Chinese Physics B
·
2024
·Vol. 33
·期 10
·108103
·
IF 1.5
Ruike Zhang,Ruiang Guo,Qian Li,Shuaiqi Li,Haidong Long,Duanwei He
Cubic boron nitride and hexagonal boron nitride are the two predominant crystalline structures of boron nitride. They can interconvert under varying pressure and temperature conditions. However, this transformation requires overcoming significant potential barriers in dynamics, which poses great difficulty in determining the c-BN/h-BN phase boundary. This study used high-pressure in situ differential thermal measurements to ascertain the temperature of h-BN/c-BN conversion within the commonly used pressure range (3–6 GPa) for the industrial synthesis of c-BN to constrain the P–T phase boundary of h-BN/c-BN in the pressure–temperature range as much as possible. Based on the analysis of the experimental data, it is determined that the relationship between pressure and temperature conforms to the following equation: P=a+\displaystyle \frac{1}{b}T. Here, P denotes the pressure (GPa) and T is the temperature (K). The coefficients are a = −3.8±0.8 GPa and b = 229.8±17.1 GPa/K. These findings call into question existing high-pressure and high-temperature phase diagrams of boron nitride, which seem to overstate the phase boundary temperature between c-BN and h-BN. The BN phase diagram obtained from this study can provide critical temperature and pressure condition guidance for the industrial synthesis of c-BN, thus optimizing synthesis efficiency and product performance.
研究领域:
材料科学
·
物理化学
✓ 已验证
产品关联
DOI
高影响因子
SCRIPTA MATERIALIA
·
2018
·
IF 4.163
Yinjuan Liu,Duanwei He,Zili Kou,Fangming Liu,Pei Wang,Qiwei Hu,Akun Liang
Hexagonal boron nitride (hBN) was used as the additive in improving the hardness and thermal stability of polycrystalline diamond compact under high temperature and high pressure. Indentation testing on diamond/cubic boron nitride (cBN) composites indicated a Vickers hardness of 96 ± 7 GPa, rivaling the hardness of monocrystal diamond. Thermal gravimetric analysis (TGA) suggested that the composites of diamond/cBN are thermally stable in air up to ∼910 °C which is higher than that of pure polycrystalline diamond compact (∼750 °C). Raman, TGA, x-ray photoelectron spectroscopic and microstructure analyses all revealed the features of diamond/cBN composition beyond both diamond and cBN.
研究领域:
材料科学
·
物理学
✓ 已验证
产品关联
DOI
高影响因子
CHEMICAL PHYSICS LETTERS
·
2019
·
IF 1.901
Wenchao Zhao,Wenjie Zhao,Zhiping Huang,Gang Liu,Bin Wu
Hexagonal boron nitride and cubic boron nitride were modified by polydopamine to improve dispersion in epoxy resin (EP). The average coefficient of friction (COF) of EP-HBN@PDA coating decreased under dry and seawater condition compared to EP indicating BN possessed self-lubricating effect. COF decreased with CBN content raising in seawater, because seawater removed debris including BN particles and CBN with high hardness improved rigidity of coatings. Wear rates of EP-CBN@PDA coating decreased by 68.88% and 97.95% compared to EP-HBN@PDA, and binary-filled coating performed excellently under seawater, it revealed CBN was more effective than HBN in improving load carrying capacity of coatings.
研究领域:
材料科学
·
表面工程
✓ 已验证
产品关联
DOI
高影响因子
CERAMICS INTERNATIONAL
·
2020
·
IF 3.83
Hao Liang,Weitong Lin,Qiming Wang,Wei Zhang,Shixue Guan,Jiawei Zhang,Ji-Jung Kai,Duanwei He,Fang Peng
Cubic boron nitride (cBN), a typical superhard material, has garnered significant interest for both fundamental scientific research and technical applications. Here, nanostructured cBN with high-density nanotwins and stacking faults was synthesized by rapid quenching using hexagonal boron nitride (hBN) as the starting material at a moderate temperature (2200 K) and low pressure (13 GPa). This synthetic nanostructured cBN exhibits high Vickers hardness (78 GPa), high fracture toughness (11.8 MPa·m 1/2 ), and extremely high oxidization temperature (1565 K). We propose that the refined grain structure and excellent mechanical properties of the cBN synthesized in this study is attributed mainly to dislocation slips and (111) mechanical nanotwins that dominate this phase transformation.
研究领域:
材料科学
·
纳米技术
✓ 已验证
DOI
高影响因子
CHEMICAL ENGINEERING JOURNAL
·
2025
·
IF 13.2
Caiyue Huang,Xiaohua Jia,Rui Tian,Zhaofeng Wang,Haojie Song
Technological advancements have significantly accelerated the development of high-performance thermal interface materials (TIMs), consequently leading to an increase in electronic waste (e-waste) generation. The recyclability of TIMs has thus emerged as a pressing concern. In this work, we propose a recyclable TIM constructed by an ordered interpenetrating structure composed of boron nitride nanosheets (BNNS) and boron nitride nanoribbons (BNNR). Functionalized BNNS (f-BNNS) were immobilized onto a melamine sponge (MS) skeleton using iteratively electrostatic layer-by-layer (L-B-L) assembly technique. Subsequently, BNNR were integrated within the f-BNNS x @MS framework to establish a three-dimensional (3D) binary BNNS/BNNR interpenetrating thermally conductive network through freeze-drying and hot-pressing. This method ensures robust thermal conductivity connectivity within the HDCN matrix. Thanks to the 3D BNNS/BNNR interpenetrating ordered thermal conductivity network, the f-BNNS x /BNNR@MS/HDCN (BBMH) nanocomposites demonstrate an outstanding in-plane thermal conductivity of 3.72 W·m −1 K −1 at a BN loading of 45 wt%, representing a remarkable enhancement of 2076 % compared to pure MS/HDCN, and surpassing previously reported BN polymer composites with analogous loading levels. Furthermore, the incorporation of BN and MS contributes to the exceptional flame retardancy observed in the BBMH nanocomposites. Significantly, these nanocomposites enable efficient recycling of hybrid BN fillers in acidic environments. This work offers a novel strategy for designing recyclable and high-performance thermal interface materials.
研究领域:
材料科学
·
纳米技术
·
电子工程
✓ 已验证
产品关联
DOI
高影响因子
ACS Applied Nano Materials
·
2022
·
IF 6.14
Jingwen Yang,Chaochao Cao,Wei Qiao,Jiaxiao Qiao,Hejun Gao,Wenjuan Bai,Zexia Li,Peng Wang,Chengchun Tang,Yanming Xue
Advanced heat dissipation materials are necessary for powerful and miniaturized electronics. Hexagonal boron nitride (h-BN) is an ideal material for thermal management due to its electrical insulation but thermal conductivity. However, its utilization is seriously restricted by the pulverulence, and multilayer and chemical inertness. Herein, highly functionalized BN nanosheets (BNNSs) are exfoliated by a boric acid-assisted chemo-mechanical method and show stable dispersion in various solvents. An ingenious chemical etch- and mechanical force-induced exfoliation and functionalization mechanism is proposed. Due to the existence of strong interfacial interaction between BNNSs and poly(vinyl alcohol) (PVA), a series of composite films with excellent thermal stability, low dielectric constant (2–4), negligible dissipation factor (<0.2), good machinability, and flexible bending and folding performances are prepared. The BNNSs’ filling content can reach ∼90 wt %, and the BNNSs/PVA films’ maximum tensile strength and modulus can be as high as ∼85.5 MPa and ∼7.6 GPa, respectively. Importantly, their in-plane thermal conductivity increases monotonously with the elevated BNNS content and temperature. The maximum thermal conductivity can reach up to 27.3 and 39.3 W·m–1·K–1 at 25 and 100 °C, respectively. Noteworthily, the BNNSs/PVA films show rapid thermal diffusion and can be readily designed as efficient heat dissipation components for integrated and intelligent electronic devices.
研究领域:
材料科学
·
热管理技术
✓ 已验证
产品关联
DOI
高影响因子
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING
·
2017
·
IF 4.075
Haoming Fang,Shu-Lin Bai,Ching Ping Wong
A series of novel flexible polymer composites consisted of boron nitride foam (BNF), boron nitride nanosheets (BNNS) and polydimethylsiloxane (PDMS) were designed and fabricated by vacuum-assisted infiltrating BNNS/PDMS mixtures into 3D BNF synthesized via chemical vapor deposition (CVD). Their microstructure, thermal, mechanical and dielectric properties were studied. Contributed to the interconnected networks of BNF and synergistic effect of BNNS with BNF, 10 wt% BNNS/BNF/PDMS composite shows a high thermal conductivity of 0.56 W m −1 K −1 , high heat resistance index of 275.6 °C, 33% increment of Young’s modulus compared to PDMS, relative permittivity of 3, dissipation factor of 0.0051, EMI shielding effectiveness of 1.5 dB at X band and breakdown strength of 21.8 MV/m. Due to the outstanding comprehensive properties, BNNS/BNF/PDMS composites have a promising potential application in wide electronic packaging field.
研究领域:
材料科学
·
电子工程
✓ 已验证
DOI
高影响因子
COMPOSITES SCIENCE AND TECHNOLOGY
·
2019
·
IF 6.309
Liwei Zhao,Xiangrong Shi,Yue Yin,Bo Jiang,Yudong Huang
Polymer dielectric composites with excellent thermal conductivity have received increasing attention in the modern electronics industry due to their outstanding thermal management performance. However, conventional polymers used for the thermally conductive composites usually suffer from accidental mechanical failure, causing decrease in service life or loss of functionality. In this work, we prepared a self-healing silicone/BN composite simultaneous with high thermal conductivity, high self-healing efficiency and low electrical conductivity . Silicone cross-linked by DA adduct was used as polymer matrix and BN was used as thermally conductive filler . The self-healing silicone/BN composite exhibited a high self-healing efficiency of higher than 90% and an enhancement of 544% in thermal conductivity at BN content of 50 wt%. The self-healing composites presented excellent thermal management performance. The excellent self-healing properties were attributed to the thermal reversibility of the DA reaction and the flexibility of the siloxane molecules. In addition, the self-healing silicone/BN composite with 50 wt% of BN exhibited a low dielectric dissipation factor of 0.017 and an enhancement of 568% in tensile strength .
研究领域:
材料科学
·
高分子化学
·
电子工程
✓ 已验证
产品关联
DOI
高影响因子
COMPOSITES SCIENCE AND TECHNOLOGY
·
2024
·
IF 8.3
Liyuan Guo,Lei Feng,Caiyue Huang,Qiang Song,Peng Wei,Dongfang Xu,Mengdan Hou,Haojie Song
Technological advances have accelerated the development of high-performance insulation-based Thermal Interface Materials (TIMs), leading to increased generation of electronic waste. A significant challenge is the development of recyclable TIMs with superior thermal conductivity. Hemiaminal dynamic covalent network (HDCN) polymers are considered as an ideal matrix material for recyclable TIMs due to their high degradability at low pH (pH < 2). In this work, binary thermally conductive paths of hexagonal boron nitride nanoribbons (BNNRs) and boron nitride nanosheets (BNNSs) are introduced into the HDCN to improve the thermal conductivity of HDCN without sacrificing its electrically insulating properties. The functional BNNSs (f-BNNSs) are attached onto the surfaces of BNNRs to achieve the homogeneous distribution of nanosheets within the HDCN. Benefiting from the binary thermally conductive paths, an excellent in-plane thermal conductivity of 3.12 W m −1 K −1 for BNNS-BNNR/HDCN nanocomposite is achieved at a BN loading of 14 wt% (containing 2 wt% BNNRs and 12 wt% f-BNNS), increased by 1299 % comparing to the pure HDCN polymer, as well as superior to those reported for polymer composites with similar loading of BNNRs or BNNSs. Additionally, the nanocomposite demonstrated efficient recyclability of BNNSs and BNNRs hybrid fillers in an acidic environment (pH < 2) at 25 °C with a recycling efficiency of 82 %. Notably, the nanocomposite exhibited noteworthy electrical insulation properties. This study demonstrates the potential of BNNS-BNNR/HDCN as a recyclable TIMs and provides a new idea for the future research and development of recyclable high performance TIMs.
研究领域:
材料科学
·
纳米技术
✓ 已验证
产品关联
DOI
高影响因子
HIGH PERFORMANCE POLYMERS
·
2024
·
IF 1.8
Han Zhao,Jianxin Rong,Dengke Li,Dianqiu Jia,Xiaoyan Yu,Qingxin Zhang
As the electronic industry develops rapidly, the miniaturisation, integration and multifunctionality of electronic devices have resulted in a dramatic increase in power density, and the heat dispersal of electronic devices has attracted much attention. In this work, hydroxylated hexagonal boron nitride (BN-H) was obtained by hot alkali treatment, and boron nitride nanosheets (BNNS) with a thickness of about 4 nm were obtained by boric acid-assisted ball milling stripping. The effects of different types of fillers as well as filler contents on the thermally conductive and mechanical performance of organosilicon composites were also compared. Notably, when BN-H and BNNS thermally conductive fillers were added at 12 wt%, the thermally conductive coefficients of the composites were 0.4831 W·m−1·K−1 and 0.7131 W·m−1 K−1, respectively, which were 183% and 318% of higher than that for the pure silicone rubber (SR, with a thermally conductive coefficient of 0.1706 W·m−1·K−1). In addition, in respect of mechanical performance, the tensile strengths of SR/BN-H and SR/BNNS composites with a filling level of 12 wt% were 3.59 MPa and 3.89 MPa, respectively, and the storage moduli were 4501 MPa and 4583 MPa, respectively, which were improved to a certain extent compared with pure SR. The present work provides an effective way to develop organosilicone rubber composites with good thermal conductivity and mechanical properties by boric acid assisted ball milling to strip boron nitride in the field of electronics packages.
研究领域:
材料科学
·
电子封装
✓ 已验证
DOI
高影响因子
DIAMOND AND RELATED MATERIALS
·
2014
·
IF 1.572
Zhengyang Li,Aiguo Zhou,Liang Li,Libo Wang,Meihua Hu,Shangsheng Li,Surojit Gupta
In this paper, synthesis of novel super hard and high performance composites of titanium silicon carbide–cubic boron nitride (Ti 3 SiC 2 –cBN) was evaluated at three different conditions: (a) high pressure synthesis at ~ 4.5 GPa, (b) hot pressing at ~ 35 MPa, and (c) sintering under ambient pressure (0.1 MPa) in a tube furnace. From the analysis of experimental results, the authors report that the novel Ti 3 SiC 2 –cBN composites can be successfully fabricated at 1050 °C under a pressure of ~ 4.5 GPa from the mixture of Ti 3 SiC 2 powders and cBN powders. The subsequent analysis of the microstructure and hardness studies indicates that these composites are promising candidates for super hard materials.
研究领域:
材料科学
·
力学工程
✓ 已验证
产品关联
DOI
高影响因子
Lubricants
·
2023
·Vol. 11
·期 5
·198
·
IF 3.5
Yumeng Wang,Ning Shi,Min Liu,Sheng Han,Jincan Yan
In this work, a chemical modification method was used to prepare silicone grease with high thermal conductivity. We report two preparation methods for thermal conductive fillers, which are hydroxylated boron nitride-grafted carboxylic silicone oil (h-BN-OH@CS) and amino boron nitride-grafted carboxylic silicone oil (h-BN-NH2@CS). When h-BN-OH@CS and h-BN-NH2@CS were filled with 30 wt% in the base grease, the thermal conductivity was 1.324 W m−1K−1and 0.982 W m−1K−1, which is 6.04 and 4.48 times that of the base grease (0.219 W m−1K−1), respectively. The interfacial thermal resistance is reduced from 11.699 °C W−1to 1.889 °C W−1and 2.514 °C W−1, respectively. Inorganic filler h-BN and organic filler carboxylic silicone oil were chemically grafted to improve the compatibility between h-BN and the base grease. The covalent bond between functionalized h-BN and carboxylic silicone oil is stronger than the van der Waals force, which can reduce the viscosity of the silicone grease.Keywords:silicone grease;boron nitride;thermal conductivity;interfacial thermal resistance;chemical modification
研究领域:
材料科学
·
热管理技术
✓ 已验证
产品关联
DOI
高影响因子
危险品化学品经营许可证（带存储）