Xiaojun Ruan,Jiangjiang Luo,Rui Wang,Yanbo Yao,Jingjiao Guan,Tao Liu
A nanometer-thick carbon film with a highly ordered pattern structure is very useful in a variety of applications. However, its large-scale, high-throughput, and low-cost fabrication is still a great challenge. Herein, microcontact printing (µCP) and direct laser writing carbonization (DLWc) are combined to develop a novel method that enables ease of fabrication of nanometer-thick and regularly patterned carbon disk arrays (CDAs) and holey carbon films (HCFs) from a pyromellitic dianhydride-oxydianiline-based polyamic acid (PAA) solution. The effect of PAA concentration and pillar lattice structure of the polydimethyl siloxane stamp are systematically studied for their influence on the geometrical parameter, surface morphology, and chemical structure of the finally achieved CDAs and HCFs. Within the PAA concentration being investigated, the averaged thickness of CDAs and HCFs can be tailored in a range from a few tens to a few hundred of nanometers. The µCP+DLWc-enabled electrically conductive CDAs and HCFs possess the characteristics of ease-of-fabrication, nanometer-thickness, highly regular and controlled patterns and structures, and the ability to form on both hard and soft substrates, which imparts usefulness in electronics, photonics, energy storage, catalysis, tissue engineering, as well as physical, chemical, and bio-sensing applications.
Jian Cheng,Xin Liu,Weichang Kong,Qingzheng Lei,Zhiyu Yu,Dun Liu
The fabrication of flexible electronics has gained extensive attention due to the growing demand of flexible devices. Among various methods, laser direct writing technology has emerged as a promising approach due to its advantages of high processing accuracy and simplicity. This research focuses on the preparation of copper microelectrodes using laser-induced reduction of CuO nanoparticles (Cu NPs) on polyethylene terephthalate films. First, the influence of various parameters on the conductivity of the copper microelectrodes is investigated. Second, flexible copper microelectrodes with a minimum resistivity of 62.29 μΩ cm and an adhesion grade of 4B level are successfully fabricated. Building upon these results, a capacitive pressure sensor is developed with optimal sensitivity of 3.99 Pa −1 , good hysteresis of 3.99%, and response and recovery times of 1.2 and 1.3 s, respectively. Repeatability tests confirm the sensor's stability and fatigue resistance. This research provides valuable insights for the production of flexible sensors.
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