CERAMICS INTERNATIONAL
·
2023
·
IF 5.2
Wenxia Sima,Wenlong Pang,Potao Sun,Tao Yuan,Ming Yang,Zhaoping Li,Hefei Wang
Epoxy-based composites with high insulation and thermal conductivity are desirable materials for electronic and electrical applications. However, resolving the tradeoff between insulation and thermal conductivity remains challenging. Based on the functional requirement, we designed and fabricated a cactus-like double-oriented epoxy composite by combining magnetic orientation and ice-templated methods. Semiconducting SiC endowed the composite with field-grading characteristics, thus relieving local electric field stress along the horizontal direction, while BN with high thermal conductivity promoted heat dissipation along the vertical direction. The composite exhibited its highest performance with 15 vol% filler, improving the breakdown voltage and thermal conductivity by 43.7% and 1312% compared with pure epoxy, respectively, outperforming recently developed packaging materials. It is believed that this work offers an efficient strategy for the fabrication of the filler structure and provides insights on the simultaneous enhancement in insulation and thermal conductivity of polymer composites .
研究领域:
材料科学
·
电子工程
✓ 已验证
产品关联
DOI
高影响因子
POLYMER COMPOSITES
·
2021
·Vol. 43
·期 1
·84-93
·
IF 3.171
Jiaming Guo,Tingtian Qiu,Chengxingzi Yu,Yu Liu,Chen Ning,Lingqiang Kong,Yan Ma,Liu Liu,Yuhui Ao
An unprecedented electrostatic self-assembly of MXene and SiO 2 on carbon fiber (CF) to enhance the interfacial properties of CF-reinforced epoxy resin composites is disclosed. MXene with negative charge was anchored on the cationized CF surface via a strong electrostatic interaction, followed by synergistic effect of amine-modified SiO 2 (positive charge) to furnish a stable MXene/SiO 2 material with three-dimensional structure, which takes the advantages of high modulus, large specific surface area, and high-surface activity. The involvement of the two nano-materials with different dimensions and morphologies results in synergistic enhancement on mechanical interlocking, leading to excellent chemical bonding connection between CF and resin, which could transfer stress and dissipate energy effectively. Moreover, the surface energy of CF increased from 26.67 to 48.12 mJ/m 2 after assembly of MXene/SiO 2 . Compared with unsized CF/EP composites, the interfacial shear strength, interlaminar shear strength, and flexural strength of CF/MXene/SiO 2 /epoxy (EP) composites were increased by 73.2%, 61.2%, and 39.2%, respectively. Dynamic mechanical analysis poxy (DMA) tests showed that the storage modulus of the CF/MXene/SiO 2 /EP composites was enhanced by 64% compared with CF/EP composites, and the glass-transition temperature of composites was elevated from 147.9 to 151.8°C. This protocol provides a promising strategy for designing advanced CF/EP composites with three-dimensional structure.
研究领域:
材料科学
·
复合材料工程
✓ 已验证
产品关联
DOI
高影响因子
Materials
·
2021
·Vol. 14
·期 8
·2013
·
IF 3.623
Zhong Wu,Jingyun Chen,Qifeng Li,Da-Hai Xia,Yida Deng,Yiwen Zhang,Zhenbo Qin
By modifying the bonding of graphene (GR) and Fe3O4, a stable structure of GR-Fe3O4, namely magnetic GR, was obtained. Under the induction of a magnetic field, it can be orientated in an epoxy resin (EP) matrix, thus preparing EP/GR-Fe3O4composites. The effects of the content of GR and the degree of orientation on the thermal conductivity of the composites were investigated, and the most suitable Fe3O4load on GR was obtained. When the mass ratio of GR and Fe3O4was 2:1, the thermal conductivity could be increased by 54.8% compared with that of pure EP. Meanwhile, EP/GR-Fe3O4composites had a better thermal stability, dynamic thermomechanical properties, and excellent electrical insulation properties, which can meet the requirements of electronic packaging materials.Keywords:magnetic GR;EP/GR-Fe3O4composites;orientation;thermal conductivity
研究领域:
材料科学
·
热物理学
✓ 已验证
产品关联
DOI
PubMed
高影响因子
Materials
·
2023
·Vol. 16
·期 10
·3825
·
IF 3.4
Wei Zhang,Mingfeng Dai,Xin Liang,Xi Wang,Wei Wei,Zuowan Zhou
The problem of interfacial interaction between carbon fiber (CF) and the matrix is the key to the failure of CF-reinforced plastic (CFRP). A general strategy to enhance interfacial connections is to create covalent bonds between the components, but this usually reduces the toughness of the composite material, which in turn limits the range of applications of the composite. In this study, carbon nanotubes (CNTs) were grafted onto the CF surface using the molecular layer bridging effect of the dual coupling agent to prepare multi-scale reinforcements, which significantly improved the roughness and chemical activity of the CF surface. By introducing a transition layer structure between the carbon fibers and the epoxy resin matrix to moderate the large modulus and scale differences between them, the interfacial interaction was improved while enhancing the strength and toughness of CFRP. We used amine-cured bisphenol A-based epoxy resin (E44) as the matrix resin and prepared the composites by the hand-paste method and performed tensile tests on the prepared composites, which showed that, compared with the original CF-reinforced composites, the modified composites showed an increase in tensile strength, Young’s modulus and elongation at break by 40.5%, 66.3% and 41.9%, respectively.Keywords:carbon fiber;coupling agent;CNTs;epoxy composites
研究领域:
材料科学
·
复合材料工程
✓ 已验证
产品关联
DOI
PubMed
高影响因子
POLYMER COMPOSITES
·
2024
·
IF 4.8
Zhiqiang Xia,Ruxi Dai,Rui Wang,Jianhong Gao,Bo Qu,Shaoyun Chen,Cuifang Cai,Dongxian Zhuo
There are increasing need for the development of electromagnetic wave-absorbing materials since the growing concern about electromagnetic interference. However, materials with integrated structure and function are difficult to attain due to the high content of functional fillers. In this paper, carbon nanotubes (CNTs) were formed into a three-dimensional porous framework, known as Buckypaper (BP), which was subsequently in situ deposited with iron tetraoxide (Fe 3 O 4 ) through the sol–gel method and incorporated into epoxy resin to create Fe 3 O 4 /BP/EP composites by hot pressing. The three-dimensional porous structure of Fe 3 O 4 /BP facilitates the high-content incorporation and uniform dispersion of CNTs and Fe 3 O 4 nanoparticles. The results indicate that the 33%Fe 3 O 4 /BP/EP composite achieved an optimal reflection loss of −38.41 dB and an absorption bandwidth of 3.28 GHz at the optimal matching thickness of 1.5 mm. This performance primarily stems from Fe 3 O 4 adjusting the impedance matching of BP and enhancing the magnetic loss capability of CNTs. Furthermore, the deposition of Fe 3 O 4 on BP improves the mechanical strength of BP/EP, The 17% Fe 3 O 4 /BP/EP composite achieves a tensile strength of 35.09 MPa, which is 46.27% higher than that of BP/EP and 92.38% higher than pure EP. Highlights Fe 3 O 4 /BP was prepared by deposition of Fe 3 O 4 onto surfaces of the CNTs framework. Fe 3 O 4 /BP/EP composites with different Fe 3 O 4 /BP were fabricated. Fe 3 O 4 adjusts impedance matching of BP, and forms heterogeneous interfaces. Fe 3 O 4 /BP/EP composites exhibit excellent wave absorption performance. Fe 3 O 4 /BP/EP composites possess improved mechanical properties.
研究领域:
材料科学
·
电磁学
✓ 已验证
产品关联
DOI
高影响因子
COMPOSITES COMMUNICATIONS
·
2025
·
IF 7.7
Qinghe Shi,Kang Jin,Yuxuan Zhang,Hongyan Xia
Fiber-reinforced resin matrix composites are widely used in organic printed circuit boards (PCBs). However, conventional glass fiber reinforced epoxy resin (EP) matrix composites suffer from low thermal conductivity and poor electrical properties. Herein, to coordinate the thermal and electrical properties of the composites, a novel c-BN/EP/Si 3 N 4 composite for PCBs was prepared by hot-pressing moulding method by selecting Si 3 N 4 fibers instead of glass fibers and introducing nano cubic boron nitride (c-BN) particles as filler at the same time. Combined with Si 3 N 4 fibers, nano c-BN filler with suitable content can further improve thermal transfer capacity and limit the volume shrinkage of EP during curing, resulting in the decreased porosity and strong interfacial bonding between Si 3 N 4 fibers and EP. When c-BN content is 20 wt%, the c-BN/EP/Si 3 N 4 composite shows excellent in-plane thermal conductivity (2.124 W m −1 K −1 ), low coefficient of thermal expansion (4.34 ppm K −1 ) and excellent breakdown strength (55.71 kV mm −1 ). Therefore, the c-BN/EP/Si 3 N 4 composites have a potential application in the field of organic PCBs substrates.
研究领域:
材料科学
·
电子工程
✓ 已验证
产品关联
DOI
高影响因子
JOURNAL OF APPLIED POLYMER SCIENCE
·
2014
·Vol. 131
·期 20
·
IF 1.64
Ziqian Li,Rongjie Yang
A novel polyhedral oligomeric octadiphenylsulfonylsilsesquioxane (ODPSS) was synthesized from octaphenylsilsesquioxane and benzenesulfonyl chloride via a Friedel–Crafts reaction with a high yield. ODPSS was identified by Fourier transform infrared spectroscopy, 1 H-NMR, 13 C-NMR, 29 Si-NMR, matrix-assisted laser desorption/ionization time-of-flight mass spectrometry (MALDI–TOF MS), wide-angle X-ray diffraction, and elemental analysis to be a kind of polyhedral oligomeric silsesquioxane of a T 8 R 8 structure. ODPSS exhibited superior thermal stability according to thermogravimetric analysis. Its initial thermal decomposition temperature ( T onset ) was at 491°C in air and 515°C in nitrogen. Thermal and mechanical properties of epoxy resin (EP) composites with ODPSS added were studied by differential scanning calorimetry and tensile testing. The results show that the incorporation of ODPSS at a low loading content not only improved the glass-transition temperature of the EP composites but also enhanced their tensile strength. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131 , 40892.
研究领域:
材料科学
·
化学工程
✓ 已验证
产品关联
DOI
高影响因子
High Voltage
·
2024
·
IF 4.4
Yunxiao Zhang,Wenxin Lin,Yuanxiang Zhou,Weiwei Xing,Jiayu Cheng,Chenyuan Teng
Electrical tree degradation is one of the main causes of insulation failure in high-frequency transformers. Electrical tree degradation is studied on pure epoxy resin (EP) and MgO/EP composites at frequencies ranging from 50 Hz to 130 kHz. The results show that the tree initiation voltage of EP decreases, while the growth rate and the expansion coefficient increase with frequency. Moreover, the bubble phenomenon at high frequencies in EP composites is discussed. Combined with trap distribution characteristics within the material, the intrinsic mechanism of epoxy composites to inhibit the growth of the electrical tree at different frequencies is discussed. It can be concluded that more deep traps and blocking effect are introduced by doping nano-MgO into EP bulks, which can improve the electrical tree resistance performance of EP composites in a wide frequency range.
研究领域:
电气工程
·
材料科学
✓ 已验证
产品关联
DOI
高影响因子
ACS Applied Nano Materials
·
2024
·
IF 5.3
Jing Peng,Wei Xia,Lifen Su,Yang Zhou,Ru Xia,Bin Wu,Jiasheng Qian,Lei Miao
Polymer thermally conductive composites have emerged as ideal materials to address the issue of heat accumulation in various electrical devices. However, the practical application of thermally conductive composites often requires low filler content with multifunctional properties to meet the rapid development of electronic technology. Herein, highly oriented carbon nanotubes (O-CNTs) were grown in situ on vertically aligned melem skeletons by ice templating and high-temperature catalytic methods. The ordered CNTs were constructed by a cross-linking network in the matrix of epoxy (EP) for efficient heat transport pathways. The oriented O-CNTs/EP composite exhibits outstanding out-of-plane and in-plane thermal conductivities as 2.36 and 1.20 W/(m·K) with a CNT content of 4 wt %, respectively. The O-CNTs/EP composite also shows an excellent electromagnetic shielding effect of over 30 dB in the range of 8–40 GHz. This work provides a promising strategy for the construction of high-performance composites with advanced heat dissipation in thermal management materials.
研究领域:
材料科学
·
热管理技术
✓ 已验证
产品关联
DOI
高影响因子
JOURNAL OF MATERIALS SCIENCE
·
2022
·Vol. 57
·期 25
·11698-11713
·
IF 4.682
Yuan Weichao,Li Weizhen,Zhu Shuangbao,Chu Zhongyang,Gan Wenjun
A facile and effective method has been developed to prepare highly thermal conductive composites with three-dimensional boron nitride (BN) network based on epoxy spheres (ESs). ESs synthesized and coated with f BN (ESs@ f BN) were added into epoxy matrix to construct networks. The formation mechanism of ESs morphology and properties of composites with different content of ESs@ f BN were investigated. The thermal conductivity of the composites was enhanced from 0.18 W m −1 K −1 of neat epoxy to 0.67 W m −1 K −1 of composite with only 7.4 wt% f BN . A 272% increment is attributed to the occupation of ESs, which can facilitate to form effective heat dissipating paths at low content of filler and improve the thermal conductivity of the composites. Moreover, the addition of reactive ESs and f BN could lead to an increase in storage modulus and T g of epoxy resin. This method will give a new consideration for the preparation of thermally conductive composites.
研究领域:
材料科学
·
热传导工程
✓ 已验证
DOI
高影响因子
Materials Research Express
·
2025
·Vol. 12
·期 2
·025305
·
IF 2.2
Guangyuan Yang,Jing Che,Xiaokang Zhao,Congxin Chen,Sanwen Peng,Heng Yang,Bin Zhang
The increasing complexity of electromagnetic environments demands the development of advanced absorbers with superior performance. In this study, a novel magnetic Fe3O4-modified graphene-based absorber (FARGO) is synthesized via an in situ reduction process using polyether amine. The resulting FARGO composite exhibits excellent microwave absorption properties. When the filling content of FARGO is 5 wt% in epoxy resin, the optimal reflection loss is −23.12 dB with a thickness of 4 mm and a broad absorption bandwidth of 5.6 GHz can be achieved as the thickness changes to 2 mm. Polyether amine efficiently reduces GO to rGO, significantly improving electrical conductivity. Simultaneously, it grafts amine groups onto the graphene surface, enhancing dispersion and reactivity within the epoxy resin matrix. These synergistic effects make it a promising candidate for high-performance microwave absorbing materials.
研究领域:
材料科学
·
电磁学
✓ 已验证
产品关联
DOI
高影响因子
European Physical Journal-Special Topics
·
2025
·
IF 2.3
Xiang Yue,Miao Zhicong,Wu Zhixiong,Liu Huiming,Huang Chuanjun,Yang Zengchao,Li Jiangtao,Huang Rongjin,Li Laifeng
The packaging structure with efficient heat conduction and dissipation is the key to ensuring rapid cooling and heat dissipation for superconducting magnets. However, as the most common encapsulated adhesive, epoxy resin has an extremely low thermal conductivity at low temperatures (< 0.1 W/(m·K) at 77 K), which can no longer meet the demands of future superconducting technology. In this work, a high-thermal-conductivity dielectric epoxy composite was obtained by using binary fillers consisting of α- and β-silicon nitride (Si 3 N 4 ) as a reinforcement. Compared to the unitary filler system, the binary filler system can generate a more efficient thermal conduction pathway inside the composites. The results demonstrated that at a binary filler content of 60 wt%, the Si 3 N 4 -2/EP composite (α-Si 3 N 4 : β-Si 3 N 4 = 2: 8) exhibited a 687.8% increase in thermal conductivity at room temperature (RT) and a 3266% increase at low temperature (77 K) compared to neat epoxy. Over the temperature range of 77–293 K, the Si 3 N 4 -2/EP composite exhibited an average coefficient of thermal expansion (CTE) as low as 14.1 × 10 –6 ·K −1 , which was reduced by 63%. This work provides a promising strategy for obtaining high thermal conductivity encapsulation materials for superconducting magnets.
研究领域:
材料科学
·
物理学
✓ 已验证
DOI
高影响因子
危险品化学品经营许可证（带存储）