ACS Applied Materials & Interfaces
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2014
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IF 5.9
Yu Chang,Chao Yang,Xin-Yao Zheng,Dong-Yu Wang,Zhen-Guo Yang
A novel patterning–adsorption–plating process to additively fabricate copper patterns is developed. Functional ink with ion-adsorption nanoparticles was inkjet printed on PET substrate to form the patterned adsorption film. Catalytic ion was adsorbed by amino groups in the adsorption film, and catalyzed the electroless plating of copper. The mercapto groups introduced to the film enhance the reliability of the patterns. Specific solvent used in the ink increase the surface roughness of the adsorption film, leading to a better adhesion of the patterns. The prepared copper patterns show excellent conductivity about the same with bulk copper and good adhesion on PET.
研究领域:
材料科学
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电子工程
✓ 已验证
产品关联
DOI
PubMed
高影响因子
JOURNAL OF POLYMER SCIENCE
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2023
·Vol. 61
·期 9
·818-828
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IF 3.4
Dongwu Li,Dandan Li,Zhao Ke,Qian Gu,Ke Xu,Chunhai Chen,Guangtao Qian,Gang Liu
Colorless polyimides (CPIs) with superheat resistance and low coefficient of thermal expansion (CTE) are required urgently to employ as plastic substrates in flexible-display devices. To attain the target properties, 2-(2-methyl-4-(4-aminobenzamido)phenyl)-5-(4-aminobenzamido)- N -phenylbenzimidazol (AB-MPBZ) that contains biamide was synthesized, and its homo- and co-polyimides were prepared with 1,2,4,5-cyclohexanetetracarboxylic dianhydride (HPMDA) and cyclobutane-1,2,3,4-tetracarboxylic dianhydride (CBDA). The crank-shaft-like amide groups effectively increases the linearity and stiffness of polymer segments, providing CPI films with low CTE. On the basis, the CBDA based poly(benzimidazole imide) (PBII) series with dense interchain packing exhibits further reduced CTE down to 22 ppm K −1 and increased glass-transition temperature ( T g ) up to 404 °C. Such good thermal properties indicate that the resultant copolyimides have potential applications as colorless flexible substrates. These provide a feasible approach to balance thermal and optical performance of polyimides. Graphical
研究领域:
材料科学
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高分子化学
✓ 已验证
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DOI
高影响因子
Materials Today Advances
·
2024
·
IF 8.1
Heming Li,Panpeng Wei,Yongqi Wang,Qiushi Zhu,Xinming Wang,Weiguo Gao,Lin Tao,Ke Ma,Zhizhi Hu,Wei Chen
Polyimide (PI) faces new challenges in meeting the requirements of low coefficient of thermal expansion (CTE), low dielectric content/loss, and high thermal stability to be utilized effectively as a substrate for flexible electronic materials. At present research, the CTE of PI films can be reduced to around 5 ppm/K, with Tg > 420 °C. However, it is difficult to balance low CTE and high Tg at the same time, and reducing dielectric performance is even more difficult. This study focused on synthesizing four types of PI films (using BPDA as the dianhydride) by employing biphenyl structure diamines (PDA, BZD, DPT, DMP) with an increasing number of benzene rings. The improvement in CTE, dielectric properties, and thermal stability was observed with an increase in the number of benzene rings and a decrease in the number of imine rings in the PI horizontal structure. The Tetraphenylene PI-DMP exhibited values of ε and tanθ as 3.31 and 4.73 ‰ respectively under 10 GHz . Additionally, the biphenyl PI films demonstrated commendable thermal stability (Tg = 442°C ), outstanding mechanical properties (elastic modulus > 10 GPa ), and a low CTE ( 2 ppm/K within the temperature range of 50–300 °C, and close to the 3.6 ppm/K CTE of monocrystalline silicon). The low CTE, high thermal stability, and low dielectric properties that 5G flexible substrate materials need to be qualified are simultaneously reflected in this study. MS theoretical calculations were used to analyze the results. The excellent consistency with experimental results can promote the feasibility of MS theory in PI dielectric properties at high-frequency (10 Ghz). This innovative approach is anticipated to provide foldable chip fields with intrinsic biphenyl PI materials possessing low dielectric, low CTE, and high thermal stability.
研究领域:
材料科学
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电子工程
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产品关联
DOI
高影响因子
COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS
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2025
·
IF 5.4
Li Zhang,Zhaomeng Wang,Wenhao Zhang,Puyue Xia,Sining Fan,Shaolong Tang
Nanoporous gold (NPG) offers promise in electronic packaging due to its high compressibility, excellent conductivity, and high thermal conductivity. However, fabricating ultrafine (1–10 μm) conductive NPG microspheres presents a challenge. Herein, we report a novel method for preparing high-volume shrinkage NPG microspheres (NPGMS) with a particle size range of 2.3–8 μm (average 5.06 μm, calculated by ImageJ software). The method involves preparing gold-copper precursors via spray freeze-drying, achieving spheroidization through non-wetting effects at the liquid-solid interface, and fabricating NPGMS by chemical dealloying. Statistical analysis shows a 79 % average volume shrinkage upon dealloying. By using these high-volume shrinkage NPGMS, we fabricated an NPGMS anisotropic conductive film (NPGMS-ACF) and demonstrated its superior performance in 500-micron pitch Flex-on-Glass (FOG) bonding. Remarkably, at only 5 wt% powder loading, the NPGMS-ACF exhibited significantly improved connection reliability compared to commercial ACFs. In cyclic thermal shock testing, NPGMS-ACF packaged devices displayed exceptional stability, with a resistance change of 0.468 Ω (18.4 % change) after 5 cycles. In contrast, commercial ACF packaged devices failed after one cycle, with resistance changes exceeding 100 MΩ. The improved performance of NPGMS-ACF stems from: (1) NPGMS’s excellent thermal and electrical conductivity; (2) enhanced chip-substrate bonding due to the porous structure’s high compressibility, effectively reducing thermal stress. These findings establish NPGMS-ACF as a promising candidate for advanced liquid crystal display (LCD) packaging, providing enhanced thermal shock resistance and adhesive reliability.
研究领域:
材料科学
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纳米技术
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电子封装
·
应用物理学
✓ 已验证
产品关联
DOI
高影响因子
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