ACS Applied Materials & Interfaces
·
2025
·
IF 8.2
Zhiming Xu,Hongpeng Jiang,Xiaoliang Wang,Zhirong Zhang,Yunfeng Qiu,Jie Xu,Debin Shan,Bin Guo
Pool boiling offers exceptional heat transfer performance, making it crucial for advanced thermal management. However, simultaneously optimizing both critical heat flux (CHF) and heat transfer coefficient (HTC) is challenging due to the inherent trade-off between promoting bubble nucleation and mitigating detrimental bubble coalescence. This study presents a micro/nano-hierarchical surface architecture designed to overcome this limitation. Fabricated via laser machining and chemical vapor deposition, the architecture comprises an array of micro pits (MPs) decorated with Co-catalyzed carbon nanotubes (CoCNTs). Computational fluid dynamics (CFD) simulations demonstrate that the MP array enhances HTC by increasing the density of nucleation sites and reducing the bubble departure diameter. Simultaneously, the CoCNTs within the MPs enhance interfacial heat transfer and promote capillary-driven liquid replenishment to the heating surface, effectively mitigating dry-out and significantly improving CHF. The synergistic effects of these micro/nanofeatures yield remarkable performance enhancements on Cu substrates, with the HTC and CHF increasing by 211.5% and 125.2%, respectively, compared to a bare Cu surface. This hierarchical surface design offers a promising strategy for developing high-performance boiling heat transfer surfaces for next-generation thermal management applications.
研究领域:
热能工程
·
材料科学
✓ 已验证
产品关联
DOI
PubMed
高影响因子
Materials Today Nano
·
2023
·
IF 10.3
Junsheng Hou,Junjie Wu,Hongqiang Chen,Lei Huang,Li Ma,Xiong Zhao,Zihan Ding,Yonghai Zhang,Jiabin Fang,Jinjia Wei,Satoshi Watanabe,Nanjing Hao
Microchannel flow boiling heat transfer with nanofluids is an effective approach to enhance the heat transfer performance of high-power electronics. However, conventional nanofluids are plagued by laborious fabrication procedures, poor stability, and uncontrollable nanoparticle sizes, which compromise the overall heat transfer efficiency. To address these challenges, a facile microfluidic synthesis strategy is developed to prepare highly stable and size-controllable silica nanofluids in a continuous, efficient, and high-throughput methodology. The introduction of silica nanofluid aims to facilitate surface bubble formation and delay coalescence, ultimately enhancing the critical heat flux (CHF) and heat transfer coefficient (HTC) for efficiently cooling silica chips. Through the specifically designed spiral microchannel reactor, nanofluids with controllable nanoparticle sizes ranging from several tens of nanometers to a few hundreds of nanometers can be synthesized with long-term (>30 days) dispersion stability at both room temperature (25 °C) and high temperature (75 °C). Importantly, with negligible changes in pressure drop, the CHF and HTC of the synthesized nanofluids increase by maximum of 55 % and 63 % respectively compared to the basic fluid. Furthermore, our results suggest that smaller-sized nanoparticles outperform larger ones at higher flow rates . These findings not only provide important guidelines for the controllable preparation of nanofluids, but also shed new light on the rational design of efficient nanosystems for two-phase cooling.
研究领域:
材料科学
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热力学
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纳米技术
✓ 已验证
产品关联
DOI
高影响因子
CHEMICAL ENGINEERING JOURNAL
·
2024
·
IF 13.3
Hongqiang Chen,Xiang Ma,Xiong Zhao,Quan Gao,Yonghai Zhang,Jinjia Wei
Embedded phase change boiling heat transfer is crucial for addressing the energy saving posed by high-power compact electronic devices. However, the endeavor to fabricate improved heat transfer structures in confined and constricted spaces remains a formidable challenge. Herein, we present a simple and straightforward acoustofluidics strategy to create stable, controllable, and efficient functional Zinc oxide (ZnO) nanoarray coatings in narrow micro-pin-fins chip surfaces with excellent phase change cooling performance. A robust acoustic micromixer combining bubble acoustic streaming and hydrodynamic effect provided by spiral microchannels is proposed to facilitate microscale fluid mixing across a broad flow rate range. The ZnO nanoarray-coated micro pin-fins chip, which allows for customizable lengths, densities, diameter, and morphology, is fabricated through straightforward adjustment of acoustofluidics micromixer parameters. Excellent phase change cooling performance is obtained on this surface, giving priority to nucleation (superheat≈ 4 °C, reduced by 50.2 %), low wall temperature (≤70.7 ℃) under the limit CHF, negligible pumping energy (≤3.5 kPa), and simultaneously enhancing the critical heat flux (CHF, from 45.1 to 77.2 W·cm −2 ) and heat transfer coefficient (HTC, from 5955 to 15552 W·m −2 ·K −1 ) by up to 71.3 % and 161.1 %, respectively, compared with the smooth chip surface. In situ observation and analysis of the dynamic wetting behavior and boiling bubble dynamics indicated ZnO nanoarray coated micro pin-fins chip promotes the phase change heat exchange process by massive nucleation sites, effective control of boiling bubbles, and ultra-fast two-stage liquid rewetting capability. These findings not only provide important guidelines for the precise control and rational design of functional nanomaterials, but also provide new insights for embedded cooling and significant energy savings on power devices.
研究领域:
工程热物理
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纳米材料科学
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电子冷却技术
✓ 已验证
产品关联
DOI
高影响因子
INTERNATIONAL JOURNAL OF THERMAL SCIENCES
·
2025
·
IF 5
Hongqiang Chen,Quan Gao,Xiang Ma,Kai Li,Wangfang Du,Caifeng Li,Yonghai Zhang,Jinjia Wei
Phase change flow boiling heat transfer in microchannel is a very efficient thermal management mode for high-power electronics/devices cooling. However, achieving comprehensive enhancement of flow boiling heat transfer performance at low power consumption is still challenging. Herein, we devised and manufactured a teardrop-like micro-pin-fin coated stable copper hydroxide nanotubes array chip surfaces (S-Nanotube), demonstrating their exceptional enhancement in flow boiling heat transfer efficiency. A series of experiments were conducted using HFE-7100 as a working fluid within a semi-open microchannel. Compared to the smooth surface, the critical heat flux (CHF) and the maximum boiling heat transfer coefficient (HTC) of the S-Nanotube is increased by 82.1 % (from 45.1 to 72.9 and then to 82.1 W/cm 2 ) and 140.5 % (from 5955 to 11,325 and then to 14,316 W/m 2 ·K) at extremely low-pressure drop (≤4 kPa), showing a high coefficient of performance (COP). The temperature of the onset of nucleate boiling on the S-Nanotube surface is reduced by 26.4 %, and the heat flux is greatly increased in a small wall temperature variations (Δ T ≤ 10 °C). In situ observation and analysis of the surface properties and the bubble dynamics, the S-Nanotube chip promotes the phase change heat transfer process by providing massive nucleation sites, reducing bubbles size and residence time, and enhancing the wicking wetting capacity. These findings provide guidance for the rational design of boiling heat transfer-enhanced surfaces and heat sinks and point the way to achieving efficient thermal management of power devices.
研究领域:
电子冷却
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热管理
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材料科学
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传热学
✓ 已验证
DOI
高影响因子
Microsystems & Nanoengineering
·
2024
·Vol. 10
·期 1
·1-12
·
IF 7.3
Dong Helei,Lu Meimei,Wang Weifeng,Tan Qiulin
Hypersonic vehicles and aircraft engine blades face complex and harsh environments such as high heat flow density and high temperature, and they are generally narrow curved spaces, making it impossible to actually install them for testing. Thin-film heat flux sensors (HFSs) have the advantages of small size, fast response, and in-situ fabrication, but they are prone to reach thermal equilibrium and thus fail during testing. In our manuscript, an ITO–In 2 O 3 thick film heat flux sensor (HFS) is designed, and a high-temperature heat flux test system is built to simulate the working condition of a blade subjected to heat flow impact. The simulation and test results show that the test performance of the thick-film HFS is improved by optimizing the structure and parameters. Under the condition of no water cooling, the designed HFS can realize short-time heat flux monitoring at 1450 °C and long-term stable monitoring at 1300 °C and below. With a maximum output thermopotential of 17.8 mV and an average test sensitivity of 0.035 mV/(kW/m 2 ), the designed HFS has superior high-temperature resistance that cannot be achieved by other existing thin (thick) film HFSs. Therefore, the designed HFS has great potential for application in harsh environments such as aerospace, weaponry, and industrial metallurgy.
研究领域:
航空航天工程
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材料科学
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传感器技术
✓ 已验证
产品关联
DOI
PubMed
高影响因子
ADVANCED FUNCTIONAL MATERIALS
·
2025
·
IF 19
Wenjie Liu,Pengli Li,Zhantao Pei,Kunming Shi,Jie Chen,Fei Liu,Hua Bao,Gang Zheng,Xingyi Huang
The rapid increase in power density and the more limited space in compact electronic devices necessitate highly thermally conductive yet electrically insulating tapes for heat dissipation. However, state-of-the-art tapes have an in-plane thermal conductivity ( κ // ) lower than 70 W m −1 K −1 when the thickness exceeds 200 µm, limiting their applications in high heat flux devices. Herein, a multilayer, highly thermally conductive yet electrically insulating tape (MTCEIT) is developed by sandwiching graphene paper within boron nitride nanosheet-filled polymer nanocomposite adhesives and in series combining it with a boron nitride flake-filled polymer composite film. At ≈300 µm thickness, the MTCEIT exhibits an ultrahigh κ // of 121.22 W m −1 K −1 , while maintaining a volume electrical resistivity of 5.07 × 10 11 Ω·cm and a Weibull characteristic breakdown strength of 36.9 kV mm −1 . The multilayer structure endows the MTCEIT with exceptional electrical insulation and highly efficient heat dissipation capability, which can reduce the equilibrium temperature of a central processing unit (CPU) by 9 °C in a thin laptop and stabilize the video frame rate (fluctuation ≤ 0.1 fps) of an ultrathin smartphone without forced cooling. This study provides an innovative solution to the challenge of dissipating high heat flux in compact electronic devices.
研究领域:
材料科学
·
热工学
·
电子封装
·
纳米复合材料
·
能量耗散
✓ 已验证
产品关联
DOI
高影响因子
JOURNAL OF THE EUROPEAN CERAMIC SOCIETY
·
2024
·
IF 5.8
Xinhao Shi,Liping Wang,Wanbo Hou,Jiahui Ding,Tao Feng,Hongjiao Lin,Mingde Tong
Multiphase HfC-SiC ceramic matrix composites were prepared by a combination process. The interface mechanics and ablation properties behaviors were investigated. Introducing the PyC-SiC interface, the composites showed a second-order pull-out mechanism. The mechanical failure model showed that fibers and matrix have different failure strain under load depending on the component that fails first. Moreover, the ablative airflow in the center area will spread to the edge area through the thermal shock microcracks generated. Increasing of the heat flux, the crack width gradually increased to be ditches. It accelerated the evolution of surface morphology, which showed HfC-SiC substrate was first transformed into Hf-Si-O solid solution on the process of phase transformation of oxidation products from 1680 ℃ to 2150 ℃, and eventually sintered into HfO 2 . The change in the morphology of oxidation product consumed more heat and protected the substrate from oxidation, resulting in improving the ablation resistance of composites.
研究领域:
材料科学
·
陶瓷基复合材料
·
机械工程
·
热防护系统
·
烧蚀研究
✓ 已验证
DOI
高影响因子
ADVANCED FUNCTIONAL MATERIALS
·
2025
·
IF 19
Wen Zhang,Wenchao Chen,Xiaoqin Ma,Yanfu Feng,Xiangpeng Geng,Qin Gong,Dekai Guan,Yaxin Liu,Bin Ma
The thermal management of highly integrated chips under high thermal flux density is hindered by disordered high-thermal-conductivity matrices that reduce phonon transport efficiency. To address this challenge, this study employs directional freezing to systematically align multi-walled carbon nanotubes, thereby establishing efficient thermal conduction pathways. Subsequent vacuum impregnation with the CaCl 2 ·6H 2 O phase change material (PCM) yields a composite material with pronounced anisotropic thermal conductivity—6.86 W·m −1 ·K −1 along the axial direction and 0.08 W·m −1 ·K −1 along the radial direction. This structural design not only enhances axial heat transfer and accelerates thermal equilibrium, but it also significantly suppresses PCM leakage via nanoconfinement and capillary effects, accelerating its phase transition by reducing subcooling to 11.41 °C. When employed for the transient thermal management of CPUs, the proposed material effectively directs heat flow, resulting in a 24 °C reduction in peak core temperature and a 19.5 °C reduction in peak surface temperature. Furthermore, this material demonstrates excellent thermal stability over 20 thermal cycles, with a maximum temperature fluctuation of only 5.2 °C. This study thus presents an effective strategy for the development of high-performance, structurally controllable PCM-based thermal interface materials.
研究领域:
材料科学
·
热工工程
·
电子器件散热
·
纳米复合材料
·
能量存储与管理
✓ 已验证
产品关联
DOI
高影响因子
危险品化学品经营许可证（带存储）