroless copper as the conductive seed layer for the metallization of PCB.
研究领域:
材料科学
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电子封装
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表面工程
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高分子化学
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环境友好技术
✓ 已验证
产品关联
DOI
高影响因子
ACS Applied Materials & Interfaces
·
2022
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IF 10.383
Xinming Zhang,Ruijuan Lv,Lixia Chen,Ruimeng Sun,Yang Zhang,Rongtian Sheng,Ting Du,Yuhan Li,Yanfei Qi
Wound healing greatly affects patients’ health and produces medical burden. Therefore, we developed a multifunctional electrospun nanofiber dressing, which can inhibit methicillin-resistant Staphylococcus aureus (MRSA), drain excessive biofluid to promote wound healing, and simultaneously monitor wound pH level. The polyoxometalate (α-K6P2W18O62·14H2O, P2W18) and oxacillin (OXA) are encapsulated in hydrophobic polylactide (PLA) nanofiber to synergistically inhibit MRSA. The phenol red (PSP) is encapsulated in hydrophilic polyacrylonitrile (PAN) nanofiber to sensitively indicate wound pH in situ. The PSP/PAN nanofiber is directly electrospun on the patterning OXA/P2W18/PLA nanofiber layer to form a Janus dressing. By taking advantage of the wettability difference between the two layers, the excess biofluid can be drained away from the wound. In addition, the Janus dressing exhibits good biocompatibility and accelerates wound healing via its antimicrobial activity and skin repairing function. This multifunctional Janus electrospun nanofiber dressing would be beneficial for wound management and treatment.
研究领域:
生物材料学
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医学工程
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抗菌研究
✓ 已验证
产品关联
DOI
PubMed
高影响因子
ELECTROCHIMICA ACTA
·
2025
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IF 5.6
Youchi Chen,Shuzhou Xing,Jie Jiang,Ruopeng Li,Yaqiang Li,Xin Li,Mingjie Li,Maozhong An,Jinqiu Zhang,Jiang Qin,Peixia Yang
With the rapid development of 5G communication, artificial intelligence, and new energy vehicles, the metallization of through-holes (THs) in printed circuit boards (PCBs) has imposed stringent requirements on the uniformity and interconnection reliability of copper layers. In this study, a novel azo-based additive Chromotrope 2R (BSS2R) was developed, and combined with pulse electroplating to synergistically regulate the conformal filling of PCB THs and the microstructure of copper. Electrochemical tests showed that BSS2R could reduce cathodic polarization and accelerate Cu²⁺ reduction. Surface and crystallographic characterization confirmed that BSS2R could induce the formation of Cu(111) preferred orientation in the copper layer and increase grain size, and its concentration should be controlled within 20 mg/L to suppress the high-frequency skin effect. Density functional theory (DFT) calculations revealed that the sulfonic acid groups of BSS2R could form strong ionic coordination with Cu²⁺ and preferentially adsorb on Cu(111) crystal planes, driving the oriented growth of copper crystal planes. Pulse electroplating experiments verified the "adsorption pumping effect" of BSS2R, which could increase the throwing power (TP) of THs from 72.5% to 84.1%. This work provides theoretical support and practical technical solutions for the metallization of high-aspect-ratio THs in advanced PCB manufacturing.
研究领域:
材料科学
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电化学
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微电子制造
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表面工程
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凝聚态物理
✓ 已验证
产品关联
DOI
高影响因子
危险品化学品经营许可证（带存储）