Polymers
·
2024
·Vol. 16
·期 13
·1805
·
IF 4.7
Peng Zhang,Hehe Wang,Pengcheng Xia,Xiaolei Chen,Wei Zhao,Chengqian Wang,Xiao Meng,Bin Jia
Negative-tone photosensitive polyimides (PSPIs) with a low coefficient of thermal expansion (CTE) were prepared by dissolving polyimide precursor-poly(amide ester) (PAE) resins, photoinitiators, photocrosslinkers and other additives in organic solvents. Using triamine as a monomer and dianhydride and diamine as polycondensates, tri-branched structure PAE resins with different molecular weights named PAE-1~5 were prepared. A series of corresponding PSPI films named PSPI-1~5 were prepared from PAE-1~5 resins with the same formulation, respectively. The PSPI-1~5 films prepared from resins of this structure have excellent mechanical, thermal and electrical properties after being thermally cured at 350 °C/2 h in nitrogen. The PSPI-1~5 films’ coating solution also show good photolithographic performance and are able to obtain photolithographic patterns with a resolution of about 10 μm after homogenization, exposure and development. Among the PSPI-1~5 films, PSPI-2 has the most excellent lithographic properties with a weight average molecular weight (Mw) of 2.9 × 104g/mol, a CTE of 41 ppk/°C, a glass transition temperature (Tg) of 343 °C and a 5% weight loss temperature (Td5) of 520 °C, making it suitable for industrial scale-up. The mechanical properties of elongation at breakage of 42.4%, tensile moduli of 3.4 GPa and tensile strength of 153.7 MPa were also measured.
研究领域:
材料科学
·
聚合物化学
·
微电子封装
✓ 已验证
产品关联
DOI
PubMed
高影响因子
ACS Nano
·
2024
·
IF 15.8
PeiChi Liao,Haichang Guo,Hongyu Niu,Ruijie Li,Ge Yin,Lei Kang,Liuchen Ren,Ruicong Lv,Huifeng Tian,Shizhuo Liu,Zhixin Yao,Zhenjiang Li,Yihan Wang,Lina Yang Zhang,U Sasaki,Wenxi Li,Yijie Luo,Junjie Guo,Zhi Xu,Lifen Wang,Ruqiang Zou,Shulin Bai,Lei Liu
The rapid development of modern electronic devices increasingly requires thermal management materials with controllable electrical properties, ranging from conductive and dielectric to insulating, to meet the needs of diverse applications. However, highly thermally conductive materials usually have a high electrical conductivity. Intrinsically highly thermally conductive, but electrically insulating materials are still limited to a few kinds of materials. To overcome the electrical-thermal conductance trade-off, here, we report a facile Pechini-based method to prepare multiple core (metal)/shell (metal oxide) engineered fillers, such as aluminum-oxide-coated and beryllium-oxide-coated Ag microspheres. In contrast to the previous in situ growth method which mainly focused on small-sized spheres with specific coating materials, our method combined with ultrafast joule heating treatment is more versatile and robust for varied-sized, especially large-sized core–shell fillers. Through size compounding, the as-synthesized core–shell-filled epoxy composites exhibit high isotropic thermal conductivity (∼3.8 W m–1 K–1) while maintaining high electrical resistivity (∼1012 Ω cm) and good flowability, showing better heat dissipation properties than commercial thermally conductive packaging materials. The successful preparation of these core–shell fillers endows thermally conductive composites with controlled electrical properties for emerging electronic package applications, as demonstrated in circuit board and battery thermal management.
研究领域:
材料科学
·
电气工程
·
热能工程
·
复合材料
✓ 已验证
产品关联
DOI
PubMed
高影响因子
危险品化学品经营许可证（带存储）