The reliability of Cu bonding technology in three-dimensional integration packaging is limited by high sintering temperatures and the growth of oxide at the joining interface. Hence, we propose a bionic adhesion interface of creeper sucker on the Cu substrate and covered with monolayer graphene, which increases the shear strength by 3 times compared to the conventional flat Cu substrate. The covered graphene layer effectively inhibits the generation of oxide at the joint interface and maintains a high shear strength after aging at 300 °C for 48 h Nanoscale Cu particles could reduce the chemical potential energy of the substrate surface , and stable bonding was achieved at 200 °C under a pressure of 2 MPa. Molecular dynamics simulation models reveal crystal structure evolution and residual stresses during the sintering process . This work demonstrates that bionic microstructures applied to copper bonding play an important role in interface enhancement, resulting in reliable bonding of Cu substrate at low temperatures. The method proposed here can provide insight into diversified applications including high-power light-emitting diodes soldering, SiC electronic devices, and flexible electrode interconnects.
Flexible silicone materials have excellent elastic properties and can maintain excellent structural stability under high-intensity repeated deformation. They are ideal materials for preparing piezoresistive flexible sensors. However, traditional silicone materials exhibit strong insulation properties. The solid block structure is also not conducive to improving sensitivity. Inspired by the irregular hole structure of Taihu Lake stone, this paper prepared a porous silica gel skeleton (rGO/CTAB/SG) based on reduced graphene oxide film coating, which was equipped with flexible interdigital electrodes to achieve electrical signal derivation. The “honeycomb” shaped sensing module prepared in this way achieves an extremely wide elastic deformation range (20-200%). In the pressure feedback layer, the rGO film is evenly coated on the SG surface, which greatly improves the device conductivity and sensing performance (high sensitivities of 89.4 kPa − 1 and 25.4 kPa − 1 are achieved within 0-30.2 kPa and 30.2–42 kPa, ultra-high durability under more than 22,000 load-unload cycles.) Numerical simulation analysis results confirmed that the structure of the flexible substrate SG prepared by this method maintained well when extreme deformation occurred, and no fracture or stress concentration occurred. As an elastic sensor, after being integrated with a microprocessor, it can easily monitor and analyze human body movement in real time. It has huge potential in areas such as daily training and health monitoring of athletes.
危险品化学品经营许可证（带存储）