Design and Fabrication of a Low Dielectric Constant Poly(arylene ether sulfone) Film-Containing Cyclohexane Group
In this study, a novel bisphenol-containing cyclohexane group [4,4′-(cyclohexane-1,1-diyl)bis(2-methoxyphenol) (CDBMP)] was synthesized. It was reacted with 4,4′-dichlorodiphenylsulfone to synthesize polyether sulfone-containing −OCH3 groups (PES–OCH3). Then, PES–OCH3 was reacted with BBr3 and (t-Boc)2O to yield PES–OH and PES–Boc, respectively. The glass transition temperatures of PES–OCH3 and PES–OH were found to be 177.6 and 240.7 °C, respectively. The resultant resins exhibited good tensile strength and solubility (dissolved in N-Methyl-2-Pyrrolidine, dimethylformamide, and so on). Interestingly, PES–Boc showed excellent foam property, and the density of the foam decreased from 1.23 to 0.012 g/cm3. Also, we found that the dielectric constant and dielectric loss values (107 Hz) of the foaming sample were in the range of 1.9–2.7 and 4.22 × 10–3 to 7.99 × 10–3, respectively. The introduction of hydroxyl-Boc-assisted modification provides a controllable process to fabricate porous and ultra-light materials, and it can be potentially applied in these fields such as microelectronics and high speed communication systems.
危险品化学品经营许可证（带存储）