Pan Tian,Shengdu Yang,Yushun He,Wanjing Liu,Junhua Zhang
Despite the great progress in alkali developing photocurable resins for electronic packaging, the continuous development of high-frequency communication technology still poses a great challenge to the high heat resistance, toughness, robustness, and dielectric properties of photocurable resins. In this paper, a simple and feasible method is proposed to prepare a series of naphthalene-based photocurable resins with excellent thermal/mechanical properties and performance by introducing four selected fluorodiamine molecules into 1,6-naphthalene diglycidyl ether (NDE), respectively, and employing maleic anhydride (MA) as the alkali developing functional component. Among them, the effects of MA on the photocuring kinetics and thermo-mechanical properties of the resins were systematically investigated. Most importantly, the high functionality molecules obtained by diamine chain extension effectively improved the properties of the photocured films. As a result, two of the cured films exhibited excellent toughness (3.00 ± 1.39 MJ cm −3 and 4.55 ± 1.16 MJ cm −3 ), excellent heat resistance (212 and 195 °C), low dielectric constants (2.84 and 3.25), and low dielectric losses (0.0024 and 0.0068). Finally, the fast alkali development capability possessed by these two resins was verified, demonstrating their potential for technical application in real packaging boards and providing an effective strategy for the design and manufacture of high-performance naphthalene-based inks.
Shu-Xiao Wang,Jia-Xin Li,Shan-Yuan Zhong,Qing Liao,Mei-Jin Lin
With the rapid advancement of 5G communication technology, the development of novel low-dielectric constant polyimides (PIs) as interlayer dielectric materials has become a key area of research. However, the development of fluorinated diamines with simple synthetic routes remains a challenge. In this study, a facile and efficient one-step synthetic strategy was employed to construct three novel fluorinated diamines with fully non-planar and twisted structures. The influence of fluorine content and different bulky side groups on the dielectric, thermal, and optical properties of the PIs based on these diamines was investigated. Notably, the increase in fluorine content and structural non-planarity significantly enhanced the dielectric properties and moisture resistance. Among the synthesized PIs, FPOPF-6FDA exhibited the most favorable performance, with a low dielectric constant ( D k = 2.20 @ 10 8 Hz), low dissipation factor ( D f = 0.00755 @ 10 8 Hz), low water absorption ( W A = 0.89 %), and high hydrophobicity ( WC A = 93.90°). Moreover, the non-planar and twisted fluorinated diamines did not compromise the thermal stability ( T d5 > 500 °C, T g = 250.87–340.13 °C), optical transparency ( T 500 > 85.90 %), or solubility in organic solvents of these PIs. This work provides valuable insights into the molecular design and cost-effective synthesis of high-performance low-dielectric PIs.
危险品化学品经营许可证（带存储）