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ACS Applied Polymer Materials · 2025 · IF 4.7

Biphenyl-Based High Thermal Conductivity Films with Intrinsic Self-Healing Properties

Yanhan Tao,Hui Yang,Zhijun Liu,Guoming Yuan,Kunxin Wang,Kun Wu,Jun Shi

One kind of liquid crystal monomer (LM) based on a biphenyl mesomorphic unit was synthesized from 4,4′-biphenyldicarboxaldehyde and 4-amino-3-methylphenol. Then two films (LM/TPTMP and LM/PETMP) were prepared by reacting the two thiols (TPTMP and PETMP) with the liquid crystal monomer (LM), respectively. These two films simultaneously exhibit intrinsically high thermal conductivity and intrinsic self-healing properties. Due to the presence of biphenyl liquid crystal units in LM and its highly symmetrical structure, a distinct nematic liquid crystal phase can be observed through a polarized optical microscope when heated to the liquid crystal phase transition temperature. The crystallite size of LM was calculated as 37 nm by an X-ray diffractometer (XRD). The films exhibit outstanding thermal conductivity, with LM/TPTMP achieving a thermal conductivity in the horizontal direction (λ∥) of 0.700 W/(m·K), which is significantly higher than that of epoxy resin-based intrinsic thermal conductivity materials in the range of 0.2–0.4 W/(m·K). The introduction of thiol flexible segments endowed the materials with good mechanical strength, with LM/PETMP demonstrating a tensile strength of 4.74 MPa and an elongation at break of 42.57%. Furthermore, the incorporation of dynamic imine bonds imparted excellent self-healing properties to the films. Specifically, LM/PETMP could retain 73% and 65.2% of its original tensile strength after one and three cycles of self-healing behavior, respectively. This type of high intrinsic thermal conductivity (λ) and excellent intrinsic self-healing performance film is expected to solve the problems of safety and service life of high-precision smart devices.

研究领域: 材料科学 · 高分子化学
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JOURNAL OF POLYMER SCIENCE · 2021 ·Vol. 59 ·期 7 ·627-637 · IF 0

Synthesis and performance of flexible epoxy resin with long alkyl side chains via click reaction

Xueyan Dai,Peihong Li,Yanlong Sui,Chunling Zhang

Epoxy resin is a thermosetting polymer with excellent performance and wide application. However, it suffers from low toughness and high brittleness because of its high crosslink density. To overcome these disadvantages, this study synthesizes a toughened, flexible, and hydrophobic epoxy resin (DGEBDBP) by introducing a flexible segment into the polymer network via a thiol-ene click reaction. The cured flexible epoxy resin is obtained by mixing E44, DGEBDBP, and polyamide curing agents of varying contents. The long alkyl side chains significantly improve the mechanical properties and hydrophobicity of the cured epoxy resin. The sample containing 75% DGEBDBP and 25% E44 achieve the highest breaking elongation that was nine times that of pure E44, the highest compressive strength of 112.8 MPa, and the highest contact angle of 101.4°. The introduction of side chains through the thiol-ene click reaction can provide a simple and effective method for designing and preparing multifunctional epoxy resins. Graphical

研究领域: 材料科学 · 聚合物化学
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