Materials
·
2019
·Vol. 12
·期 17
·2793
·
IF 2.972
Hongyu Dong,Xin Li,Yi Dong,Shaoqing Guo,Liangfu Zhao
In a conventional electrically conductive adhesive (ECA) preparation process, typical ECAs are made by adding an appropriate amount of electrically conductive fillers, such as silver, into a polymer matrix, such as epoxy resin, to form a uniformly dispersed mixture by mixing and stirring operations. However, during the preparation process, secondary pollution and mass loss are caused by the vigorous mixture process. At the same time, the stirring operation introduces many small and stable bubbles, which affect the electrical conductivity of the ECAs. In light of these problems with the conventional preparation of ECAs, we developed a novel ECA preparation method that employs a powder spraying process: silver flakes are sprayed into the epoxy resin with a certain mass fraction to form formulated pastes. The as-prepared ECAs exhibited excellent properties compared with those prepared by the conventional process. This proves that the powder spraying process is feasible and superior to the conventional process.Keywords:electrically conductive adhesives;silver flakes;electrical resistivity
研究领域:
材料科学
·
电子工程
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DOI
PubMed
高影响因子
INTERNATIONAL JOURNAL OF BIOLOGICAL MACROMOLECULES
·
2024
·
IF 7.7
Tong Luo,Xiaoliang Guo,Yuling Qiu,Daihui Zhang,Chuanwei Lu,Chunpeng Wang,Jifu Wang,Tongqi Yuan,Fuxiang Chu
Conductive pressure sensitive adhesives (PSA) used for wearable and smart electronic sensors have attracted a significant amount of attention recently. However, achieving multifunctional conductive PSA with the feature of temperature tolerance and sustainability via a convenient and environment-friendly approach still remains challenge. Herein, a novel cellulose-rosin based poly(esterimide) (PEI) was first prepared by esterification and imidization. Then, the cellulose-rosin based PEI was integrated with polymerizable deep eutectic solvents (PDES, 2-hydroxyethyl acrylate and triethanolamine as hydrogen bond donor, choline chloride as hydrogen bond receptor) and performed UV-induced polymerization for formation of the conductive PSA with dual network (DN). The DN structure and the existence of extensive hydrogen bonds endowed these cellulose-rosin based conductive PSA with excellent adhesion property (shear resistance more than 70 h, tack of 14.6 N and 180° peel strength of 148.1 N/m, are higher than that of some typical commercial PSA), exceptional UV-blocking, solvent-resistance (usable in low polar solvent) and temperature tolerance (perform well between −25 °C to 140 °C). Furthermore, these conductive PSA could be used as wearable sensor to monitor subtle movements and achieve real-time monitoring of interface adhesion states even under extreme environmental conditions. This work provides a green strategy for the next-generation of multifunctional PSA.
研究领域:
材料科学
·
可持续发展
·
传感器技术
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产品关联
DOI
PubMed
高影响因子
MICROELECTRONICS RELIABILITY
·
2022
·
IF 1.418
Hao Liu,Jiahao Liu,Shaoan Wang,Zezhu Jin,Shuyan Zhu,Rui Ma,Weiwei Zhang,Jianqiang Wang,Jin Li,Chengliang Song,Shuye Zhang,Hongtao Chen
The morphology and content of the silver fillers, resin matrix composition and curing process could significantly affect performance properties of electrically conductive adhesives (ECAs). In this study, the effects of silver nano-particles (NPs) and nano-wires (NWs) were studied on the properties of ECAs, which are under the same curing and aging conditions varied with three kinds of fillers: the mixture of silver micro flakes and NPs at a mass ratio of 17:3, the mixture of silver micro flakes and NWs at a mass ratio of 19:1, and the pure silver micro flakes as the reference sample. Results show that silver NPs might cause the deterioration of electrical conductivity and thermal conductivity in ECAs with the filler weight fraction of 70 wt%, because segregation of silver NPs might increase the average distance between silver micro flakes; but silver NPs could improve the performance properties of ECAs at a filler loading of 85 wt% especially after 200 °C aging. Silver NWs could reduce bulk resistivity of ECAs with the filler weight fraction of 70 wt% from 2.5 × 10 −3 Ω·cm to 1.8 × 10 −4 Ω·cm. In addition, thermal conductivity and shear strength of ECAs seemed irrelevant to the filler morphology but only correlated positively and negatively with filler loading ratio respectively.
研究领域:
材料科学
·
电子工程
✓ 已验证
DOI
高影响因子
MICROELECTRONICS RELIABILITY
·
2023
·
IF 1.6
Weiwei Zhang,Zhijun Yao,Hao Liu,Jiahao Liu,Mingyu Li,Fuquan Li,Hongtao Chen
For electrically conductive adhesives (ECAs) interconnection, adequate electrical, mechanical and thermal performance are crucial for long-term service reliability. The work focused primarily on analyzing the effects of environmental aging on the reliability and failure mechanism of ECAs joints. In this paper, high temperature and humidity (85 °C, 85%RH, 1000 h), thermal shock (−40 °C to 125 °C, 1000 cycles) and thermal aging (125 °C, 1000 h) tests were performed to study the reliability of the ECAs. Additionally, the fracture modes were investigated by mechanical shear strength testing before and after the reliability tests. The interfacial microstructure of the ECAs was investigated and the fracture mechanism of ECAs was characterized. The study showed that the reliability of the ECAs was improved compared with conventional ECA1 and ECA2.
研究领域:
材料科学
·
电子工程
✓ 已验证
产品关联
DOI
高影响因子
RSC Advances
·
2017
·Vol. 7
·期 84
·53219-53225
·
IF 3.108
Jiayue Wen,Yanhong Tian,Zhipeng Mei,Weizhen Wu,Yanqing Tian
Herein, we report an innovative application of doping conjugated-polypyrrole nanoparticles (PPy NPs) into electrically conductive adhesives (ECAs) to prepare low-electrical resistivity interconnecting materials. PPy NPs were synthesized via a facile one-step chemical oxidative polymerization method at room temperature with the average diameter as small as 86.8 nm. Particles' diameters and dispersity were manipulated under different polymerization conditions through the adjustment of weight percentages and molecular weights of polyvinylpyrrolidone (PVP) as the surfactants. Results showed that higher concentrations of PVP and the longer chains of PVPs resulted in smaller diameters of PPy NPs. We also found that a suitable portion of ethanol in the polymerization mixtures gives rise to a better dispersity than that observed in mixtures without ethanol. When a small amount of PPy NPs was added into traditional epoxy resin-based and silver-flakes-filled ECAs, the resistance measurements showed an enhancement in the electrical conductivity, or in other words, a reduction in resistivity significantly. For example, the electrical resistivity of 70 wt% silver-filled ECAs was reduced from 1.6 × 10−3 Ω cm to 9.4 × 10−5 Ω cm by using only 2.5 wt% PPy NPs as the dopants. Thus, our results confirmed new applications of PPy NPs in the field of ECAs for decreasing the resistance, reducing the dosage of silver in ECAs, and achieving flexible devices. Finally, flexible electrical patterns were printed on paper and polyimide substrates were used as conducting circuits to light LED devices.
研究领域:
材料科学
·
电子工程
✓ 已验证
DOI
高影响因子
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES
·
2022
·
IF 3.848
Weiwei Zhang,Jintao Wang,Hao Liu,Zheng Zhang,Jianqiang Wang,Luobin Zhang,Haozhong Wang,Fengyi Wang,Fangcheng Duan,Jiahao Liu,Mingyu Li,Chunjin Hang,Hongtao Chen
Coupling agents are widely used in order to improve the properties of electrically conductive adhesives (ECAs). The effects of different coupling agents on the characteristics of epoxy-based ECAs were investigated in terms of thermal, rheological, electrical and mechanical properties. Results showed that the ECAs had favourable flow, adhesion and good conductivity. In particular, the ECAs filled with Ag flakes treated with the silane coupling agent 3-aminpropyltriethoxysilane (KH-550) exhibited the lowest electrical resistivity (5.22 × 10 −4 Ω cm) and the highest shear strength (20.32 MPa) among the ECAs. Besides, it had the minimum viscosity 154 Pa s at 5 rpm/25 °C. It was also found that the adding of coupling agents had different effects on the aging electrical and shear strength of the ECAs. According to this study, the use of KH-550 had a significant electrical conductivity improvement and shear strength increase before and after aging. In addition, a strong adhesion/bonding between the conductive fillers and the resin matrix was revealed by scanning electron microscopy studies.
研究领域:
材料科学
·
化学工程
✓ 已验证
产品关联
DOI
高影响因子
MICROELECTRONICS RELIABILITY
·
2023
·
IF 1.6
Xiaomin Zhang
Printable electrically conductive adhesive with high electrical conductivity and good mechanical properties has a broad application prospect in electronic devices. In order to explore the preparation method of high-purity nanometal conductive filler for conductive adhesive , silver nanopowders were prepared by DC arc plasma method. The silver nanopowders present a spherical structure and the average particle size is 55 nm. In this paper, a high performance electrically conductive adhesive (ECA) was prepared. This ECA was fabricated by mixing silver nanopowders with epoxy resin and screen-printed to a required shape. It was found that the ECA can be solidified through a low temperature sintering method in the air at 150 °C for 10 min. The electrical and mechanical properties of above ECA were investigated and characterized. The ECA filled with 75 % silver nanopowders exhibits excellent performances, including high electrical conductivity (9.8 × 10 −3 Ω·cm) and high bonding strength (8.3 MPa). Based on the performance characteristics, the ECA applications in flexible printed electrodes and interconnecting materials are demonstrated.
研究领域:
材料科学
·
电子工程
✓ 已验证
产品关联
DOI
高影响因子
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES
·
2023
·
IF 3.4
Weiwei Zhang,Zheng Zhang,Hao Liu,Jianqiang Wang,Fangcheng Duan,Ziwen Lv,Wentong Chen,Xinjie Wang,Mingyu Li,Chuantong Chen,Hongtao Chen
Adequate mechanical and electrical properties and long-term reliability are critical in conductive adhesive interconnects. In order to improve the electrical and mechanical properties of isotropic conductive adhesives (ICAs), reduce contact resistance and enhance the aging resistance of ICAs, the effects of low melting point SnBi58 alloy on the properties of ICAs were studied. The low melting point SnBi58 alloy formed metallurgical bonds between conductive fillers , as well as between the ICAs and a Cu substrate and not only improved the electrical conductivity and mechanical properties of ICAs, but also reduced the contact resistance shift of ICAs effectively. It was found that when the mass ratio of SnBi58 alloy in conductive fillers was maintained at 20 wt%, the bulk resistivity of ICAs reached 4.8 × 10 −4 Ω cm, the shear strength of ICAs was 27.71 MPa, and the contact resistance shift of ICAs was 7% after aging. In addition, better bulk resistivities and higher shear strengths of ICAs were achieved after aging at 85 °C/85%RH.
研究领域:
材料科学
·
电子工程
✓ 已验证
产品关联
DOI
高影响因子
ELECTROCHIMICA ACTA
·
2023
·
IF 6.6
Chenrui Cao,Mingkun Yang,Chen Liang,Donglin Zhang,Xin Chen,Xiuchen Zhao,Chin C. Lee,Yongjun Huo
Electrochemical migration failure is the main reliability problem that silver conductive adhesives face in the field of power electronics. However, there is no prior existing study that describes the electrochemical migration process of silver conductive adhesive using the phase-field model. In this study, a phase-field model is proposed to study the electrochemical migration process of silver-based conductive adhesive. The model involves the analysis of electrochemical reactions, diffusion of metal ions, applied electrode potential and overpotential and the morphology of electrochemically migrating dendrites. Model-building is based on the water drop (WD) test of silver conductive adhesive. The simulation results of the phase-field model not only reproduce the morphology of the silver dendrite, but also realize the critical voltage phenomenon in the WD experiments. In addition, by comparing the results of WD experiments as well as the model simulations, we demonstrate that the phase-field model is able to predict the electrochemical migration failure time of silver conductive adhesives effectively. The proposed model may be a helpful tool for understanding and predicting the evolution of dendrites during the electrochemical migration of silver-based conductive adhesives.
研究领域:
材料科学
·
电子工程
✓ 已验证
DOI
高影响因子
Nanomaterials
·
2016
·Vol. 6
·期 6
·119
·
IF 2.69
Hongru Ma,Jinfeng Zeng,Steven Harrington,Lei Ma,Mingze Ma,Xuhong Guo,Yanqing Ma
Silver nanowires-silver nanoparticles-graphene nanosheets (AgNWs-AgNPs-GN) hybrid nanomaterials were fabricated through a hydrothermal method by using glucose as a green reducing agent. The charge carriers of AgNWs-AgNPs-GN passed through defect regions in the GNs rapidly with the aid of the AgNW and AgNP building blocks, leading to high electrical conductivity of electrically conductive adhesives (ECA) filled with AgNWs-AgNPs-GN. The morphologies of synthesized AgNWs-AgNPs-GN hybrid nanomaterials were characterized by field emission scanning electron microscope (FESEM), and high resolution transmission electron microscopy (HRTEM). X-ray diffraction (XRD) and laser confocal micro-Raman spectroscopy were used to investigate the structure of AgNWs-AgNPs-GN. The resistance of cured ECAs was investigated by the four-probe method. The results indicated AgNWs-AgNPs-GN hybrid nanomaterials exhibited excellent electrical properties for decreasing the resistivity of electrically conductive adhesives (ECA). The resistivity of ECA was 3.01 × 10−4Ω·cm when the content of the AgNWs-AgNPs-GN hybrid nanomaterial was 0.8 wt %.Keywords:hydrothermal;nanosilver;graphene;resistivity;electrically conductive adhesives
研究领域:
材料科学
·
纳米技术
✓ 已验证
DOI
PubMed
高影响因子
Nanomaterials
·
2019
·Vol. 9
·期 7
·960
·
IF 4.034
Jiayue Wen,Yanhong Tian,Chunjin Hang,Zhen Zheng,He Zhang,Zhipeng Mei,Xuanyi Hu,Yanqing Tian
Electrically conductive adhesives (ECAs) are one of the low temperature bonding materials. It can be used to replace toxic Sn-Pb solder. The key issue for the application of ECAs is how to improve their electrical properties. In the present study, we develop an effective method to promote the electrical properties of ECAs by addition of polyaniline (PANI) nanoparticles. PANIs were synthesized via a facile one-step chemical oxidative polymerization method. After adding 0.5 wt% PANI nanoparticles, the conductivity of ECAs increased dramatically by an order of magnitude. The bulk resistivity of 8.8 × 10−5Ω·cm is achieved for 65 wt% silver fillers with 0.5 wt% PANIs loaded ECAs. Besides, this improvement has no negative effect on the shear strength and the aging life of ECAs. Moreover, the use of PANIs not only lowers the percolation threshold of ECAs, but also reduces the cost and improves the bonding reliability. Finally, PANIs enhanced ECAs patterns were successfully printed by a stencil printing method, which proved their potential applications in replacing conventional solder pastes and printing functional circuits.Keywords:Electrically conductive adhesive;polyaniline;electrical property and reliability;low-temperature bonding;printable circuits
研究领域:
材料科学
·
电子学
·
纳米技术
✓ 已验证
产品关联
DOI
PubMed
高影响因子
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES
·
2021
·
IF 3.189
Weiwei Zhang,Jiahao Liu,Luobin Zhang,Jianqiang Wang,Zheng Zhang,Jintao Wang,Hao Liu,Hongtao Chen,Mingyu Li
In the application of electronic products, it is critical for conductive adhesives to ensure high electrical conductivity and good adhesion reliability. In this study, isotropic conductive adhesives (ICAs) with high conductivity and low percolation threshold can be achieved by making full use of the synergistic effect of micron spherical and flaky silver-coated copper (Cu@Ag) conductive fillers . The flaky Cu@Ag powder prepared by electroless plating was chosen as the main conductive filler, and the spherical core-shell structure Cu@Ag powder was used as an auxiliary conductive filler to be dispersed in the flaky Cu@Ag particles, providing more possibilities for building a large number of conductive bridges. In this study, the Cu@Ag powder was synthesized to eliminate the disadvantages of Cu oxidation and Ag electrochemical migration, while making the ICAs low cost and favourable conductivity. Furthermore, the curing parameters were optimized for the matrix resin in corresponding experiments. The results showed that a combination of spherical and flaky Cu@Ag powders in ICAs could not only significantly reduce the percolation threshold and the bulk resistivity but also increase the shear strength compared with the single component. In particular, the bulk resistivity of the optimum sample was 1.95 × 10 −3 Ω cm, and the shear strength was 22.69 MPa when the filler content was only 60 wt%. Hence, the ICAs filled with spherical and flaky Cu@Ag will pave the way for high-performance and low-cost ICAs in the electronics packaging industry.
研究领域:
材料科学
·
电气工程
·
化工
·
电子封装
✓ 已验证
产品关联
DOI
高影响因子
危险品化学品经营许可证（带存储）