APPLIED THERMAL ENGINEERING
·
2014
·
IF 2.624
Yuan-Xiang Fu,Zhuo-Xian He,Dong-Chuan Mo,Shu-Shen Lu
Heat dissipation is an important issue for electronic devices. In the present work, we prepared eight kinds of thermal adhesives by filling the epoxy resin with natural graphite, copper, aluminum , zinc oxide , boron nitride , aluminum oxide, diamond and silver powders, and measured the thermal conductivity of all samples. The results show the eight fillers can efficiently improve the thermal conductivity of the epoxy resin. Meanwhile, we found the layer-shape filler is more favorable than the ball-shape filler and the sharp-corner-shape filler to enhance the thermal conductivity of epoxy resin, and the low price layer-shape natural graphite-epoxy adhesive had the highest thermal conductivity up to 1.68 W m −1 K −1 at weight 44.3% of the eight thermal adhesives. All the fillers and the cross sections of thermal adhesives morphologies images were characterized by scanning electron microscopy, and the thermal conductivities of all the samples were measured by Hot Disk TPS-2500 thermal constants analyzer.
研究领域:
材料科学
·
热管理技术
✓ 已验证
产品关联
DOI
高影响因子
APPLIED THERMAL ENGINEERING
·
2019
·
IF 4.026
Desong Fan,Ming Jin,Jun Wang,Jinhui Liu,Qiang Li
Thermal dissipation has become a vital issue in electronic devices with highly miniaturization and integration. As a high thermal conduction material, graphite has been used widely in these devices. However, heat dissipation of graphite is limited by the poor thermal radiation in serving as a heat sink. In this work, we proposed a novel composite foil with a sandwich structure of graphite-silver-polyimide, exhibiting high thermal conductivity and excellent selective emission property, which is attractive for application in outdoor space. The heat dissipation performance of the foil was numerically and experimentally investigated. Our simulations confirmed that employing a selective thermal emitter in the sandwich structure prevented object surface from overheating under direct sunlight, augmenting the dissipated heat generated by heat source, reducing the local high temperature of surface. By the solar simulator and infrared camera, we experimentally demonstrated the numerical prediction that the heat dissipation ability of sandwich structure is much better than the graphite.
研究领域:
材料科学
·
电子工程
✓ 已验证
产品关联
DOI
高影响因子
CARBON
·
2023
·
IF 10.9
Bin Wang,Yaotian Yan,Jinghuang Lin,Yifei Cai,Jian Cao,Junlei Qi
Efficient multi-path heat dissipation is urged to be designed for balancing the heat density generated in highly integrated electronic devices. Herein, aluminum foam/carbon composites were fabricated by chemical bath and annealing method to realize the effect of strengthening the effective thermal conductivity while retaining the convective heat transfer characteristics of the porous structure . The results show that the continuous and high crystalline carbon coating can be obtained in the optimized composites prepared with 350 g dopamine addition at 600 °C annealing temperature. When compared with amorphous carbon , the phonons in crystalline carbon can carry more energy during the heat transport in terms of high phonons density of states, and their scattering behavior can be alleviated. A smaller temperature gradient is further established in the system. Hence, a desirable thermal conductivity, 21.44 W m −1 K −1 , is obtained in the optimized composites, which is almost 3 times that of pristine aluminum foam (7.67 W m −1 K −1 ). Additionally, the remarkable cooling efficiency of 24.71% in comparison to other studies, suggests that aluminum foam/carbon composites hold great potential as thermal management materials in addressing the issue of intense heat generation.
研究领域:
材料科学
·
热管理工程
✓ 已验证
产品关联
DOI
高影响因子
Materials Advances
·
2024
·
IF 5.2
Kaifen Yan,Weifeng Zhang,Xue Feng,Weiyun Zhao,Lingling Wu,Yuan Deng
Heat dissipation is critical for energy efficiency; high operating temperatures can even cause electronic device failure. Herein, a high heat dissipation strategy is proposed and applied to a passive composite heat sink (CHS) by combining a porous hydrogel with fin. The heat generated by the devices can be dissipated utilizing the evaporation latent heat of the water in the multi-scale porous hydrogel and the increased heat dissipation area of the composite finned structure. The heat transfer coefficient of the CHS can reach 60 W m−2 K−1, which is six times higher than that of natural convection and comparable to that of forced air convection. Moreover, rehydration can be achieved with zero energy consumption. The CHS is able to enhance the temperature difference of the thermoelectric generator (TEG) and improve the output performance by 4–10 times. In addition, it can lower the operating temperature of electronic devices and solar cells, which can be maintained at about 60 °C when the heat load is 10 W. As a result of excellent cooling performance and zero energy consumption properties, the CHS has potential applications in the fields of thermoelectric devices, electronic products, and solar photovoltaic power generation.
研究领域:
材料科学
·
热能工程
·
电子学
·
可再生能源
✓ 已验证
产品关联
DOI
高影响因子
MATERIALS CHEMISTRY AND PHYSICS
·
2025
·
IF 4.7
Hailong Liu,Furong Tao,Hairui Ji,Hailong Zhang,Libin Liu
Developing the coating with superior waterproofing and heat dissipation abilities can prevent electronics from contamination and heat damage. However, most of these coatings show poor transparency and antifouling ability. In this study, a multifunctional ultra-slippery transparent coating (STC) has been developed by simply spraying suspensions consisting of poly(perfluorodecyl acrylate-co-isobornyl acrylate) followed by the curing treatment at room temperature. The thickness of the coating is only 1.5 μm measured by scanning electron microscope. A high transparency of 90 % is observed by UV–vis–NIR. X-ray photoelectron spectroscopy and fourier transform infrared spectroscopy demonstrate successful formation of STC and explain low surface energy. The slippery surface makes the rapid sliding of water and oil droplets when tilted at only 8°. The surface of the coating can be cleaned by water and oil-based liquids due to its excellent slippery property. In addition, the heat dissipation of electronic devices was improved after coating STC. High transparency makes it easier to observe the working condition of precision equipment. Also, the STC protects the electronic components from short circuit destroying during for underwater operation. Therefore, the prepared STC shows great promise for various electronic devices due to its easy fabrication and versatile performance.
研究领域:
材料科学
·
表面工程
✓ 已验证
DOI
高影响因子
Advanced Fiber Materials
·
2024
·
IF 17.2
Yang Peng,Ju Yanshan,He Jiajun,Xia Zhengcai,Chen Liang,Tang Shaochun
Passive cooling holds tremendous potential in improving thermal comfort because of its zero energy consumption and cost-effectiveness. However, currently reported radiative cooling materials primarily focus on hydrophobic polymer films, inevitably leading to sweat accumulation and limited cooling efficiency in hot-humid environments. Herein, an advanced Janus membrane with excellent temperature–moisture management capabilities is developed, which combines radiative cooling and evaporative heat dissipation. Modification with Calcium sulfite (CaSO 3 ) nanoparticles not only enhances the optical properties (state-of-the-art solar reflectance of 96.6%, infrared emittance of 96.1%) but also improves the wettability of the polylactic acid fiber membrane. Especially 15% emittance improvement is achieved due to the strong infrared radiation ability of CaSO 3 . The membranes with opposite wettability realize the directional sweat transport (high one-way transport index of 945%). Excellent radiative cooling capability is demonstrated with sub-ambient cooling of 5.8 °C in the dry state. The Janus membranes covering sweaty skin exhibit a 46% shorter drying time and a 2 °C lower average evaporation temperature compared to cotton fabric, indicating highly efficient thermal and moisture management. This work provides an efficient route to achieving smart textiles that enable the human body to adapt to complex environmental conditions. Graphical Abstract
研究领域:
材料科学
·
纺织工程
·
生物医学工程
✓ 已验证
DOI
高影响因子
ACS Applied Materials & Interfaces
·
2021
·
IF 9.229
Zhi-Guo Wang,Jia-Cheng Lv,Zi-Li Zheng,Ji-Guang Du,Kun Dai,Jun Lei,Ling Xu,Jia-Zhuang Xu,Zhong-Ming Li
Innovations of transistors toward miniaturization and integration aggravate heat accumulation of central processing units (CPUs). Thermal interface materials (TIMs) are critical to remove the generated heat and to guarantee the device reliability. Herein, maltose-assisted mechanochemical exfoliation was proposed to prepare maltose-g-graphene as a structural motif of TIMs. Then, maltose-g-graphene/gelatin composite films with a bilayer structure were prepared by two-step vacuum filtration to construct effective thermally conductive pathways consisting of the directionally arranged and tightly packed maltose-g-graphene. The bilayer composite film exhibited a remarkable in-plane thermal conductivity (30.8 W m–1 K–1) and strong anisotropic ratio (∼8325%) at 40 wt % maltose-g-graphene addition. More intriguingly, the cooling effect on CPUs was significantly better for the bilayer composite films than commercial thermal pads as TIMs. The outstanding thermally conductive stability in resistance to instantaneous and prolonged thermal shocks as well as fatigue stability was gathered. Our work offers a valuable reference to design and fabricate high-performance TIMs for CPU cooling to surmount harsh application scenarios.
研究领域:
材料科学
·
电子工程
✓ 已验证
产品关联
DOI
PubMed
高影响因子
APPLIED THERMAL ENGINEERING
·
2022
·
IF 6.465
Yu Zhao,Zhengguo Zhang,Ziye Ling,Xuenong Gao,Xiaoming Fang
Thermal interface materials that possess high thermal conductivity and can reach low thermal impedance during service, are highly desirable for chip heat dissipation systems, especially when cooling high-power chips. Herein, a novel thermal pad was developed by combining low melting point alloy having metal-level thermal conductivity and liquid-like rheological property with expanded graphite possessing large pore volume and high thermal conductivity. Specifically, the alloy 62.5Ga21.5In16Sn was modified by the trace-oxidation method to obtain oxidized alloy, followed by adsorbing into expanded graphite and then molding and pressing to fabricate the thermal pad. It is found that the oxidation treatment resulted in the generation of refractory metal oxides Ga 2 O 3 and SnO 2 within the alloy, thereby preventing the leakage of the alloy from the composite thermal pad. Impressively, the optimal low melting point alloy/expanded graphite composite thermal pad, prepared at the oxidation duration of 24 min, expanded graphite mass fraction of 4 % and compact density of 3.125 g/cm 3 , reached a thermal conductivity of as high as 26.94 W/m·K and a thermal impedance of as low as 0.42 K·cm 2 /W, along with exhibiting a good shape-stability. More significantly, when employed into a simulative desktop CPU cooling system, this thermal pad exhibited 36.78 % higher cooling efficiency under the forced air convection, extended ten times in the time for the chip to reach the upper limit temperature (100 ℃) under the natural air cooling, and benefited to the chip to fight with the pulse-type instantaneous thermal shock, as compared to the commercial thermal pad. These excellent characteristics and good heat dissipation performance make the low melting point alloy/expanded graphite composite thermal pad show great potential for use in chip thermal management systems.
研究领域:
材料科学
·
热管理技术
✓ 已验证
产品关联
DOI
高影响因子
Science China-Technological Sciences
·
2023
·Vol. 66
·期 10
·2797-2807
·
IF 4.6
Jiang Miao,Xiao Chao,He XuSheng,Du HuiChao,Wang YanYan,Ding Xin,Zhang Xian,Li XiaoFei,Zheng Kang,Liu XiangLan,Chen Lin,Tian XingYou
In hot environments, the human body shows an efficient capability to maintain a stable temperature by benefiting from sweating behavior. Inspired by this skin perspiration strategy, in this study, we demonstrated an innovative polyimide foam (PIF)-based mimetic skin with excellent cooling capability by integrating a silver coating and reusable hydrogel for the first time. Because of the hybrid thermal dissipating system, the successive silver coating quickly transferred heat to the inside of the polyacrylamide hydrogel. Meanwhile, the hydrogel absorbed a large amount of heat due to its large enthalpy and effectively dissipated heat to the environment through the evaporation of moisture, similar to the sweating of skin. Thus, the temperature of the skin-like film was reduced by 25.4°C compared with pure PIF under a high-power laser heating source. Identical and remarkable cooling effects were also obtained in mobile phone and battery applications, far better than commercially available thermally conductive polyimide (PI). This outstanding performance paves a new way for the thermal management application of PI in wearable electronics, microprocessors, and flexible electronics.
研究领域:
材料科学
·
电子工程
✓ 已验证
产品关联
DOI
高影响因子
Chip
·
2022
·
IF 0
Sheng-Chang Ding,Jian-Feng Fan,Dong-Yi He,Lin-Feng Cai,Xiang-Liang Zeng,Lin-Lin Ren,Guo-Ping Du,Xiao-Liang Zeng,Rong Sun
The emerging applications of composite gels as thermal interface materials (TIMs) for chip heat dissipation in intelligent vehicle and wearable devices require high thermal conductivity and remarkable damping properties. However, thermal conductivity and damping properties are usually correlated and coupled each other. Here, inspired by Maxwell theory and adhesion mechanism of gecko's setae, we present a strategy to fabricate polydimethylsiloxane-based composite gels integrating high thermal conductivity and remarkable damping properties over a broad frequency and temperature range. The multiple relaxation modes of dangling chains and the dynamic interaction between the dangling chains and aluminum fillers can efficiently dissipate the vibration energy, endowing the composite gels with ultrahigh damping property (tan δ > 0.3) over a broad frequency (0.01 – 100 Hz) and temperature range (–50 – 150 °C), which exceeds typical state-of-the-art damping materials. The dangling chains also comfort to the interfaces between polymer matrix and aluminum via van der Waals interaction, resulting in high thermal conductivity (4.72 ± 0.04 W m –1 K –1 ). Using the polydimethylsiloxane-based composite gel as TIMs, we demonstrate effective heat dissipation in chip operating under vigorous vibrations. We believe that our strategy could be applied to a wide range of composite gels and lead to the development of high-performance composite gels as TIMs for chip heat dissipation.
研究领域:
材料科学
·
热管理
·
柔性电子器件
✓ 已验证
DOI
CERAMICS INTERNATIONAL
·
2025
·
IF 5.6
Lujia Han,Fengxia Yang,Qing Meng,Xiao Yang,Jiangtao Li
The heat flow density of electronic power devices is increasing, raising concerns about their safe operation, which necessitates high-performance radiative cooling coatings to improve thermal management. This paper presents the preparation of ZrO 2 /graphene composite powders with an encapsulated structure via the combustion reaction of Mg with CO 2 and ZrO 2 using as a diluent. A passive radiative cooling coating with an emissivity of 0.97 was developed using ZrO 2 /graphenet composite powders and silicon fluoride (SiF) resin. At 50 wt% filler content, the thermal conductivity of the coating reached 4.6 W m −1 K −1 , an increase of 27.8% compared to the coating prepared with mechanically mixed ‘ZrO 2 +graphene’ powders. This improvement could be attributed to the ZrO 2 /graphene powders with encapsulated structure forming a phonon transport network in the coating. Heat dissipation tests of coated Al heat sinks demonstrated that the cooling efficiency increased from 8.2% to 15.0% as the thermal conductivity of the coating increased from 3.6 W m −1 K −1 –4.6 W m −1 K −1 . This result indicates that simultaneously achieving high thermal conductivity and high emissivity of the coating could significantly enhance the heat dissipation of the heat sink.
研究领域:
材料科学
·
热管理技术
✓ 已验证
产品关联
DOI
高影响因子
JOURNAL OF ELASTOMERS AND PLASTICS
·
2023
·
IF 1.7
Xiaoyong Yang,Xiaofang He,Fuqin Xu,Zhaoyang Hou,Zhihui Ma,Jing Cai,Ruimin Jiao
With the rapid development of electronic devices and rubber tires, the industry has put forward new requirements for the heat dissipation of rubber components. With excellent thermal conductivity, oxidation resistance, and thermal stability, hexagonal boron nitride (h-BN) is often added to plastics or rubber as a thermally conductive filler, but is less effective when used directly. In this study, h-BN-K was prepared by direct modification of the mixed solution of KH-550, and KH-570, while h-BN-PK was prepared by co-modification of dopamine, KH-550, and KH-570. Two modified h-BN were added to natural rubber (NR) to improve the vulcanization properties, mechanical properties, and thermal conductivity. It was found that the tensile strength and thermal conductivity of 20 wt% h-BN-PK/NR composites were 30.6 MPa and 0.335 W/mK, which were 39.1% and 110.7% higher compared to pure NR (22.0 MPa and 0.159 W/mK), respectively. In addition, the addition of h-BN improved the thermal stability performance of NR to some extent. In conclusion, the h-BN-PK/NR composites provide a certain reference for the use of thermally conductive NR and suggest new ideas for heat dissipation of electronic devices.
研究领域:
材料科学
·
高分子化学
✓ 已验证
DOI
高影响因子
危险品化学品经营许可证（带存储）