SCIENCE AND ENGINEERING OF COMPOSITE MATERIALS
·
2021
·Vol. 28
·期 1
·510-515
·
IF 1.295
Shasha Li,Xi Liu,Jianjia Qin,Changqing Fang,Nailiang Liu
To meet the high-precision needs of conductive ink in the field of microelectronic circuit printing, nano silver-coated graphene oxide (GO) composites were prepared as the conductive functional unit of the composites. The results show that compatibility of the GO grafted with ethylene glycol diglycidyl ether is better in the organic matrix than in the inorganic solvents. The nano silver particles attached to the surface of the grafted GO are evenly distributed and uniform in size. Moreover, the conductivity of grafted GO coated with silver particle composites is effectively improved. The composite conductivity is higher than 10 8 S/m, which is close to the electrical conductivity of silver.
研究领域:
材料科学
·
化学工程
✓ 已验证
产品关联
DOI
高影响因子
MACROMOLECULAR RAPID COMMUNICATIONS
·
2023
·Vol. 45
·期 3
·2300510
·
IF 4.6
Kangkang Tao,Gaohui Sun,Shuai Zhang,Jun Wang,Rongrong Chen,Shihui Han
Polyimide (PI) film with hydrophilic greatly limits their application in the field of microelectronic device packaging. A novel hydrophobic PI film with sag structure and improved mechanical properties is prepared relying on the reaction between anhydride-terminated isocyanate-based polyimide (PIY) containing a seven-membered ring structure and the amino-terminated polyamide acid (PAA) via multi-hybrid strategy, this work named it as hybrid PI film and marked it as PI-PIY-X. PI-PIY-30 showed excellent hydrophobic properties, and the water contact angle could reach to 102°, which is 20% and 55% higher than simply PI film and PIY film, respectively. The water absorption is only 1.02%, with a decrease of 49% and 53% compared with PI and PIY. Due to that the degradation of seven-membered ring and generation of carbon dioxide led to the formation of sag structure, the size of sag structures is ≈16.84 and 534.55 nm for in-plane and out-plane direction, which are observed on surface of PI-PIY-30. Meanwhile, PI-PIY-30 possessed improved mechanical properties, and the tensile strength is 109.08 MPa, with 5% and more than 56% higher than that of pure PI and PIY film, showing greatly application prospects in the field of integrated circuit.
研究领域:
材料科学
·
微电子学
✓ 已验证
产品关联
DOI
PubMed
高影响因子
COMPOSITES SCIENCE AND TECHNOLOGY
·
2024
·
IF 8.3
Xiangyu Mei,Azim Abdullaev,Qingbiao Yang,Kun Peng,Shuaida Shi,Fujian Liu,Yinsong Si,Yaqin Fu
Polyimide (PI) has been extensively used in 5G microelectronics however the relatively high dielectric constant (∼3.5) and moisture adsorption have greatly limit its practical applications in high-frequency region. Here hydrophobic PI/SiO 2 composite films with low dielectric constant and excellent thermal stability were synthesized by dispersing methyl modified hollow silica nanospheres (MHS) into polyamic acid solution prior to imidization treatment. Comparing with unmodified hollow silica nanospheres (HS), the MHS obtained through methyl modification can disperse uniformly in the PI matrix. Thus, the relaxation and orientation polarization of the PI chains as well as their electron migration are suppressed, resulting in a significant decrease in dielectric constant. The PI/MHS-10% film exhibits a stable low dielectric constant (1.9–2.3) in the high-frequency range (8.2 GHz–12.4 GHz), meanwhile maintains a high breakdown voltage (192 kV/mm), mechanical properties (64 MPa) and an excellent thermal stability ( T d5% = 546.5 °C; T max = 589.0 °C). Moreover. PI/MHS demonstrates much lower linear expansion coefficient of 25.0 ppm/K that better matches the substrate. The surface contact angle of PI/MHS increases from 73° to 110° and the water absorption rate decreases from 3.1% to 1.6%, effectively avoiding the moisture adsorption. This work provides a simple method to prepare high-performance composite films for 5G practical applications.
研究领域:
材料科学
·
电子工程
✓ 已验证
产品关联
DOI
高影响因子
ACS Applied Polymer Materials
·
2025
·
IF 4.7
Haoting Zheng,Guoming Yuan,Yujie Wang,En-Hou Han,Lingzhi Zhang
A series of boron nitride/fluorinated-polysiloxane (m-BN/f-PSi) composite films was designed and developed for effective thermal management and moisture resistance of microelectronic devices. Fluorinated-polymethylhydrosiloxane (f-PMHS) was synthesized via a ring-opening copolymerization of 1,3,5-trimethyl-1,3,5-tris(3,3,3-trifluoropropyl)cyclotrisiloxane and 1,3,5,7-tetramethylcyclotetrasiloxane. The biobased curing agent allyl-functionalized magnolol (allyl-Magnolol) was synthesized via the Williamson reaction. The modified BN (m-BN) with methacryloxy functional groups was prepared by reacting with γ-methacryloxypropyltrimethoxysilane (KH-570), which was subsequently mixed with f-PMHS and allyl-Magnolol. Subsequently, the m-BN/f-PSi composite films were fabricated by using the above mixture through a curing process followed by hot pressing. With an optimized loading level of 30 wt % m-BN, the composite film exhibits in-plane and out-of-plane thermal conductivities of 2.35 and 0.70 W·m–1·K–1, respectively. Additionally, the water contact angle of the film is measured at 136°. Thermogravimetric analysis also shows that the composite film has an increased onset degradation temperature of 343 °C (Td,5%, defined as the temperature corresponding to 5% mass loss) and a char yield of 63.0%. m-BN/f-PSi composite films offer a favorable combination of high thermal conductivity, excellent hydrophobicity, and sufficient thermal stability, making them highly promising candidates for thermal management applications in microelectronic devices.
研究领域:
材料科学
·
化学工程
·
微电子学
·
高分子科学
·
热工学
✓ 已验证
产品关联
DOI
高影响因子
ACS Applied Polymer Materials
·
2022
·
IF 4.855
Zihua Yu,Shaohua Wu,Chuncheng Li,Yaonan Xiao,Jiajian Liu,Bo Zhang
The poor processability has long limited the broad application of polybenzoxazoles in microelectronics. Herein, a series of poly(benzoxazole imide) (PBOI) copolymers were designed and prepared through the polymerization of 5-amino-2-(4-aminobenzene) benzoxazole with 3,3′,4,4′-biphenyl tetracarboxylic dianhydride and 4,4′-(hexafluoro-isopropylidene)diphthalic anhydride. These PBOI copolymers show excellent film-forming properties by integrating preformed benzoxazole structures into the polyimide backbone. Moreover, the molecular and aggregate structures of PBOIs, such as chain rigidity and stacking behavior, can be facilely regulated by controlling the comonomer ratio, thereby significantly affecting their macroscopic properties. A breakthrough in film performance could be further achieved by compounding PBOIs with fluorinated graphene (FG) via in situ polymerization. This series of FG/PBOI composite films exhibit high mechanical strength (119.8–371.2 MPa), modulus (2.5–6.7 GPa), heat resistance (5% weight loss, 551.3–620.6 °C), and hydrophobicity (water absorption within 72 h, 0.8–2.5%) as well as a low dielectric constant (2.09–3.4), which can well meet the development needs of microelectronic packaging. This work is also believed to provide theoretical guidance for the structural design and performance research of high-performance dielectrics.
研究领域:
材料科学
·
高分子化学
·
微电子
·
复合材料
✓ 已验证
产品关联
DOI
高影响因子
Nature Communications
·
2024
·Vol. 15
·期 1
·1-15
·
IF 14.7
Tian Xiaoli,Li Fu,Tang Zhenyuan,Wang Song,Weng Kangkang,Liu Dan,Lu Shaoyong,Liu Wangyu,Fu Zhong,Li Wenjun,Qiu Hengwei,Tu Min,Zhang Hao,Li Jinghong
Metal-organic frameworks (MOFs) with diverse chemistry, structures, and properties have emerged as appealing materials for miniaturized solid-state devices. The incorporation of MOF films in these devices, such as the integrated microelectronics and nanophotonics, requires robust patterning methods. However, existing MOF patterning methods suffer from some combinations of limited material adaptability, compromised patterning resolution and scalability, and degraded properties. Here we report a universal, crosslinking-induced patterning approach for various MOFs, termed as CLIP-MOF. Via resist-free, direct photo- and electron-beam (e-beam) lithography, the ligand crosslinking chemistry leads to drastically reduced solubility of colloidal MOFs, permitting selective removal of unexposed MOF films with developer solvents. This enables scalable, micro-/nanoscale (≈70 nm resolution), and multimaterial patterning of MOFs on large-area, rigid or flexible substrates. Patterned MOF films preserve their crystallinity, porosity, and other properties tailored for targeted applications, such as diffractive gas sensors and electrochromic pixels. The combined features of CLIP-MOF create more possibilities in the system-level integration of MOFs in various electronic, photonic, and biomedical devices.
研究领域:
材料科学
·
纳米技术
·
微电子
·
光子学
✓ 已验证
产品关联
DOI
PubMed
高影响因子
RSC Advances
·
2016
·Vol. 6
·期 41
·34825-34832
·
IF 3.289
Zhenxun Huang,Jianqing Zhao
In this study, various amounts of an amino-derivative of pure silica zeolite nanocrystals (A-PSZN) were blended with fluorinated poly(amic acid) (FPAA) to form a FPAA/A-PSZN precursor solution, and the fluorinated polyimide (FPI)/A-PSZN hybrid films were prepared via spin-coating and following thermal imidization of the FPAA/A-PSZN solution. A series of FPI/A-PSZN hybrid films were investigated scientifically based on the dielectric constant (k), water absorption, dynamic mechanical and thermal and mechanical properties. It is found that the k value decreases from 3.11 for pristine FPI to 2.65 for the FPI/7 wt% A-PSZN hybrid, which is attributed to the air within the micropore of A-PSZN and the inhibited molecular polarization originating from the internal cross-linking structure of hybrids. Due to the effective phase interconnection and the inherent excellent property of A-PSZN, on the other hand, the incorporation of A-PSZN results in the improvement of the storage modulus, glass transition temperature, thermal stability, Young's modulus, tensile strength and the decrease of water absorption, and thermal expansion coefficients for materials. The results indicate that the incorporation of A-PSZN is a promising approach to reduce the k value and improve the comprehensive properties of FPI, and the FPI/A-PSZN hybrid materials are potentially useful in the microelectronic industry.
研究领域:
材料科学
·
化学工程
✓ 已验证
产品关联
DOI
高影响因子
CHEMICAL ENGINEERING JOURNAL
·
2022
·
IF 16.744
Xin-zheng Jin,Zhen-yu Yang,Chen-hui Huang,Jing-hui Yang,Yong Wang
Recently, the miniaturization of microelectronics has proposed a more urgent demand for the multi-functionalization of packaging materials. Here, a PEDOT:PSS/MXene/PEG composite, which is prepared by vertical directional freezing and vacuum infiltrating, integrates the function of heat management & EMI shielding into single packaging material. The melting & cooling enthalpy (237.6 & 236.1 J g −1 ) and the phase transition temperature of composite are enhanced synchronously for the first time. The zigzag modification of polyethylene glycol (PEG) crystal is induced by poly(3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS). The rest of crystal with (7/2) helix conformation packs preferentially along the (1 2 0) plane. The stability of the melting composite is enhanced. The PEG leakage is less than 0.66 %, and over 80 % dimension is maintained under the pressure of 1.88 kPa. The composite shows excellent photo-thermal (η = 94.9 %) and electro-thermal (t η = 7.86) conversion performances. The EMI shielding mechanism is reflection-dominated and the total EMI shielding effectiveness (SE T ) of composite is 29.8 dB at the framework content as low as 1.22 wt%, which is the relatively low filler content and the highest enthalpy efficiency among the reported composites with the equivalent SE T . The HF-band shielding capability of composite is verified by the Tesla kit. The assembled heterogeneous asynchrony photo-thermal-electric conversion system identifies its potential application on photo-thermal converters and heat buff. The HF-band & X-band (Sub-6G) EM waves shielding and heat management in microelectronics can be achieved simultaneously by applying this composite.
研究领域:
材料科学
·
电子工程
✓ 已验证
产品关联
DOI
高影响因子
MATERIALS & DESIGN
·
2022
·
IF 9.417
Shuang Liu,Limin Ma,Cheng Zhen,Yishu Wang,Dan Li,Fu Guo
Crystalline and amorphous cobalt-phosphorus (Co-P) coatings have their own advantages in interfacial diffusion resistance and mechanical ductility of solder joints, respectively, but it cannot be better at both. In this work, the hybrid crystalline-amorphous Co-P coating (Co-9.1 at.% P) was fabricated and applied on the Cu/Sn interface by controlling the crystallinity through compositional design. Combining the advantages of crystalline and amorphous Co-P, strategies for solder joints with high shear strength, ductile intermetallic compounds (IMCs) and slow interface consumption was proposed. The evolution, microstructure, phase, and mechanical properties of the Co-Sn, Co-Sn-P and P-rich layers in solid-state diffusion were systematically characterized and tested by means of SEM, EPMA, EBSD, TEM, nanoindentation, and shear test. It was found that the hybrid Co-P coating achieved a low consumption rate, 14.2 nm/h, attributing to the partially crystalline structure and the Co-Sn-P exfoliation behavior. In addition, solder joints containing large-thickness ductile Co-Sn IMCs, 3.2–3.6 GPa of hardness, was established. The shear strength after aging reached 75.4 MPa relying on the large thickness of Co-Sn IMCs. Severe mechanical loads would be able to be withstand by virtue of the plastic deformation of ductile IMCs. Hybrid crystalline-amorphous Co-P would be a promising interface material in microelectronic packaging.
研究领域:
材料科学
·
焊接技术
·
微电子学
✓ 已验证
产品关联
DOI
高影响因子
POLYMERS FOR ADVANCED TECHNOLOGIES
·
2019
·Vol. 30
·期 9
·2313-2320
·
IF 2.162
Hui Zhao,Si-Qi Zhao,Guo-Hua Hu,Qun-Chao Zhang,Yang Liu,Chong-Xing Huang,Wei Li,Tao Jiang,Shuang-Fei Wang
A facile method was developed to synthesize a new type of polyhedral oligomeric silsesquioxane (POSS). It contained a single amine group and seven aliphatic moieties on its corners. FT-IR, 1 H-NMR, 13 C-NMR, 13 C- 1 H COSY, and 1 H- 1 H COSY confirmed that cages with eight corners were the main part of the product. This new POSS was used to modify the structure of hexamethylene diisocyanate trimer and then copolymerized with hexamethylene diisocyanate and poly (tetramethylene glycol) to get a serious of waterborne polyurethane (WPU)/POSS hybrid materials with low dielectric constants for microelectronics applications. The results showed that POSS particles were uniformly dispersed in the WPU dispersions. The WPU/POSS films did not show any macrophase separation, even when the POSS content was as high as 16%. As the POSS content increased from 0% to 16%, the tensile strength was increased from 2.3 to 7.3 MPa, the dielectric constant was decreased from about 2.9 to 2.0, and the thermal stability of the WPU/POSS was also improved.
研究领域:
高分子科学
·
材料化学
·
纳米复合材料
·
电子封装材料
·
功能高分子
✓ 已验证
DOI
高影响因子
PROGRESS IN ORGANIC COATINGS
·
2023
·
IF 6.6
Yuhang Han,Yingyi Ma,Junming Zhang,Shun Yao,Kaizheng Xu
It is important to reduce dielectric constant while maintaining or improving water resistance and mechanical properties for the practical use of porous low-dielectric materials. Herein, a composite film in which GO and fluorinated PI (FPI) contained porous structure located on the surface of flat PI film was prepared by the simple breath figure method. The incorporation of GO/surfactant can break the design contradiction between low dielectric constant and high mechanical strength for porous structure, thereby realizing the synchronous promotion of dielectric and mechanical properties. Moreover, the water absorption of composite film was decreased significantly due to the synergy of fluorine atoms, porous structure and GO/surfactant, guarantee its high robustness to humid stress. The dielectric, water resistance and mechanical properties of the composite film could be regulated through varying the casting humidity and GO/surfactant content. A low dielectric constant of 2.3, water absorption of 0.6 % and high tensile strength of 122 MPa, with 31.11 % and 75.88 % of decrease and 26.99 % of increase compared to flat PI film was exhibited with the GO/surfactant loading of only 0.5 wt%. The dielectric constant of composite film is still below 2.5 after moisture treatment. These excellent properties facilitate the application of GO/PI composite film in microelectronics.
研究领域:
材料科学
·
电气工程
·
化学工程
✓ 已验证
DOI
高影响因子
COMPOSITES PART B-ENGINEERING
·
2022
·
IF 11.322
Zhuo Cai,Yifei Ma,Micun Yun,Mei Wang,Zhaomin Tong,Jonghwan Suhr,Liantuan Xiao,Suotang Jia,Xuyuan Chen
In wearable and microelectronic devices, there is a rising need for ultrathin electromagnetic interference (EMI) shielding films with multifunction, such as Joule heating and photothermal conversion. MXene has shown promising applications in EMI shielding due to its excellent electrical conductivity , abundant surface functional groups, and layered structures. However, the self-stacking, poor mechanical strength and hydrophilicity of MXene hinder its applications. In this study, MXene/holey graphene (MX/HG) composite film is fabricated in a layered structure. The hydrogen bonds between HG and MXene improve the mechanical properties and prevent the self-stacking of MXene sheets. EMI shielding performances are investigated according to the monolayer MXene sheets' size and HG's mass ratio. As a result, the large lamella-based MX/HG composite film shows outstanding EMI shielding effectiveness (EMI SE) of 56.15 dB, excellent low-voltage-driven Joule heating (up to 100 °C at 3 V within 4 s), and high-efficiency photothermal conversion (up to 49.8 °C under 1000 W m −2 within 30 s) at a thickness of 5 μm. The multifunctional film achieves impressive EMI shielding, Joule heating, and photothermal conversion performances at a low thickness, showing great prospects in wearable and microelectronic device applications.
研究领域:
材料科学
·
纳米技术
·
电气工程
·
复合材料
✓ 已验证
DOI
高影响因子
危险品化学品经营许可证（带存储）