Materials
·
2021
·Vol. 14
·期 15
·4233
·
IF 3.623
Guodong Meng,Yimeng Li,Zhengdong Wang,Cheng Pan,Wenwu Gao,Yonghong Cheng
Polymethylsilsesquioxane (PMSQ) has become a kind of widely studied filler used in the electronic circuit board substrates due to its organic–inorganic hybrid structure, low dielectric constant, and good thermal stability, among other factors. Herein, the PMSQ microspheres were prepared by a two-step acid–base-catalyzed sol–gel method; the influences of reaction conditions including the ratio of water/methyltrimethoxysilane (MTMS), reaction temperature, concentration of the catalyst, and stirring time were systematically investigated; and the optimized reaction condition was then obtained towards a narrow particle size distribution and good sphericity. The microstructure of PMSQ microspheres was analyzed by the infrared spectrum and X-ray diffraction (XRD), which indicated that the as-prepared PMSQ had a ladder-dominant structure. The thermogravimetric analysis (TGA) demonstrated an excellent thermal stability of as-prepared PMSQ microspheres. More specifically, the dielectric constants at high frequency (1~20 GHz) of as-prepared PMSQ microspheres were measured to be about 3.7, which turned out a lower dielectric constant compared to SiO2powder (≈4.0). This study paves the way to further improve the performance of the electronic circuit board substrates for the application of high-frequency electronic packaging.
研究领域:
材料科学
·
电子工程
✓ 已验证
DOI
高影响因子
CERAMICS INTERNATIONAL
·
2020
·
IF 3.83
Shuai Gao,Zongliang Nan,Yi Li,Nan Zhao,Qinqin Liu,Guifang Xu,Xiaonong Cheng,Juan Yang
Reducing thermal expansion and improving thermal conductivity of copper based materials are particularly important for improving thermal stability of electronic packaging materials. Herein, Cu/Sc 2 W 3 O 12 /SiC composite with a moderate coefficient of thermal expansion (CTE) of 8.28 ppm/K and a high thermal conductivity of 287.2 W/m⋅K was successfully prepared by partial replacement of Sc 2 W 3 O 12 by the nano SiC particles to compensate sacrificial thermal conductivity of the reported Cu/Sc 2 W 3 O 12 composites using a hot-pressing method. Theoretical calculation and Ashby plot map suggests that this Cu/Sc 2 W 3 O 12 /SiC composite facilitate the best combination between tunable thermal expansion and high thermal conductivity , which may due to that SiC nanoparticles can strengthen the driving force of vacuum hot-pressing sintering and thus lead to more homogeneous microstructure accounting for improved thermal reliability. This work can provide useful insights into the design and synthesis of composites used as packaging material for various semiconductors.
研究领域:
材料科学
·
电子工程
✓ 已验证
DOI
高影响因子
INDUSTRIAL & ENGINEERING CHEMISTRY RESEARCH
·
2022
·
IF 4.326
Xiaohan Li,Yanglong Zhou,Ying Bao,Wei Wei,Xiaoma Fei,Xiaojie Li,Xiaoya Liu
Development of a new packaging material with superior high-temperature stability is becoming increasingly crucial in high-power and high-density electronics industry. In this study, we employed bis(3-ethyl-5-methyl-4-maleimidephenyl)methane (BMI), para-xylene phenolic resin (PF), and triphenylmethane novolac epoxy resin (EP) as matrix resins to develop high-temperature-stable BPE ternary resin molding compounds for power device packaging. BMI was first melt-blended with PF to obtain the premix with a reduced softening point for meeting the requirement of melt-kneading process. 2-Ethyl-4-methylimidazole with a dosage of 2 wt % of the ternary resins, could effectively promote the curing reaction, making the molding process of BPE molding compounds be compatible with that of the existing epoxy molding compounds (EMC). The introduction of BMI component could enhance the chain rigidity and heat resistance of cured resins. When the BMI content was more than 70 wt % of the ternary resins, the cured BPE molding compounds exhibited the glass transition temperature and initial decomposing temperature larger than 250 and 400 °C, respectively, indicating a much superior thermal performance to that of the cured EMC. Moreover, the flexural performance and the adhesion strength with copper at 260 °C, high-temperature aging resistance, dielectric properties, and thermal conductivity of the cured BPE molding compounds were also improved compared with those of the cured EMC. This study provides a promising strategy for preparing heat-resistant electronic packaging molding compounds.
研究领域:
材料科学
·
高分子化学
✓ 已验证
DOI
高影响因子
Journal of Macromolecular Science Part B-Physics
·
2024
·
IF 1.2
Rongjun Yi,Jiexi Ke,Jianwen Zhou,Hong Wang
The continuous integration and refinement of electronic equipment results in the more stringent requirements for epoxy resin (EP) based materials, such as excellent heat dissipation and low coefficient of thermal expansion (CTE). In order to improve the dispersion of silica powder (SP) in EP and thus expand the application of EP in the field of electronic packaging, our research described in this paper adopted the KH-550 coupling agent to modify the surface of SP (m-SP). The effects of KH-550 coupling agent on the characteristics of the composites were investigated in terms of thermal, rheological, electrical insulation and mechanical properties. The results showed that when the content of KH-550 was 2 wt% of the fillers, the best modification effect was achieved, and the surface properties of the fillers were changed accordingly. In particular, the materials filled with m-SP exhibited lower viscosity end, better mechanical and electrical insulation properties. It was also found that the adding of the KH-550 had different effects on the thermal degradation, dynamic thermo-mechanical properties and the thermal deformation behavior of the materials. According to our study, the thermal conductivity and the CTE of m-SP/EP filled with 70 wt% of modified fillers were 0.787 W/m.K and 28.3 ppm/°C respectively, corresponding to a significant thermal conductivity improvement and low CTE.
研究领域:
材料科学
·
高分子科学
·
电子封装
·
热管理
·
复合材料
✓ 已验证
DOI
高影响因子
HIGH PERFORMANCE POLYMERS
·
2024
·
IF 1.8
Han Zhao,Jianxin Rong,Dengke Li,Dianqiu Jia,Xiaoyan Yu,Qingxin Zhang
As the electronic industry develops rapidly, the miniaturisation, integration and multifunctionality of electronic devices have resulted in a dramatic increase in power density, and the heat dispersal of electronic devices has attracted much attention. In this work, hydroxylated hexagonal boron nitride (BN-H) was obtained by hot alkali treatment, and boron nitride nanosheets (BNNS) with a thickness of about 4 nm were obtained by boric acid-assisted ball milling stripping. The effects of different types of fillers as well as filler contents on the thermally conductive and mechanical performance of organosilicon composites were also compared. Notably, when BN-H and BNNS thermally conductive fillers were added at 12 wt%, the thermally conductive coefficients of the composites were 0.4831 W·m−1·K−1 and 0.7131 W·m−1 K−1, respectively, which were 183% and 318% of higher than that for the pure silicone rubber (SR, with a thermally conductive coefficient of 0.1706 W·m−1·K−1). In addition, in respect of mechanical performance, the tensile strengths of SR/BN-H and SR/BNNS composites with a filling level of 12 wt% were 3.59 MPa and 3.89 MPa, respectively, and the storage moduli were 4501 MPa and 4583 MPa, respectively, which were improved to a certain extent compared with pure SR. The present work provides an effective way to develop organosilicone rubber composites with good thermal conductivity and mechanical properties by boric acid assisted ball milling to strip boron nitride in the field of electronics packages.
研究领域:
材料科学
·
电子封装
✓ 已验证
DOI
高影响因子
CHEMICAL ENGINEERING JOURNAL
·
2019
·
IF 8.355
Jiake Ma,Tianyu Shang,Linlin Ren,Yimin Yao,Tao Zhang,Jinqi Xie,Baotan Zhang,Xiaoliang Zeng,Rong Sun,Jian-Bin Xu,Ching-Ping Wong
Thermal management has become one of the most important issues for electronic devices due to the continual increase in power density and consumption. Thermal interface materials (TIMs), applied between heat sources and heat sinks, are essential ingredients of thermal management. Carbon fibers are promising fillers because of its numerous advantages including high thermal conductivity , high strength-to-weight ratio, desired fatigue resistance, and corrosion resistance. However, they are rarely considered in preparing TIMs at present, because the one-dimensional structure of carbon fibers largely enhance the viscosity of the composites using conventional methods, and thus increase the complexity of processing. Herein, we report a thermally conductive TIM based on the construction of three dimensional and vertically aligned carbon fibers (3D-CFs) skeleton. The 3D-CFs skeleton is fabricated by vertical freezing the solution of CFs followed by freeze-dying to remove the ice and then infiltrating them with epoxy resin matrix. At a relatively low CFs loading of 13.0 vol%, the composites show an enhanced through-plane thermal conductivity (2.84 W m −1 K −1 ) compared to that of a neat epoxy resin (0.19 W m −1 K −1 ). Theoretical models qualitatively demonstrate that the interfacial thermal resistance is mainly originated from CFs–CFs interface not CFs–epoxy interface in oriented CFs/epoxy composites. In addition, the composites also possess a low thermal expansion coefficient (CTE) of 23.63 ppm K −1 , and an increased glass transition temperature of 222.8 °C at a relatively small CFs loading (13.0 vol%) compared to that of pure epoxy resin. Our fabrication of through-plane assembly of carbon fibers skeleton has broad application prospects in TIMs.
研究领域:
材料科学
·
热工工程
·
纳米复合材料
·
电子封装
✓ 已验证
DOI
高影响因子
ACS Applied Nano Materials
·
2020
·
IF 0
Guang Yang,Haokun Yi,Yagang Yao,Chaowei Li,Zhuo Li
The scaling-down of chip size and the increase in on-chip power density require highly efficient thermal management materials in electronic packaging. The excellent thermal conductivity and unique two-dimensional structure of graphene make it an ideal candidate for heat spreader films to alleviate the hot spots on chips. Reduction of graphene oxide (GO) films has been utilized as an effective way to achieve the large-scale production of the thermally conductive graphene films. However, this approach usually requires high-temperature annealing at 1000–3000 °C in order to achieve the high conductivity needed, which dramatically increases the energy and time consumption and thus the total cost. In this contribution, graphene films free of high-temperature treatment with an in-plane thermal conductivity up to 1102.62 W·m–1·K–1 are obtained by simple chemical reduction of GO. The high conductivity is achieved by adjusting the concentration of GO solution and mixing GO sheets with different sizes to optimize the connectivity and compactness of GO films. While the majority of previous work relies on the graphitic structure restoration by high-temperature treatment, our work demonstrates that the geometric organization of graphene sheets also plays an important role in the thermal conductivity of graphene films.
研究领域:
材料科学
·
纳米技术
·
热管理
·
电子封装
✓ 已验证
DOI
ACS Applied Polymer Materials
·
2023
·
IF 5
Shun Wang,Bin Yang,Liangyong He,Yingdong Yang,Shishuang Cui,Shuqin Liu,Pengjun Chen,Ru Xia,Jiasheng Qian,Yuchao Ke,Tao Jiang
In this study, poly(methyl methacrylate) (PMMA)/polylactic acid (PLA)/boron nitride (BN) composites were fabricated by melt blending and solution blending, respectively. When the content of BN achieved 20%, the thermal conductivities of both in-plane and out-of-plane were found to increase considerably by 303 and 334%, respectively. Scanning electron microscopy (SEM) observations substantiated that a thermal conduction path could be in situ established at a filler content of 20% in the composites prepared by solution blending, which was earlier than that established in the composites prepared by melt blending. Analysis based on the results of both transmission electron microscopy (TEM) and SEM after a selective etching of the composites proved that BN was selectively distributed in the PLA phase, making it possible to prepare composites with greatly enhanced thermal conductivity (TC) via altering the mixing order of preparing the route. More importantly, our findings suggested that there exists a direct scaling between mechanical properties and TC, which could clearly be expressed by a linear master curve. The present work will provide insight into the industrial manufacturing of PMMA/PLA/BN composites, which could be potentially applicable in electronic devices, e.g., 2.4G/5G routers, notebook keyboards, etc.
研究领域:
材料科学
·
聚合物复合材料
·
热管理
·
纳米材料
·
电子封装
✓ 已验证
DOI
高影响因子
POLYMER COMPOSITES
·
2023
·Vol. 44
·期 9
·6136-6148
·
IF 5.2
Mu-yuan Song,Chuan-guo Ma,Xiao-lei Li,Hong-tao Chi,Ping Zhang,Pei-bang Dai
The accumulation of heat in electronic devices puts forward an urgent demand for thermal interface materials. It is still a great challenge to achieve the good comprehensive performance of high thermal conductivity (TC), insulation, flexibility and tensile strength. In this work, polyester-based nonwoven fabric (NWF) was coated with boron nitride nanosheets (BNNS) by dispersion and interfacial reinforcement of cellulose nanofibers to obtain a three-dimensional thermally conductive network skeleton (BNNS@NWF). The sandwich-structured composite film was assembled by introducing alumina (Al 2 O 3 )/polydimethylsiloxane (PDMS) layers on the top and bottom surfaces of BNNS@NWF using scratch coating and hot pressing processes. The composite film has a high TC of 6.42 W/mK at 45.8 wt% BNNS content, and has excellent insulation with a volume resistivity of 1.06 × 10 15 Ω cm. This is due to the long-range effective thermal conduction path constructed by BNNS, the bridging effect of Al 2 O 3 and the synergistic effect of the two fillers. PDMS helps the composite film maintain good flexibility and good TC stability after 30 bending cycles. The PET nonwoven interlayer gives the composite film good mechanical properties with a tensile strength of 17.5 MPa. This work provides a strategy for the efficient preparation of flexible composite films with high TC and insulation properties, which is of great importance for the development of innovative thermal interface materials. Highlights A sandwich-structured composite film was prepared by a simple scale-up method. Al 2 O 3 and BNNS achieves synergistic enhancement of thermal conductivity. The film has a high thermal conductivity of 6.42 W/mK and electrical insulation. The film shows good flexibility, high tensile and thermal management properties.
研究领域:
材料科学
·
热管理
·
聚合物复合材料
·
电子封装
·
纳米材料
✓ 已验证
DOI
高影响因子
JOURNAL OF ELECTRONIC MATERIALS
·
2017
·Vol. 47
·期 1
·96-102
·
IF 1.579
Wang Yan,Han Jing,Wang Yishu,Ma Limin,Guo Fu
With a body-centered tetragonal crystal structure, Sn grains were demonstrated to have highly anisotropic behaviors in various properties. The electromigration behavior of lead-free solder was impacted by the grain orientations. In this paper, the angle between the c -axis and the electron flow direction in composite solder joints (angle θ ) was proven to be an important factor during electromigration. The effects of angle θ on the electromigration of composite solder joints were investigated in this paper. Cu particle-reinforced Sn3.5Ag solder joints were stressed under a current density of 10 4 A/cm 2 at room temperature. After 336 h current stressing time, different electromigration phenomena occurred at the two sides of the grain boundary in the composite solder joint which contained two Sn grains with different angle θ . The Sn grains with the larger angle θ had a smaller growth rate of Cu 6 Sn 5 . In addition, a composite solder joint with a single Sn grain was set as the contrast and its angle θ was smaller than that of the composite solder joint with two Sn grains. The growth rate of Cu 6 Sn 5 in the composite solder joint with a single grain was faster than that of the composite solder joint with two Sn grains.
研究领域:
材料科学
·
电子封装
·
可靠性工程
·
金属间化合物
✓ 已验证
DOI
高影响因子
ACS Applied Materials & Interfaces
·
2019
·
IF 8.456
Siqi Cui,Fang Jiang,Na Song,Liyi Shi,Peng Ding
In recent years, the development and wide application of micro-electronic technology brings forward high demands for active thermal management systems. However, such systems are not only costly, but also usually tethered, and need constant power to operate. To avoid such a limitation, smart thermal management systems have been developed to achieve active thermal management. Here, inspired by the temperature control principle of a butterfly, a shape memory polymer was used to endow the thermally conductive graphene–polymer hybrid film with intelligence. As the device temperature reaches 60 °C, the bud-shaped hybrid film started to bloom, which is a visually active heat dissipation process. As a result, this active process promoted the thermal management capacity of the hybrid film and increased the temperature-raising time of the light-emitting diode. Through the construction of a bilayer structure, the transmission channel for phonon transfer was optimized, which lead the hybrid film to attain a remarkable thermal conductivity of 21.83 W·m–1·K–1 with 30 wt % graphene. This graphene–polymer hybrid film shows potential application in the smart thermal management field.
研究领域:
材料科学
·
热管理
·
纳米技术
·
智能材料
·
电子封装
✓ 已验证
DOI
高影响因子
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING
·
2023
·Vol. 129
·期 6
·398
·
IF 2.7
Li Xinyi,Yang Kangli,Yuan Zhiqing,Liu Shujuan,Du Juan,Li Cancheng,Meng Shoutong
Printed circuit board (PCB) and electronic components are widely used in practical applications. However, PCB and electronic components are not waterproof. When exposed to water vapor or corrosive liquid, it is easy to make electronic equipment short circuit, thus reducing its service life in practical applications. To solve this problem, an effective and low-cost superhydrophobic coating was prepared on the PCB. First, the solution prepared by hydrophobic nano-silica (Nano-SiO 2 ) and dimethyl silicone oil (DSO) was sprayed on the PCB surface. Then, the surface was further modified with stearic acid (SA), and thus, a superhydrophobic surface with a water contact angle (WCA) of 160.24° and water sliding angle (WSA) of 3.5° was obtained. In a series of tests such as being placed under water for 10 h, at constant temperature (70 °C) and humidity (100%RH) chamber for 10 h, and outdoors for 8 months, the superhydrophobic coating on the PCB surface showed excellent water resistance. In addition, the coating had excellent stability against acid and alkali liquids, drinks, inks, etc. The coating fully solved the shortcoming of low water resistance of PCB and electronic components, and showed great potential application.
研究领域:
材料科学
·
表面工程
·
电子封装
·
纳米技术
✓ 已验证
DOI
高影响因子
危险品化学品经营许可证（带存储）