The rapid development of the portable and wearable devices has inspired the ever-growing pursuit of flexible energy storage equipment which can power these devices. Here, rice paper (RP) was integrated with a homemade LGS-polypyrrole (LGS-PPy) ink and commercial pen ink in order to construct a flexible electrode of a supercapacitor via a facial dip-coating method. The obtained RP/LGS-PPy ink/Pen ink composites showed a high areal specific capacitance of 1568 mF/cm 2 at 0.2 mA/cm 2 , owing to the uniform deposition of a LGS-PPy layer which was covered by the pen ink coating. Furthermore, the assembled symmetric supercapacitor fabricated from the RP/LGS-PPy ink/Pen ink electrode exhibited impressive electrochemical performances in terms of specific capacitance (317.5 mF/cm 2 at 2 mA/cm 2 ), power density (846 μW/cm 2 at the energy density of 23.5 μWh/cm 2 ), and life times (82.1% capacitance retention after 5000 cycles). In addition, the capacitance of the as-prepared device remained essentially unchanged even after bending at 180°, thus demonstrating this device's outstanding flexibility. The low cost of raw materials, robust fabrication strategy as well as the moderate performances make the RP-based supercapacitor a promising candidate for future flexible energy storage devices.
Photothermal conversion behavior has a vital application to disease therapy, water purification, or uncontacted heaters. The fabrication of high-performance photothermal conversion materials especially for near-infrared (NIR) light and microstructures has attracted a great deal of attention. Among numerous substances, MXene as a new type of 2D material with semi-metallic and unique electromagnetic properties presents a broader absorption of light and even a typical plasmonic absorption near the NIR-I area (808 nm), which has made it suitable for photothermal conversion. Here, we propose a facile approach for preparing a Ti3C2Tx/ionic liquid ink with a high photothermal conversion efficiency. The as-prepared ink has showed good wettability of various substrates as well as the high sensitivity of 808 nm NIR light irradiation and a wide range of thermal variation. After packing the ink into a gel pen refill, the flexible thermal chips could be easily obtained just by pen writing on the soft surface with the designed size, which also have become an optimal candidate for the thermal alarm system.