Materials Today Communications
·
2021
·
IF 3.383
Weidong Han,Xin Qian,Hongbo Ma,Xuefei Wang,Yonggang Zhang
The nickel electroplating followed by a further copper electroplating process was conducted on high modulus carbon fibers (HMCFs), and the HMCFs were oxidized in nitric acid prior to the Ni-plating process. Effect of the electroplating process on the microstructure and mechanical properties of HMCFs was investigated. Uniform nickel particles were observed on the surfaces of Ni-plated HMCFs and fiber diameter increased from 5.0 μm to 6.1 μm. With a further Cu-electroplating process, the fiber diameter continued increasing to 7.5 μm. The Ni-plating process resulted in increased surface roughness, whereas the surface RMS and Ra values dropped significantly after the Cu-plating process. Owing to the Ni-plating treatment, the relative content of carbon element on fiber surfaces decreased from 96.54 % to 36.74 %. After a further Cu-plating process, the relative content of Cu element on HMCF surfaces was as high as 54.01 %. The electroplating process resulted in decreased tensile modulus from 415.71 GPa to 407.71 GPa. By contrast, the tensile strength of electroplated HMCFs increased by 1.1 % due to the reduction of fiber defects and stress concentration. Results also showed that both the Ni-plating and Cu-plating process could lead to significant decreases in the values of electrical resistance and resistivity.
研究领域:
材料科学
·
表面工程
✓ 已验证
DOI
高影响因子
INTERNATIONAL JOURNAL OF HYDROGEN ENERGY
·
2019
·
IF 4.084
Fanghui Wang,Yimeng Luo,Yanan Wang,Hong Zhu
In this work, a spherical spider web-like structure Ru Ni/Ni foam catalyst was prepared for hydrogen evaluation from sodium borohydride (NaBH 4 ) by a combination of electroless plating and electroplating. Microstructure, surface morphology , surface area and elemental composition of the Ru Ni/Ni foam catalyst were analyzed by X-ray Diffraction (XRD), Scanning Electron Microscopy (SEM-EDS and X-ray Photoelectron Spectroscopy (XPS), Brunauere-Emmette-Teller method (BET, AS-1C-VP), respectively. The influences of Ru Ni with different molar ratios , NaOH concentration, NaBH 4 concentration, and solution temperature on the hydrogen production rate were investigated in this paper. The results showed that the Ru Ni metals were arrayed densely and uniformly on the surface of Ni foam. The average hydrogen production rate is 360 mL min −1 g −1 in 20 wt % of NaBH 4 , 1 wt% of NaOH at 30 °C in the presence of the Ru Ni/Ni foam catalysts. The calculated activation energy was 39.96 kJ mol −1 for hydrogen production from sodium borohydride using the Ru Ni/Ni foam catalyst.
研究领域:
材料科学
·
催化化学
✓ 已验证
产品关联
DOI
高影响因子
Microfluidics and Nanofluidics
·
2015
·Vol. 19
·期 4
·829-836
·
IF 2.528
He Weiqi,Xiao Jingrong,Zhang Zhengtao,Zhang Weiying,Cao Yiping,He Rongxiang,Chen Yong
A cost-effective method that used electroplating to fabricate a 3D polydimethylsiloxane (PDMS) passive micromixer was developed in this work. The mixer fabrication process characteristics were as follows: The chip design was transferred to indium tin oxide (ITO) glass via photolithography; the ITO glass was vertically immersed in a nickel electroplating solution; and the ITO glass was raised up by controlling by the syringe pump, while electroplating was in progress. In this method, the height of the mixing structure could increase gradient from 15 to 30 μm. Compared with a flat structure, this structure could increase mixing efficiency by at least 10 %. The mixing efficiency with this 3D microstructure can reach more than 80 %. This 3D microstructure fabrication method can be easily integrated with other PDMS functional structures for future point-of-care diagnostic applications because of the advantages of this technique.
研究领域:
微流控技术
·
生物医学工程
✓ 已验证
产品关联
DOI
高影响因子
ADSORPTION SCIENCE & TECHNOLOGY
·
2020
·
IF 2.425
Qiaoling Xie,Gaojie Liang,Tao Lin,Fuming Chen,Dandan Wang,Bo Yang
A study on selective chelating precipitation of palladium metal from real electroplating wastewater using chitosan and its water-soluble derivative was conducted. The pH parameter, the concentrations of chitosan and its water-soluble derivative and the chelating precipitation time were experimentally investigated, and the optimum conditions were determined. The results revealed that both chitosan and its water-soluble derivative acted as chelating precipitation agents. Rapid chelating precipitation occurred when chitosan was added to real electroplating wastewater containing the chitosan derivative, thereby improving removal efficiency of palladium in different forms up to 95% under the optimum condition of 0.2 g/L chitosan and 0.16 mg/L derivative at pH 2.5. Then, dissolution experiments showed that chelating precipitation products could be dissolved in aqua regia. Additionally, selective chelating precipitation of palladium by chitosan and its derivative was characterized using X-ray photoelectron spectroscopy and Fourier transform infrared spectroscopy. Thus, it can be concluded that the combined utilization of chitosan and its water-soluble derivative is a promising approach method for the removal of different forms of palladium from real electroplating wastewater.
研究领域:
环境科学
·
材料科学
✓ 已验证
产品关联
DOI
高影响因子
ACS Applied Electronic Materials
·
2021
·
IF 3.314
Zhiqiang Lai,Tao Zhao,Pengli Zhu,Dan Liu,Xianwen Liang,Rong Sun
Recently, improving the reliability of silver nanowire (AgNW) has become an interesting topic for promoting working performance and service life of portable electronic devices. In this work, flexible, transparent, and highly conductive AgNW-based films are fabricated by electroplating Cu, Co, or Ni on polyethylene terephthalate. The AgNW network deposited by metal shell (Metal@AgNW) via electroplating exhibits improved conductivity with acceptable transmittance. The Metal@AgNW effectively enhances the chemical reliability of AgNW concerning the electrochemical migration and the UV degradation of Ag, maintaining a superior mechanical property. For the sulfurizing degradation of AgNW, only Ni@AgNW holds a relatively strong resistance. In addition, a high electromagnetic interference (EMI) shielding effectiveness (SE) up to 30 dB of Metal@AgNW with a good stability in the frequency range of 8.2–12.5 GHz is obtained, which is higher than that of pristine AgNW network. Theoretical calculations in combination with the corresponding experiments are employed to investigate the mechanism of electroplating Cu, Co, or Ni on AgNW. As a result, electroplated Ni on AgNW is the densest and most reliable coating in comparison to other metals due to the relatively strong interaction between electroplated Ni particles and the Ag surface. Therefore, electroplating Ni on AgNW is the preferred approach to obtain flexible, transparent, and high-conductivity films with superior reliability.
研究领域:
材料科学
·
电子工程
✓ 已验证
产品关联
DOI
高影响因子
Surfaces and Interfaces
·
2025
·
IF 6.3
Zhao-Yun Wang,Xin Zhao,An-Ni Zheng,Lei Jin,Jia-Qiang Yang,Jun-Yang Liu,DongPing Zhan,Da-Quan Yu,Fang-Zu Yang,Shi-Gang Sun
Metallization of micro through silicon via (TSV) is vital in 3-dimensional integration of chips and high-density printed circuit boards. As the diameter decreases and aspect ratio increases, realizing a uniform copper seed layer inside TSV becomes increasingly challenging by using traditional techniques of high-cost physical vapor deposition (PVD) and chemical vapor deposition (CVD). Cu electroless deposition (Cu-ELD) is a promising technique for growing a conductive seed layer on the wall of TSV, and promotes the completion of metallization of micro TSV following by Cu electroplating. In the current study, an advanced method is developed to form Cu seed layer on micro TSV by Cu-ELD catalyzed through Ag nanoparticles. The Ag nanoparticles are synthesized using gallic acid as the reducing agent (denoted as GA-Ag NPs). Ultraviolet–visible absorption spectroscopy and transmission electron microscopy are applied to study the mechanism of conformal Cu-ELD catalyzed by GA-Ag NPs, and results demonstrate that all Ag ions are reduced to spherical Ag NPs of 9.7 nm in average size. Electrochemical tests and finite element simulation illustrate that the high catalytic activity of GA-Ag NPs facilitates Cu-ELD to achieve an effective conformal deposition in TSV. The obtained continuous and uniform Cu seed layer enables the void-free filling of TSV ultimately by Cu electroplating. An in situ XRD device is designed and built up for investigation of Cu-ELD process, which reveals that the Cu layer catalyzed by GA-Ag NPs during growth is stable and exhibits a mixed crystalline structure with texture coefficient ( TC ) values of Cu (220) and Cu (311) close to and higher than 25 %.
研究领域:
材料科学
·
电子工程
✓ 已验证
产品关联
DOI
高影响因子
ChemElectroChem
·
2022
·Vol. 9
·期 11
·e202200423
·
IF 4.782
Wei-Qing Li,Lei Jin,Jia-Qiang Yang,Zhao-Yun Wang,Dongping Zhan,Fang-Zu Yang,Zhong-Qun Tian
Graphical Copper Electronic Electroplating : A novel copper electroplating bath in weak alkalinity and containing citrate (Cit) and ethylenediamine (En) in the through-hole thickening of printed circuit board (PCB) was presented. The selective adsorption of Cit−Cu and En−Cu coordination ions at different sites was driven by respective overpotential in TH of PCB for conformal copper electroplating. In this work, an electronic copper electroplating bath with low copper ion concentration and preeminent throwing power in through hole (TH) thickening of the printed circuit board (PCB) was successfully developed. Based upon the weak alkaline bath containing the composite complexants of citrate (Cit) and ethylenediamine (En), their synergistic effects on the preeminent bath throwing power were carefully investigated and theoretically proved. The UV-vis spectroscopy results illustrated that En exhibited a stronger coordination ability with Cu (II) ion than citrate, and the stoichiometric coordination ratio between En and Cu (II) ion was 2 : 1. The linear sweep voltammetry (LSV) results showed that the electro-reduction peak potential of Cit−Cu coordination ion was −0.55 V (vs. Hg/HgO), whereas that of En−Cu ion was at a more negative potential of −0.82 V. The in situ Fourier transform infrared (FTIR) spectroscopy revealed that the adsorptions of the Cit−Cu and En−Cu coordination ions were potential dependent on the copper electrode. The Cit−Cu coordination ion was easily adsorbed at the interior sites of through holes with lower over-potential to promote the growth of copper coating. Moreover, the En−Cu coordination ion adsorbed preferably on the surface and the edge of through hole for its higher electro-reduction overpotential, to hinder the germinating of copper nuclear. The cross-section observation of optical microscope proved that the throwing power of novel copper electroplating bath behaved surpassingly, up to 105.8 %.
研究领域:
材料科学
·
电子工程
✓ 已验证
DOI
高影响因子
CHEMICAL PAPERS
·
2019
·Vol. 73
·期 8
·1863-1869
·
IF 1.246
Zhuang Huajian,Wang Chan,He Fufeng,Song Qijun
Brass is a metallic alloy that is made of copper and zinc and has a gold-like appearance. Tin coating could endorse the brass with yellowish up to silver-white color and improve its surface durability. In the present work, electroless plating of tin on the brass surface was investigated aiming to obtain a stable and controllable colored surface. In the presence of thiourea, the open circuit potential of brass (− 0.652 V) is more negative than that of tin (− 0.532 V), which makes the deposition of tin on brass feasible. The surface morphology and composition of the coatings were characterized by scanning electron microscope and energy dispersive spectrometer and the results indicated that a large number of tin clusters were formed on the brass surface. The amount of tin clusters determined the color of the coated surface, which can be facilely tuned by the plating time. The UV/Vis diffuse reflectance spectra were used for monitoring the changes of color at different plating time. The results show that there is a good linear correlation ( R 2 = 0.9948) between the absorbance and the plating time, which can be used to control the extent of tin plating on brass. Finally, the cross-cut test showed that the Sn particles were firmly coated on the brass substrate.
研究领域:
材料科学
·
电化学
✓ 已验证
产品关联
DOI
高影响因子
JOURNAL OF MATERIALS SCIENCE
·
2023
·Vol. 58
·期 22
·9382-9393
·
IF 4.5
Wang Bingying,Zhang Keke,Gao Yijie,Liu Peng,Liu Bo,Zhang Zhansheng
The trend toward miniaturized and highly integrated chip packaging has created a pressing need for lead-free solders with high strength, toughness, and conductivity. In this paper, we designed a scheme of Al 2 O 3 -modified nanomaterial-reinforced low silver Sn1.0Ag0.5Cu (SAC105) solder matrix. To begin with, a novel amorphous carbon and nickel core–shell structure plating modified on Al 2 O 3 (C/Ni/Al 2 O 3 ) were prepared by the electroless plating method. Then, the nano-C/Ni/Al 2 O 3 particle as reinforcement phase was mixed into the matrix solder alloy by ultrasonic vibration stirring. Finally, the morphology and relationship between coated carbon, deposited nickel and original solder interface were analyzed. The microstructure and main properties of the modified solders were also investigated. The experimental results suggested that amorphous carbon and nickel film were prepared on the surface of Al 2 O 3 by electroless plating method. The outer layer of nano-Al 2 O 3 was coated with non-uniform thickness of nickel and carbon coatings. The mass percentage of amorphous carbon was about 3.50%. Adding C/Ni/Al 2 O 3 (0–0.5%) into the SAC105 solder matrix resulted in a gradual increase in conductivity and wettability. The strength and toughness of the modified solder alloy improved as well with the adjunction of reinforced phase. The tensile fracture surface exhibited from a mixture of ductile and brittle, characterized by dimples and cleavage surface, to a purely ductile mode consisting mainly of dimples.
研究领域:
材料科学
·
电子工程
✓ 已验证
产品关联
DOI
高影响因子
RARE METALS
·
2021
·Vol. 41
·期 1
·86-95
·
IF 4.003
Tian Bang-Zhou,Jiang Xu-Ping,Chen Jie,Gao Han,Wang Ze-Gao,Tang Jun,Zhou Da-Li,Yang Lei,Chen Zhi-Gang
Abstract Interface engineering has been regarded as an effective strategy to manipulate the thermoelectric performance of materials. Here, we use a facile chemical electroless plating and a spark plasma sintering process to fabricate Ag-plated SnTe bulk. After sintering, a small amount of plated Ag can be doped into SnTe to suppress the Sn vacancies and the others form Ag precipitates with a size distribution from nanoscale to microscale, which introduces Ag/SnTe interfaces to enhance the Seebeck coefficient via energy filtering effect. Simultaneously, these structures result in strong scattering to reach a low lattice thermal conductivity of ~ 0.62 W·m –1 ·K –1 . Consequently, a maximum figure of merit ( zT ) of ~ 0.67 at 823 K is achieved in 2 wt% Ag-plated SnTe, which is ~ 60% higher than that of pristine SnTe. Moreover, the microhardness indentation test results show that the mean microhardness of 2 wt% Ag-plated SnTe is HV 64.26, which is much higher than that of pristine SnTe, indicating that Ag electroless plating can improve the mechanical properties of SnTe. This work has provided a facile and eco-friendly method to realize the interface engineering for manipulating the thermoelectric and mechanical properties of SnTe. Graphical abstract
研究领域:
材料科学
·
热电材料
✓ 已验证
DOI
高影响因子
ENVIRONMENTAL SCIENCE AND POLLUTION RESEARCH
·
2024
·Vol. 31
·期 47
·58109-58118
·
IF 0
Kong Dehui,Wu Jinxiong,Yan Xiuling,Zhang Heng,Iqbal Azhar,Ivanets Andrei,Romanovski Valentin,Zhang Lijuan,Su Xintai
The utilization of electroplating sludge (ES) to derive metal oxide functional materials is a key strategy, as it enables the recycling of valuable elements, mitigates environmental risks, and aligns with green, low-carbon development strategies. Nevertheless, the development of metal oxide composite functional materials with distinctive structures and properties derived from ES continues to present several challenges. Herein, we synthesized CuFe 2 O 4 /MgFe 2 O 4 metal oxide composites from ES by one-step hydrothermal method. As-obtained CuFe 2 O 4 /MgFe 2 O 4 metal oxide composites (MMOs) have a unique layered structure, richer mesoporous and microporous structures, activity sites. When evaluated as an adsorbent for Congo red (CR), as-synthesized CuFe 2 O 4 /MgFe 2 O 4 with layered structure composite exhibited excellent adsorption capacity (1039.1 mg/g) and reusability (85.55% after five cycles), which was superior to most similar adsorbents reported till date. Such improvement is explored to mainly originate from two respects: the physical adsorption facilitated by the abundant pores formed through the stacking and growth of CuFe 2 O 4 and MgFe 2 O 4 , and the chemisorption resulting from surface complexation and hydrogen bonding between the MMOs and CR. This strategy to directly transform ES into functional materials shows great promise both in waste management and preparation of robust adsorbents for wastewater treatment.
研究领域:
环境科学
·
材料科学
✓ 已验证
DOI
PubMed
SOLID STATE SCIENCES
·
2024
·
IF 3.4
Liming Zhu,Dezhu Sun,Xuyang Li,Wei Liu,Jiaqiang Huang,Caihang Liang,Xiaokai Hu
Bismuth telluride and lead telluride are typical thermoelectric semiconductors that are metallized for electrical contacts before being assembled into devices. In this study, three iron-group metals of nickel cobalt iron, were chemically plated on n-type bismuth telluride as the prospective contact material for adhesion and barrier in soldering connection with copper. Aluminum was used as the sacrificial anode to ensure iron deposition. The sensitization in borohydride solution facilitated the subsequent plating of metals. The plating rates were determined by gravimetric method. The crystalline structure and morphology of films were characterized. Electrochemical polarizations were undertaken to compare the driving force among three plating reactions through the reduction of metallic cations and the oxidation of hypophosphite anions with the mixed potential theory. The heterojunction of bismuth telluride with copper was fabricated by reflow soldering with Sn 95 Sb 5 foil, and the interfacial resistivity was evaluated by multiple resistance measurements across the junction.
研究领域:
材料科学
·
电化学
·
热电学
✓ 已验证
DOI
高影响因子
危险品化学品经营许可证（带存储）