JOURNAL OF COLLOID AND INTERFACE SCIENCE
·
2023
·
IF 9.9
An-Ni Zheng,Zhao-Yun Wang,Jia-Qiang Yang,Lei Jin,Fang-Zu Yang,Dong-Ping Zhan
Advanced Ag nanoparticles (Ag NPs) were prepared by wet chemical oxidation–reduction method, using mainly the tannic acid as reducing agent and carboxymethylcellulose sodium as stabilizer . The prepared Ag NPs uniformly disperse and are stable for more than one month without agglomeration. The studies of transmission electron microscopy (TEM) and ultraviolet–visible (UV–vis) absorption spectroscopy indicate that the Ag NPs are in homogeneous sphere with only 4.4 nm average size and narrow particle size distribution . Electrochemical measurements reveal that the Ag NPs behave excellent catalytic activity for electroless copper plating using glyoxylic acid as reducing agent. In situ fourier transform infrared ( in situ FTIR) spectroscopic analysis combined with density functional theory (DFT) calculation illustrate that the molecular oxidation of glyoxylic acid catalyzed by Ag NPs is as the following routes: glyoxylic acid molecule first is adsorbed on Ag atoms with carboxyl oxygen terminal, then hydrolyzed to diol anionic intermediate, and last oxidized to oxalic acid . Time-resolved in situ FTIR spectroscopy further reveals the real-time reactions of electroless copper plating as follows: glyoxylic acid is continuously oxidized to oxalic acid and releases electrons at the active catalyzing spots of Ag NPs, and Cu(II) coordination ions are in situ reduced by the electrons. Based on the excellent catalytic activity, the advanced Ag NPs can replace the expensive Pd colloids catalyst and successfully apply in through-holes metallization of printed circuit board (PCB) by electroless copper plating.
研究领域:
材料科学
·
电化学
✓ 已验证
产品关联
DOI
PubMed
高影响因子
ELECTROCHEMISTRY
·
2019
·Vol. 87
·期 4
·214-219
·
IF 1.293
Jianhong LU,Mingyong WANG,Xiaomei DENG,Jianhei YAN,Jimmy YUN,Shuqiang JIAO
Potassium ferricyanide (K3Fe(CN)6) as a stabilizer was used for electroless copper plating in EDTA/THPED dual-ligands system. The deposition behavior and surface structure of copper layer were studied systematically. The results indicated that the overall deposition process was divided into three regions designated as induction, transitional and stable regions. It was confirmed that K3Fe(CN)6 can delay the fall-off trend of electrode potential, which may be related to the competitive adsorption between Fe(CN)63− with large radius and OH− with small radius on the electrode surface. The addition of K3Fe(CN)6 led to a decrease of 70% in redox current density, which reduced obviously Cu deposition rate. Meanwhile, the decomposition time of electroless solution sharply increased and the reoxidation of Cu(I) ion was effectively inhibited in the presence of K3Fe(CN)6. Metallographic studies of copper layers with and without K3Fe(CN)6 stabilizer revealed that surface structures and fine particle distribution were uniform. The resultant product was high-purity without detectable iron impurities. Moreover, the addition of K3Fe(CN)6 was favorable to the formation of the preferred orientation on (220) crystal plane, and the grain size decreased from 61.5 nm to 40.4 nm with the addition of 50 mg L−1 K3Fe(CN)6.
研究领域:
材料科学
·
电化学
✓ 已验证
DOI
高影响因子
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
·
2025
·Vol. 172
·期 1
·012507
·
IF 3.3
Le Xu,Guo-Liang Liu,Hao-Wen Zhang,Yan Wang,Zhe-Sheng Feng
In this work, nano-silver doped ZnO (SZO) thin films were prepared on glass substrates and through-glass vias (TGVs) using a sol-gel dip-coating method. The SZO film served as a catalytically active mixed metal oxide adhesion layer, replacing the etching, sensitization, and activation processes typically used in traditional electroless copper plating (ECP). Surface cleaning is essential for achieving high-quality coatings. In this work, an alkaline degreasing solution, followed by a citric acid chelating solution, was used to effectively enhance the wettability of the glass surface. The SZO thin film, formed on the glass substrate after dip-coating and sintering of the SZO sol, can be directly coated with a copper layer via ECP. Following subsequent electroplating, a copper film with a thickness of 11 μm and a resistivity as low as 1.84 μΩ·cm was obtained. The adhesion strength of the copper layer under vacuum annealing at 300 °C in nitrogen atmosphere is 4.19 N cm−1. In addition, the SZO sol-gel dip-coating process achieved complete coverage of the copper seed layer for TGVs with a high aspect ratio (10:1). This approach presented a cost-effective solution for fully solution-processed substrate-to-substrate interconnects in electronic device packaging applications.
研究领域:
材料科学
·
电子工程
✓ 已验证
产品关联
DOI
高影响因子
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
·
2023
·Vol. 34
·期 30
·1-10
·
IF 2.8
Wang Sanlong,Wan Jiajia,Tong Huijuan,Yu Yang,Zhang Wenqing,Chen Zhenming,Gui Chengmei,Huang Junjun,Li Honglin
To design and fabricate a novel and low-cost electromagnetic interference shielding material with outstanding performance is becoming extremely popular by scientists over the years, owing to increasingly complex proliferation of electromagnetic waves. In this work, the composite construction that included activation of silver nitrate, electroless copper plating (ECP) and annealing for fabricating weaving structure copper tube was reported to alleviate the problem above. The effect of annealing temperature on its electromagnetic shielding performance was investigated as well. Results manifest the metal particle/ligand structure on weaving cotton surface could promote copper particles to be reduced and deposited on its surface, which can generate weaving copper pipes with face-centered cubic structure spontaneously. The resultant composite, i.e. textured copper tube possessed brilliant shielding effectiveness of 25.2 dB. Interestingly, the electromagnetic shielding performance of annealed ECP cotton was firstly enhanced, and then reduced with the increase of annealing temperature. The 200 °C-annealed ECP cotton exhibited a better shielding effectiveness performance, the values are increased by 38.1% to 34.8 dB, in which the reflection and absorption shielding are increased by 39.9% and 6.7% compared to the one of unannealed sample, corresponding power coefficients of reflection, transmission and absorption were 0.2691, 0.0031, 0.7277, owning to the improvement of Cu tube crystallinity and the introduction of Cu 2 O particles acted as scattering center of electromagnetic waves. Therefore, it would provide a promising future tendency from the viewpoint of abundant resources and sustainable development.
研究领域:
材料科学
·
电磁学
✓ 已验证
DOI
高影响因子
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES
·
2023
·
IF 3.4
Wenxia Zhao,Xin Liu,Xuan Song,Caifang Zhang,Huaijun Chen,Xinwei Li,Kaihong Hui,Wei Zhao,Liang Qiao,Hao Zhu,Yi Cheng,Zenglin Wang
The purpose of this study was to enhance the adhesion strength between the epoxy resin (EP) substrate and the electroless copper plating layer by utilizing a MnO 2 –H 2 SO 4 –H 2 O–Na 4 P 2 O 7 system for surface modification. The effect of the volume ratio of V H2SO4 :V H2O and the duration of surface modification on various surface characteristics and adhesion strength was examined. The results provide valuable insights into the relationship between these factors and their impact on the properties of the surface. Optimal results were achieved with a volume ratio of V H2SO4 :V H2O at 3:1, a surface modification time of 20 min, Na 4 P 2 O 7 content of 30 g L −1 , and a modification temperature of 50 °C. Following the surface modification treatment, the EP substrate surface exhibited many deep micro-holes, significantly improving surface roughness . Due to the enhanced roughness on the surface and the application of suitable modifications, the contact angle on the EP substrate surface exhibited a significant decrease from 94.6° to 19.5°. This alteration caused the surface to transition from hydrophobic to hydrophilic . The adhesion strength between the EP substrate and the electroless copper plating layer was significantly increased to 0.74 kN m −1 . This improvement was attributed to the combined effects of surface roughness and hydrophilicity of the substrate surface.
研究领域:
材料科学
·
表面工程
✓ 已验证
产品关联
DOI
高影响因子
Materials
·
2022
·Vol. 15
·期 5
·1846
·
IF 3.748
Haiyao Cao,Zaiji Zhan,Xiangzhe Lv
Ti3AlC2presents a hexagonal layered crystal structure and bridges the gap between metallic and ceramic properties, and Gadolinia (Gd2O3) has excellent thermodynamic stability, which make them potentially attractive as dispersive phases for Cu matrix composites. In this paper, Cu@Ti3AlC2-Gd2O3/Cu composites, Ti3AlC2-Gd2O3/Cu composites, and Gd2O3/Cu composites were prepared by electroless Cu plating, internal oxidation, and vacuum hot press sintering. The microstructure and the effect of the Cu plating on the properties of the Cu@Ti3AlC2-Gd2O3/Cu composites were discussed. The results showed that a Cu plating with a thickness of about 0.67 μm was successfully plated onto the surface of Ti3AlC2particles. The ex situ Ti3AlC2particles were distributed at the Cu grain boundary, while the in situ Gd2O3particles with a grain size of 20 nm were dispersed in the Cu grains. The electroless Cu plating onto the surface of the Ti3AlC2particles effectively reduces their surfactivity and improves the surface contacting state between the Cu@Ti3AlC2particles and the Cu matrix, and reduces electron scattering, so that the tensile strength reached 378.9 MPa, meanwhile, the electrical conductivity and elongation of the Cu matrix composites was maintained at 93.6 IACS% and 17.6%.Keywords:Cu@Ti3AlC2-Gd2O3/Cu composites;electroless Cu plating;microstructure;electrical conductivity;mechanical properties
研究领域:
材料科学
·
冶金工程
✓ 已验证
产品关联
DOI
PubMed
高影响因子
危险品化学品经营许可证（带存储）