Li Liu,Tao Chen,Liping Han,Zhuo Qian,Junpeng Li,Guoyou Gan
The Thermal Conductive Silver Adhesive (TCSA) efficiently transfers heat from electronic components to heat dissipation components, preventing overheating and extending device lifespan. Despite the effectiveness of commercial sintered nano TCSA, high production costs necessitate a more affordable, high-performance preparation method. This study presents a strategy for preparing ultra-high thermal conductivity (TC) TCSA using multidimensional thermal conductive fillers and low-temperature sintering of silver nanoparticles (AgNPs). MXene@AgNPs particles are synthesized via in-situ reduction of AgNPs on MXene surfaces. These particles, combined with silver microflakes (AgMFs) as primary fillers and epoxy (EP), undergo low-temperature heat treatment to form the AgMFs-MXene@AgNPs/EP composite. Characterization and computational models show that filler-filler interface thermal resistance (ITR f-f ) is critical for TC. Adding MXene alone is insufficient, but using MXene@AgNPs particles as secondary fillers allows AgNPs to interconnect fillers, effectively reducing the ITR f-f . The resulting composite achieves an ultra-high TC of 65.51 Wm −1 K −1 with 63 wt% total filler content (60 wt% AgMFs, 3 wt% MXene@AgNPs). This study advances the development of low-cost, high-performance TCSA for thermal management applications.
Chongjun Li,Xiaodong Li,Jiakai Cao,Lei Yang,Zhanggui Hu,Gang He
Silicon nitride (Si 3 N 4 ) is regarded as a promising filler for thermal conductive composites due to its excellent thermal and electrical properties. In this work, the effects of oxygen content and surface modification of combustion synthesized β-Si 3 N 4 filler on the thermal, electrical, and mechanical properties of polydimethylsiloxane (PDMS) composites were investigated. The results demonstrate that an increase in the oxygen content of β-Si 3 N 4 filler leads to a significant deterioration in the thermal conductivity of the PDMS/β-Si 3 N 4 composites, while the dielectric constant decreases accordingly. Surface modification by vinyltrimethoxysilane (VTMS) improves the interfacial bonding between β-Si 3 N 4 filler and PDMS matrix, which increases the filler loading. PDMS composite with a high thermal conductivity of 4.26 Wm −1 K −1 was acquired using the binary filler comprising 64 wt% Al 2 O 3 and 29 wt% β-Si 3 N 4 . This work provides valuable guidance for the application of combustion synthesized β-Si 3 N 4 filler in highly thermal conductive composites.
Yingfeng Wen,Yang Xue,Xiaojing Li,Huijie Pei,Xingping Zhou,Yuezhan Feng,Yunsheng Ye,Xiaolin Xie,Yiu-Wing Mai
Rapid developments of miniaturization and integration of modern electronic devices have been accompanied by increasing power density, which bring about urgent demands for polymer-based thermal interface materials (TIMs) with efficient thermal conductive properties. However, poor dispersibility of thermal conductive nano-fillers severely limits further improvement in the thermal conductivity of TIMs. Herein, poly(styrene- b -butadiene- b -styrene) (SBS)/graphite nanoplatelet (GNP) nanocomposites with well-dispersed GNPs were fabricated by in-situ shear exfoliation of graphite in SBS solution, followed by a co-precipitation process. The SBS macro-molecules were immobilized on the surfaces of exfoliated GNPs through π-π interaction, which not only prevented the exfoliated GNPs from restacking in the suspension, but also improved their dispersibility in SBS matrix. Thus, GNPs were uniformly dispersed in SBS/GNP nanocomposites and possessed strong interfacial adhesion with SBS, which formed efficient thermal conductive filler networks with reduced interfacial thermal resistance . Hence, at 14.7 vol% filler, SBS/GNP nanocomposites displayed an excellent thermal conductivity of 1.55 W m −1 K −1 , which is 204% higher than SBS/commercial GNP (c-GNP) composites (0.51 W m −1 K −1 ) prepared by simply adding c-GNPs in SBS matrix. Moreover, SBS/GNP nanocomposites displayed enhanced tensile moduli and higher glass transition temperatures . Therefore, this work has provided a facile and promising route to manufacture high-performance TIMs in large scale.