The partial reduced graphene oxide (P-rGO) sheets-wrapped nickel foams (NF@P-rGO) were prepared by hydrothermal method, and then their epoxy composites were fabricated via a simple drop-wetting process. The P-rGO sheets on the metal networks could effectively improve the compatibility between nickel foam and epoxy resin, thus greatly accelerate the wetting of epoxy resin on the foams and avoid cracks in the network–polymer interface. Owing to the existence of high-efficiency conductive metal networks, the NF@P-rGO/epoxy composite has a high thermal conductivity of 0.584 W m −1 K −1 , which is 2.6 times higher than that of neat epoxy resin. Additionally, owing to the improved wetting ability, NF@P-rGO-10 wt% boron nitride (BN) microsheets/epoxy composites could be fabricated and have a further higher thermal conductivity of 0.71 W m −1 K −1 . We believe the use of P-rGO as a novel surface modifier and the following liquid polymer drop-wetting could be an effective method to obtain novel and outstanding metal foam/polymer composites.
Xiao-yu Zhang,Min Xu,Sheng-zhu Cao,Wen-bo Chen,Wen-yao Yang,Qin-yu Yang
Diamond/copper composite has been considered as one of the next generation thermal management materials. Interfacial modification is an essential means of ameliorating interface wettability and bonding of diamond/copper composite for improving its thermal conductivity . In the present work, Diamond/copper composite was manufactured by using spark plasma sintering (SPS) technology with 60% volume fraction of diamond mixed with 40% volume fraction of copper power, chromium powder (0.7 wt%) and scandium oxide powder (0.21 wt%). A series of material analysis methods were used to characterize the microstructure, interfacial layer , phase compositions and distributions of Diamond/copper composite. The total and partial electron density of states (DOS) for Diamond-Cr-Sc 2 O 3 interfacial model was investigated by means of first-principles calculations from CASTEP modules. The results showed Sc 2 O 3 made a 5–20 nm well-arranged and uniformly distributed interfacial chromium carbide layer in the interface region, which played a critical role in increasing the amount of reactive interfacial bonding and decreasing defect. The addition of Sc 2 O 3 brought the increasing number of heat transfer carriers at the interface and made the interface energy system more stable. The obtained diamond/copper composite exhibited that the wettability between diamond particles and copper was effectively improved. The thermal conductivity of diamond/copper is 872 W/(m·K) and the possible reasons for doping rare-earths Sc 2 O 3 to improve the thermal conductivity were discussed.
危险品化学品经营许可证（带存储）