JOURNAL OF APPLIED POLYMER SCIENCE
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2023
·Vol. 140
·期 35
·e54359
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IF 3
Changhai Zhang,Zeyang Liu,Tiandong Zhang,Xubin Wang,Chao Yin,Xianli Liu,Qingguo Chi
The packaging insulation material was a crucial component to guarantee the stable and safe operation of electronic devices. Epoxy resin, one of the most popular packaging materials, was widely used as an electronic packaging material because of its good corrosion resistance and electrical insulation, low price, and easy processing and molding. However, the unsatisfied heat resistance cannot meet the requirements of the rapid development of third-generation power semiconductors, so it was meaningful to modify the epoxy resin with both excellent heat resistance and insulation. In this paper, tetrafunctional epoxy resin AG70 and phenolic epoxy resin F51 was blended in different proportions to combine their individual advantages, and the microstructure and electrical/thermal properties of epoxy resin blends had been systematically studied. The results showed that with the increase of blending ratio of AG70 with F51, both high glass transition temperature of 213.3°C and electric breakdown of 206.1 kV/mm were achieved when the blending ratio was 5:5, displaying excellent overall performances and exhibiting great application potential in electronic and microelectronic industries.
研究领域:
材料科学
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电子工程
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产品关联
DOI
高影响因子
CERAMICS INTERNATIONAL
·
2025
·
IF 5.6
Houbao Liu,Wei Wang,Zhenbang Cheng
Effective thermal management materials are crucial for modern electronics, aerospace, and energy applications. This study investigates a novel approach by constructing a Si₃N₄ skeleton with a triply periodic minimal surface (TPMS) structure and reinforcing phase change materials (PCM) with boron nitride (BN) to develop Si₃N₄@BN/PCM composites that exhibit enhanced thermal conductivity, thermal stability and electrical insulation. Utilizing digital light processing 3D printing, a Si₃N₄ TPMS structure was prepared and subsequently reinforced with BN via vacuum-assisted infiltration into PCM. The incorporation of 3D Si₃N₄ skeleton and 2D BN flakes created a dual-scale network within the PCM, significantly increasing thermal conductivity from 0.24 W/m·K to 2.04 W/m·K. The presence of Si₃N₄ and BN notably improved thermal stability and reduced the coefficient of thermal expansion. Additionally, electrical insulation properties improved with an increase in volume resistivity and breakdown strength to 5.1 × 10 1 ⁴ Ω·cm and 62.4 kV/mm, respectively. This work demonstrates that Si₃N₄@BN/PCM composites effectively integrate high thermal conductivity, stability, and electrical insulation, thereby meeting the stringent demands of thermal management applications.
研究领域:
材料科学
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热能工程
✓ 已验证
产品关联
DOI
高影响因子
COMPOSITES SCIENCE AND TECHNOLOGY
·
2019
·
IF 6.309
Liwei Zhao,Xiangrong Shi,Yue Yin,Bo Jiang,Yudong Huang
Polymer dielectric composites with excellent thermal conductivity have received increasing attention in the modern electronics industry due to their outstanding thermal management performance. However, conventional polymers used for the thermally conductive composites usually suffer from accidental mechanical failure, causing decrease in service life or loss of functionality. In this work, we prepared a self-healing silicone/BN composite simultaneous with high thermal conductivity, high self-healing efficiency and low electrical conductivity . Silicone cross-linked by DA adduct was used as polymer matrix and BN was used as thermally conductive filler . The self-healing silicone/BN composite exhibited a high self-healing efficiency of higher than 90% and an enhancement of 544% in thermal conductivity at BN content of 50 wt%. The self-healing composites presented excellent thermal management performance. The excellent self-healing properties were attributed to the thermal reversibility of the DA reaction and the flexibility of the siloxane molecules. In addition, the self-healing silicone/BN composite with 50 wt% of BN exhibited a low dielectric dissipation factor of 0.017 and an enhancement of 568% in tensile strength .
研究领域:
材料科学
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高分子化学
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电子工程
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产品关联
DOI
高影响因子
Nanomaterials
·
2019
·Vol. 9
·期 7
·1051
·
IF 4.034
Xiu Wang,Zhihuai Yu,Liang Jiao,Huiyang Bian,Weisheng Yang,Weibing Wu,Huining Xiao,Hongqi Dai
Hexagonal boron nitride (h-BN)-based heat-spreading materials have drawn considerable attention in electronic diaphragm and packaging fields because of their high thermal conductivity and desired electrical insulation properties. However, the traditional approach to fabricate thermally conductive composites usually suffers from low thermal conductivity, and cannot meet the requirement of thermal management. In this work, novel h-BN/cellulose-nano fiber (CNF) composite films with excellent thermal conductivity in through plane and electrical insulation properties are fabricated via an innovative process, i.e., the perfusion of h-BN into porous three dimensional (3D) CNF aerogel skeleton to form the h-BN thermally conductive pathways by filling the CNF aerogel voids. When at an h-BN loading of 9.51 vol %, the thermal conductivity of h-BN/CNF aerogel perfusion composite film is 1.488 W·m−1·K−1at through plane, an increase by 260.3%. The volume resistivity is 3.83 × 1014Ω·cm, superior to that of synthetic polymer materials (about 109~1013Ω·cm). Therefore, the resulting h-BN/CNF film is very promising to replace the traditional synthetic polymer materials for a broad spectrum of applications, including the field of electronics.Keywords:CNF aerogel;perfusion;h-BN;thermal conductivity;electrical insulation
研究领域:
材料科学
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电子工程
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产品关联
DOI
PubMed
高影响因子
CERAMICS INTERNATIONAL
·
2023
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IF 5.2
Wenxia Sima,Wenlong Pang,Potao Sun,Tao Yuan,Ming Yang,Zhaoping Li,Hefei Wang
Epoxy-based composites with high insulation and thermal conductivity are desirable materials for electronic and electrical applications. However, resolving the tradeoff between insulation and thermal conductivity remains challenging. Based on the functional requirement, we designed and fabricated a cactus-like double-oriented epoxy composite by combining magnetic orientation and ice-templated methods. Semiconducting SiC endowed the composite with field-grading characteristics, thus relieving local electric field stress along the horizontal direction, while BN with high thermal conductivity promoted heat dissipation along the vertical direction. The composite exhibited its highest performance with 15 vol% filler, improving the breakdown voltage and thermal conductivity by 43.7% and 1312% compared with pure epoxy, respectively, outperforming recently developed packaging materials. It is believed that this work offers an efficient strategy for the fabrication of the filler structure and provides insights on the simultaneous enhancement in insulation and thermal conductivity of polymer composites .
研究领域:
材料科学
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电子工程
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产品关联
DOI
高影响因子
DIAMOND AND RELATED MATERIALS
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2022
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IF 3.806
Wen Zhao,Meng Zhang,Huijin Li,Yao Du,Qiuxiang Bu,Lan Cao,Chengzhong Zong
An innovative bioinspired method is presented for the preparation of surface-modified nanodiamonds (ND) particles by poly(dopamine) (PDA). The process was aimed at improving the thermal conductivity and maintaining the insulating capability of silicone rubber (SiR). ND was successfully and effectively modified by dopamine in different hours, which was confirmed by HR-TEM, TGA, FTIR, and XRD . The poly(dopamine) coating on ND particles improved its interfacial interaction with silicon rubber and promoted the uniform dispersion of fillers, resulting in the ND-18/SiR composite that acquired a higher thermal conductivity (0.295 W/(m·K)) at the loading of 6 wt%, 81 % higher than that of pure silicone rubber (0.163 W/(m·K)). In addition, the composite materials still displayed an excellent insulating property with a resistance of ≈10 11 Ω·cm, which was a big advantage for thermal management.
研究领域:
材料科学
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生物仿生学
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产品关联
DOI
高影响因子
CHEMICAL ENGINEERING JOURNAL
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2023
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IF 15.1
Yuang Zhang,Ping Wu,Yao Meng,Rongwen Lu,Shufen Zhang,Bingtao Tang
With the continuous miniaturization and integration of electronic devices, electronics needs more advanced thermal management technology and materials to solve thermal failure problem. In this aspect, phase change materials (PCMs) exhibit great prospect in electronic thermal management due to its excellent temperature control properties. However, how to give PCMs high heat transfer performance and flexibility while maintaining low electrical conductivity is still a great challenge. Herein, we designed the alkylated modified carbon nanotubes (mCNTs) into the phase change polyurethane (PCPU) system. Based on the high junction resistance and thermal conductivity properties of mCNTs , PCPU/mCNTs exhibit enhanced thermal conductivities and high electrical resistance. Meanwhile, the phase change segment in polyurethane was used as soft segment, which endows it excellent flexibility, thus achieving effective contact with the applied matrix and conducive to heat transfer. The PCPU/mCNTs films are holding great potential for electronic thermal management.
研究领域:
材料科学
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热能工程
✓ 已验证
产品关联
DOI
高影响因子
JOURNAL OF VINYL & ADDITIVE TECHNOLOGY
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2023
·Vol. 29
·期 6
·991-1001
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IF 2.7
Hua Zhou,Liangdong Ye,Dongming Chen,Ziwei Li,Shanrong Li,Dacheng Li,Zhiyi Huang,Zhouqiao Wei,Shaorong Lu
Graphite is a thermally conductive filler. However, when dispersed into high density poly(ethylene) (HDPE) resin, graphite particles tend to agglomerate and requires a compatibilizer to achieve desired thermal/physical properties. In this study, oleic acid (OA), a bio-based additive and polyethylene-polyamines (PEPA) were used to synthesize a new compatibilizer, PEPA-g-OA, containing numerous NR 2 groups. The experimental results showed that PEPA-g-OA can significantly improve the compatibility between graphite particles and the HDPE matrix due to uniform dispersion of graphite in the HDPE matrix. When the graphite content was 25 wt%, the thermal conductivity of the composite recorded 1.2 W m −1 K −1 (three times that of neat HDPE) and the volume resistivity was 1.8 × 10 9 Ω cm, indicating excellent electrical insulation. Compared to the composites with no graphite content, the properties of the composites with 25 wt% graphite content exhibited narrower melting and crystallization peaks, more stable mechanical properties, and higher ultraviolet aging resistance. Synthesized new bio-based compatibilizer and thermally conductive and electrically insulating composites developed in this study can be useful in different industrial fields for the preparation of the next generation composites.
研究领域:
材料科学
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化学工程
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产品关联
DOI
高影响因子
ACS Applied Polymer Materials
·
2024
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IF 4.4
Yunjian Wu,Hui Lin,Yiran Hu,Fujin Cai,Xiaoxing Zhang
Epoxy is widely used as an insulating material for electric power and electronic equipment due to its excellent physicochemical properties and electrical performance. However, its stable 3D cross-linked structure makes it difficult to degrade and efficiently recycle. Epoxy insulation equipment is often incinerated or landfilled after decommissioning, resulting in environmental pollution and the waste of resources. Aimed at the demand of degradable epoxy insulating materials for power equipment, an epoxy with high insulation strength, low dielectric loss, and good thermal stability based on a Schiff base was designed and prepared in this paper. The vanillin and epichlorohydrin were etherized to produce an aldehyde-containing monocyclic oxide (VE), and the preparation process was optimized. After curing with a diamine curing agent at different temperatures, it was found that the content of Schiff base in epoxy first increased and then decreased with the curing temperature. The thermal, electrical, and degrading properties of epoxy vary with the Schiff base content. The maximum glass transition temperature is 121 °C, and the breakdown field strength gets its maximum of 45.4 kV mm–1, which is higher than that of conventional epoxy. The dielectric loss is comparable to that of conventional epoxy with the lowest of 5 × 10–3. Meanwhile, the epoxy can be completely degraded within 40 min in a mildly acidic environment, and the cast copper winding can be effectively recycled after degradation. This study can provide theoretical guidance for the application of degradable epoxy based on Schiff base to insulating materials in power equipment.
研究领域:
材料科学
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电气工程
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环境科学
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产品关联
DOI
高影响因子
Surfaces and Interfaces
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2024
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IF 5.7
Qiyang Guo,Ruixiang Yao,Huili Cheng,Kai Yin,Xiangrong Chen,Yaqing Lu,Ashish Paramane
The strategy of functionalized PS-NPs via PPy (PPy@PS-NPs) forming heterogeneous interface composition is highly efficient in increasing the insulation properties of linear low-density polyethylene (LLDPE). The morphology results show that PPy@PS-NPs are monodispersed in the LLDPE matrix after melting blend, which exhibits unparalleled engineering application value. The electrical insulation results show that PPy@PS-NPs introduced into the LLDPE matrix can reduce its DC electrical conductivity, enhance DC breakdown strength, and inhibit space charge accumulation. When the PPy@PS-NPs concentration is 0.5 wt%, the DC breakdown strength is 35.3 % higher than that of LLDPE. Mechanism research indicates that the depths of carrier traps are decreased due to high electron affinity caused by the introduction of PPy@PS-NPs, but the trap density is increased. The reported strategy of using functionalized polymer nanoparticles to improve the polymer insulation property provides new insights for developing future high-insulation materials and other functional materials based on functionalized polymer nanofillers.
研究领域:
材料科学
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电气工程
✓ 已验证
产品关联
DOI
高影响因子
COMPOSITES COMMUNICATIONS
·
2020
·
IF 4.915
Houbao Liu,Xinqing Su,Renli Fu,Binyong Wu,Xudong Chen
The flexible heat dissipation material with high thermal conductivity and electrical insulation is ideal for highly integrated flexible electronic devices. In this study, the flexible polymer composite films were prepared by spin coating process, the thermal conductivity and electrical insulation of the composite film are significantly enhanced by adding short carbon fibers (SCF) and boron nitride (BN) particles to PDMS matrix. SCF and BN particles construct an effective thermal conduction path in the PDMS matrix, while highly insulating BN particles inhibit the formation of conductive paths. The thermal conductivity of 15%SCF/20%BN/PDMS film achieved 2.29 W/m·K when 15 wt% SCF and 20 wt% BN were loaded, which was 990% enhancement compared to pure PDMS. And its volume electrical resistivity and breakdown strength reached 2.11 × 1014 Ω·cm and 12.5 KV/mm respectively, showing excellent electrical insulation property.
研究领域:
材料科学
·
柔性电子
✓ 已验证
产品关联
DOI
高影响因子
CHEMICAL ENGINEERING JOURNAL
·
2024
·
IF 13.3
Junyi Niu,Wenhui Yuan,Zhengguo Zhang,Xuenong Gao
Phase change materials have been widely studied for the applications in the thermal management of lithium-ion batteries. However, the complicated and high-cost pre-pressing and molding assembly processes are usually required, which makes it difficult to be industrialized. Hence, it is necessary to develop an easy-to-pour, highly thermally conductive, and electrically insulated phase change material to meet the requirements of lithium-ion battery. In this study, a pourable phase change material with high thermal conductivity and electrical insulation (PCPM) was prepared based on the electrostatic self-assembly of expanded graphite (EG) and boron nitride (BN). It was found that the volume resistivity of the PCPM could be effectively improved by coating functionalized EG (f-EG) with functionalized BN (f-BN), and when f-EG: f-BN was 1:3, the volume resistivity was increased by 6.18 times compared to that of the PCPM prepared without coating f-BN. Meanwhile, PCPM possessed a lower viscosity of 398.11 cP compared to the PCPM without f-BN, and lower viscosity results in the desired fluidity of the product as a potting material. Compared to pure polymer matrix (PUR), the thermal conductivity of the PCPM with 35 % m-EG@PA (f-EG: f-BN = 1:2) was increased by 200.4 % to 0.6011 W/(m· K). The results of the heating experiment of the simulated battery indicated that the thermal management efficiency of PCPM was significantly higher than that of PUR. At the end of the heating period, the surface temperature of the battery module with PCPM was 5.12 ℃ lower than that of the module with PUR at the end of heating, and 2.41℃ lower than that of the module with commercial high thermal conductive potting compound.
研究领域:
材料科学
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能源工程
✓ 已验证
产品关联
DOI
高影响因子
危险品化学品经营许可证（带存储）