Micromachines
·
2022
·Vol. 13
·期 11
·1949
·
IF 3.523
Chao Chang,Yaoguang Yang,Lilin Pei,Zhaoyang Han,Xiu Xiao,Yulong Ji
With the rapid development of electronic technologies towards high integration, high power and miniaturization, thermal management has become an increasingly important issue to guarantee the reliability and service life of electronic devices. The oscillating heat pipe (OHP), which was governed by thermally excited oscillating motion, was considered as a promising technology to dissipate high-density heat and had excellent application prospects in many important industrial processes. A flat-plate OHP, however, was fabricated by traditional welding methods, which were difficult and inefficient, resulting in increasing the cost and wasting the production time. In this work, we adopted a new metal 3D printing technology to develop an aluminum flat-plate OHP, which made it facile to build complex inner channels with high-precision molding at one time. AlSi10Mg powders, as raw materials, were selectively melted and solidified to form the container of the flat-plate OHP. The sintered inner surface presented excellent wettability to the working fluid, which facilitated the evaporation of the working fluid. Acetone was chosen as the working fluid, and the filling ratios with a range of 40–70% were loaded into the flat-plate oscillating heat pipe to analyze its effect on heat transfer performance. It was found that the 3D-printed flat-plate OHP with a 60% filling ratio had a better heat transfer performance and a lower thermal resistance, and it was able to work properly in both vertical and horizontal operation modes. The 3D-printed flat-plate OHP had been successfully applied for the thermal management of high-power LEDs, and the results showed that the temperature of LEDs was maintained within 60 °C, and its service life was prolonged.Keywords:3D printing;oscillating heat pipe;thermal resistance;heat transfer performance
研究领域:
电子工程
·
热管理技术
✓ 已验证
产品关联
DOI
PubMed
高影响因子
Nanomaterials
·
2022
·Vol. 12
·期 16
·2862
·
IF 5.719
Yuewei Li,Ranjith Kumar Kankala,Ai-Zheng Chen,Shi-Bin Wang
Liquid crystal display (LCD)-based 3D printing, a facile and cost-effective manufacturing technique, is often applied when fabricating objects with porcelain structures using photosensitive resins (PSRs). Currently, 3D printed constructions are typically used as models for demonstration purposes rather than industrial applications because of their poor performance. In this study, we prepared nanocomposites by incorporating Ti3C2MXene nanosheets to enhance the overall characteristics of a PSR, including mechanical properties and thermal resistance. Notably, the designed nanocomposites showed optimum performance at an MXene loading of 0.5%w/w. The mechanical properties of the designed nanocomposites confirmed the enhanced ultimate tensile and flexural strengths (by 32.1% and 42.7%, respectively), at 0.5%w/wMXene loading. Moreover, the incorporated MXene presented no substantial influence on the toughness of the PSR. The glass transition and thermal degradation temperatures at 5% weight loss increased by 7.4 and 10.6 °C, respectively, resulting predominantly from the hydrogen bonding between the PSR and MXene. Together, the experimental results indicate that the designed PSR/MXene nanocomposites are expected to replace pristine resins for LCD printing in various practical applications.Keywords:3D printing;photosensitive resin;mechanical property;thermal resistance
研究领域:
材料科学
·
工程学
✓ 已验证
产品关联
DOI
PubMed
高影响因子
Polymers
·
2023
·Vol. 15
·期 2
·414
·
IF 5
Zhaoyang Han,Chao Chang
As flexible electronic technologies rapidly developed with a requirement for multifunction, miniaturization, and high power density, effective thermal management has become an increasingly important issue. The oscillating heat pipe, as a promising technology, was used to dissipate high heat fluxes and had a wide range of applications. In this paper, we reported the fabrication and heat transfer performance evaluation of a polymer-based flexible oscillating heat pipe (FOHP) prepared using 3D printing technology. The 3D-printed inner surface presented excellent wettability to the working fluid, which was beneficial for the evaporation of the working fluid. Ethanol was selected as the working fluid, and the influence of the filling ratios range of 30–60% on heat transfer performance was analyzed. It was found that a 3D-printed FOHP with a filling ratio of 40% presented the best heat transfer performance with the lowest thermal resistance, and the fabricated heat pipes could be easily bent from 0° to 90°. With the best filling ratio, the thermal resistance of the FOHPs increased with larger bending angles. In addition, the 3D-printed FOHP was successfully applied for the thermal management of flexible printed circuits, and the results showed that the temperature of flexible printed circuits was kept within 72 °C, and its service life was guaranteed.Keywords:3D printing;flexible oscillating heat pipe;thermal resistance;thermal performance
研究领域:
热管理技术
·
材料科学与工程
✓ 已验证
产品关联
DOI
PubMed
高影响因子
Lubricants
·
2023
·Vol. 11
·期 5
·198
·
IF 3.5
Yumeng Wang,Ning Shi,Min Liu,Sheng Han,Jincan Yan
In this work, a chemical modification method was used to prepare silicone grease with high thermal conductivity. We report two preparation methods for thermal conductive fillers, which are hydroxylated boron nitride-grafted carboxylic silicone oil (h-BN-OH@CS) and amino boron nitride-grafted carboxylic silicone oil (h-BN-NH2@CS). When h-BN-OH@CS and h-BN-NH2@CS were filled with 30 wt% in the base grease, the thermal conductivity was 1.324 W m−1K−1and 0.982 W m−1K−1, which is 6.04 and 4.48 times that of the base grease (0.219 W m−1K−1), respectively. The interfacial thermal resistance is reduced from 11.699 °C W−1to 1.889 °C W−1and 2.514 °C W−1, respectively. Inorganic filler h-BN and organic filler carboxylic silicone oil were chemically grafted to improve the compatibility between h-BN and the base grease. The covalent bond between functionalized h-BN and carboxylic silicone oil is stronger than the van der Waals force, which can reduce the viscosity of the silicone grease.Keywords:silicone grease;boron nitride;thermal conductivity;interfacial thermal resistance;chemical modification
研究领域:
材料科学
·
热管理技术
✓ 已验证
产品关联
DOI
高影响因子
REACTIVE & FUNCTIONAL POLYMERS
·
2024
·
IF 4.5
Yang Liu,Qi Lin,Xu Long,Shuting Zhang,Hong Dong,Yanjiang Song,Chuan Wu
Three kinds of α -triethylsiloxyl- ω -trimethoxysilyethyl-terminated oligomers (TES-PDMS-TMOS, TES-PTFPMS-TMOS, and TES-PDES-TMOS) were synthesized through an anion catalyzed non-equilibrium ring-opening polymerization reaction of cyclotrisiloxanes and subsequent hydrosilylation reaction with vinyltrimethoxysilane. As the in situ surface modification agent for mixed-size AlN inorganic fillers (1, 20 and 50 μm blended in a mass ratio of 3:5:9), these oligomers have been mixed with Vi-PDMS in a mass ratio of 1:2. Relative to that of silicone pastes using Vi-PDMS as the polymer matrix , the thermal conductivity of silicone pastes made from AlN particles treated with these oligomers is enhanced, while their thermal resistances decreased. With the change of the repeating unit structure in the oligomers, the silicone pastes prepared from these oligomer-treated AlN fillers differ significantly in filler content, thermal conductivity , and thermal resistance. When TES-PTFPMS-TMOS is used and filled with 800 parts (70.3 vol%) of hybrid AlN powders, a silicone paste with a thermal conductivity of 4.56 W/(m. K) could be achieved, which was 37.8% higher than that silicone paste using pure Vi-PDMS as the matrix. When TES-PDES-TMOS is used and filled with 900 parts (72.7 vol%) of hybrid AlN powders, the thermal conductivity of the silicone paste reaches 4.13 W/(m. K). Despite its thermal conductivity being only 3.5% higher relative to the silicone paste using only Vi-PDMS as the polymer matrix, its thermal resistance decreased by 20.3%. When TES-PDMS-TMOS is used and filled with 1200 parts (78.0 vol%) of hybrid AlN powders, the thermal conductivity of the silicone paste could reach up to 4.59 W/(m. K), together with a thermal resistance 29.6% lower than that of silicone paste where 1000 parts (74.7 vol%) of hybrid AlN particles filled in the Vi-PDMS. The heat dissipation of the 30 W high-brightness LED chip also illustrated the excellent thermal conductivities of these silicone pastes. The effect of another terminal group on the monotrimethoxysilylethyl-terminated asymmetric polysiloxanes on the thermal resistance of thermal interface materials was also discussed in detail.
研究领域:
材料科学
·
热管理技术
✓ 已验证
产品关联
DOI
高影响因子
APPLIED THERMAL ENGINEERING
·
2022
·
IF 6.465
Yu Zhao,Zhengguo Zhang,Ziye Ling,Xuenong Gao,Xiaoming Fang
Thermal interface materials that possess high thermal conductivity and can reach low thermal impedance during service, are highly desirable for chip heat dissipation systems, especially when cooling high-power chips. Herein, a novel thermal pad was developed by combining low melting point alloy having metal-level thermal conductivity and liquid-like rheological property with expanded graphite possessing large pore volume and high thermal conductivity. Specifically, the alloy 62.5Ga21.5In16Sn was modified by the trace-oxidation method to obtain oxidized alloy, followed by adsorbing into expanded graphite and then molding and pressing to fabricate the thermal pad. It is found that the oxidation treatment resulted in the generation of refractory metal oxides Ga 2 O 3 and SnO 2 within the alloy, thereby preventing the leakage of the alloy from the composite thermal pad. Impressively, the optimal low melting point alloy/expanded graphite composite thermal pad, prepared at the oxidation duration of 24 min, expanded graphite mass fraction of 4 % and compact density of 3.125 g/cm 3 , reached a thermal conductivity of as high as 26.94 W/m·K and a thermal impedance of as low as 0.42 K·cm 2 /W, along with exhibiting a good shape-stability. More significantly, when employed into a simulative desktop CPU cooling system, this thermal pad exhibited 36.78 % higher cooling efficiency under the forced air convection, extended ten times in the time for the chip to reach the upper limit temperature (100 ℃) under the natural air cooling, and benefited to the chip to fight with the pulse-type instantaneous thermal shock, as compared to the commercial thermal pad. These excellent characteristics and good heat dissipation performance make the low melting point alloy/expanded graphite composite thermal pad show great potential for use in chip thermal management systems.
研究领域:
材料科学
·
热管理技术
✓ 已验证
产品关联
DOI
高影响因子
SURFACE & COATINGS TECHNOLOGY
·
2024
·
IF 5.3
Guangyin Liu,Yuhui Zhang,Chaofan Ma,Qin Tang,Hanbing Li,Shiqi Chen,Jun Shen
The gallium (Ga) base liquid metal (LM) with high thermal conductivity and deformability is applied widely in thermal management in electrical systems. However, Ga readily reacts with Cu to form intermetallic compounds (IMCs), which can cause failure in electronic devices. Herein, the thermal interface material (TIM) with Ga and diamond is prepared to analyze the reaction behavior of TIM and Cu/Ni-plated Cu under an aging test at 125 °C. The results show that Ga reacts with Cu substrate and forms CuGa 2 bulk. Moreover, Ni coating can inhibit the corrosion of Ga and Cu. However, the as-volcano IMC structures were generated, also. The thermal resistance increased from 2.24 mm 2 ·K·W −1 to 14.47 mm 2 ·K·W −1 from initial time to 200 h. The interfacial corrosion behavior between TIM and Cu substrate is studied by first-principles molecular dynamics simulation. The diffusion coefficient in the z direction of Cu is 0.04 × 10 −5 cm 2 /s. In a word, the work could provide the guidelines for the further design of high-performance corrosion resistance in the region where Ga was used for thermal management on electronic products.
研究领域:
材料科学
·
热管理
·
电子器件
✓ 已验证
产品关联
DOI
高影响因子
Advanced Materials Interfaces
·
2019
·Vol. 6
·期 17
·1900787
·
IF 4.713
Huayuan Li,Yuan Gao,Pengli Zhu,Xiaomeng Du,Xuecheng Yu,Longquan Ma,Gang Li,Rong Sun,Ching-Ping Wong
Efficient heat dissipation becomes increasingly important for high power density devices. 2D layered material hexagonal (BN) has gained extensive attention due to its superior heat conduction performance. However, phonon scattering within the polymer composites makes it fail to reach the full potential of BN. In this work, a cationic polyelectrolyte namely branched polyethyleneimine (PEI) is utilized to building bridged structure between BN and poly(vinyl alcohol) (PVA) polymer. The PEI on the BN surface can help to restrict the agglomeration of the fillers to achieve more uniform distribution then building more effective thermal conductive channels. When filled with BN@PEI particles at the loading of 50 vol%, the thermal conductivity is increased to 14.22 W m −1 K −1 . The ultrahigh of thermal conductivity is mainly attributed to this linear polyelectrolyte bridged molecular which can be acted as a phonon transfer pathway between BN and PVA matrix and lead to the remarkably decrease of interface thermal resistance. In addition, mechanical performance of the BN@PEI/PVA composites is also attributed to the enhanced interfacial affinity between filler and polymer matrix. This work provides an effective universal strategy to design polymer composites to improve the efficiency of heat dissipation in next-generation high power products.
研究领域:
材料科学
·
热管理工程
✓ 已验证
产品关联
DOI
高影响因子
Journal of Materials Chemistry C
·
2021
·Vol. 9
·期 22
·7127-7141
·
IF 7.393
Shuaishuai Cheng,Xiaoyuan Duan,Xiaoqing Liu,Zhiyi Zhang,Dong An,Guizhe Zhao,Yaqing Liu
With the development of electronic devices, it is becoming increasingly important for thermal interface materials (TIMs) to efficiently and quickly remove the heat generated. However, due to the high thermal resistance of the interface between fillers as well as filler and matrix, this seriously affects the transfer of phonons at the interface. Herein, silicon carbide nanowires (SiCnw) were bonded to rubber with a strong interaction force by grafting small molecular functional groups on the surface of SiCnw, which could serve as a phonon expressway. Secondly, a three-dimensional (3D) functional SiCnw/natural rubber (3D f-SiCnw/NR) TIM with a highly oriented and interconnected thermal conductive network was successfully prepared through the freeze-casting method. The thermal conductivity of the composites could reach 0.856 W m−1 K−1 when the filler content was 8.89 vol%. Meanwhile, the excellent heat transfer ability, wonderful electrical insulation performance and good mechanical properties provided better reliability for the application of f-SiCnw/NR composites in thermal management. It is more valuable that this strategy provides a powerful way to prepare high performance rubber-based thermal-management materials.
研究领域:
材料科学
·
热管理技术
✓ 已验证
DOI
高影响因子
Materials
·
2024
·Vol. 17
·期 3
·649
·
IF 3.1
Wei Lin,Chang Yu,Chang Sun,Baokai Wang,Mengyang Niu,Mengyi Li,Weiwei Xuan,Qi Wang
With the miniaturization and high integration of electronic devices, high-performance thermally conductive composites have received increasing attention. The construction of hierarchical structures is an effective strategy to reduce interfacial thermal resistance and enhance composite thermal conductivity. In this study, by decorating carbon fibers (CF) with needle-like ZnO nanowires, hierarchical hybrid fillers (CF@ZnO) were rationally designed and synthesized using the hydrothermal method, which was further used to construct oriented aligned filler networks via the simple freeze-casting process. Subsequently, epoxy (EP)-based composites were prepared using the vacuum impregnation method. Compared with the pure CF, the CF@ZnO hybrid fillers led to a significant increase in thermal conductivity, which was mainly due to the fact that the ZnO nanowires could act as bridging links between CF to increase more thermally conductive pathways, which in turn reduced interfacial thermal resistance. In addition, the introduction of CF@ZnO fillers was also beneficial in improving the thermal stability of the EP-based composites, which was favorable for practical thermal management applications.
研究领域:
材料科学
·
热管理技术
✓ 已验证
产品关联
DOI
PubMed
高影响因子
APPLIED THERMAL ENGINEERING
·
2023
·
IF 6.4
Li Chen,Liang Wang,Yifei Wang,Haisheng Chen,Peng Hu,Xipeng Lin
In recent decades, unconstrained melting processes with high heat-transfer rates have attracted significant interest. This study provides an in-depth investigation of the characteristics and mechanisms of two unconstrained melting phenomena (contact melting and float melting modes) of n-eicosane inside a sphere subjected to a non-isothermal wall temperature. The effects of the heating time, initial temperature, and heating temperature are studied using an improved image processing method . Quantitative and qualitative comparisons with the two melting modes demonstrate that contact melting within the sphere occurs at a higher rate (up to 2.97%) than float melting. This is because of the long-term contact state of the solid phase change material (PCM) and low thermal resistance across the bottom thin liquid PCM layer. A float melting phenomenon occurs during the melting process is a random event depending on whether the solid PCM can reach the state of force equilibrium during the initial unconstrained melting process. Due to the free motion of the solid PCM and random movement of the floating bubbles, the probability of occurrence of the contact melting mode is greater than that of the float melting mode with a maximum probability of only 46.66%. Finally, dimensional analysis of the experimental data was performed and presented with an overall uncertainty below 15%. The findings can contribute to a better understanding of the float melting and spark the interest of more researchers to further explore the unconstrained melting process.
研究领域:
热物理学
·
材料科学
✓ 已验证
产品关联
DOI
高影响因子
JOURNAL OF POLYMER ENGINEERING
·
2022
·Vol. 42
·期 6
·544-553
·
IF 1.624
Chaoyu Wang,Junqi Shen,Zhi Hao,Zhu Luo,Zong Shen,Xiaolong Li,Le Yang,Qin Zhou
Insulating materials with heat dissipation are urgently required for modern electronic devices and systems. In this study, 4,4-methylene diphenyl diisocyanate was used as the coupling agent, and nano-diamond (ND) particles were grafted onto the surface of carbon fibers (CFs) to prepare CF-ND/silicone rubber (SR) composites. The ND acted as a “bridge” among CFs, which can reduce the interface thermal resistance between CFs because the dot-like ND can increase the interfacial area of CFs, making it easier to form heat-conducting networks between SR. When the content of CF-ND (1:6) was 20%, the thermal conductivity of the SR composite was 0.305 W/(m·K), 69% higher than that of pure SR. The ND between CFs can improve the dynamic mechanical properties by acting as a crack pinhole. In addition, the CF-ND/SR composites also exhibited excellent thermal stability. This work has enormous potential for advanced electronic devices.
研究领域:
材料科学
·
电子工程
✓ 已验证
DOI
高影响因子
危险品化学品经营许可证（带存储）