Small
·
2025
·
IF 12.1
Man Liu,Feihua Liu,Hongmei Qin,Chuanxi Xiong,Hengxue Xiang,Liping Zhu,Meifang Zhu
Polymer dielectric films are widely used in advanced electronics, hybrid vehicles, etc., however, they encounter critical challenges, including significant thermal degradation and heightened leakage currents, which severely constrain their energy density and efficiency under high-temperature conditions. Herein, a novel strategy is proposed for constructing a polyimide (PI) alloy by incorporating high-bandgap copolymer of perfluoropropyl perfluorovinyl ether and tetrafluoroethylene (P(TFE-PPVE)) and fluorinated polyimide (FPI) as a compatibilizer. The highly oriented structural PI/FPI/P(TFE-PPVE) alloy is fabricated via knife casting, which utilized high shear forces to align the P(TFE-PPVE) blocks within the polyamide acid. Simulation results indicate that the high-bandgap P(TFE-PPVE) phase (9.72 eV) with an oriented structure in the PI matrix can effectively suppress electrical tree growth. Furthermore, deep carrier trap at the PI/P(TFE-PPVE) interface (2.98 eV) further reduces leakage current and enhances breakdown strength while minimizing conduction loss. As a result, the PI/FPI/0.25P(TFE-PPVE) alloy demonstrates remarkable dielectric stability under diverse conditions, achieving a discharge energy density of 3.75 J cm −3 with 90% efficiency at 150 °C and 550 MV m −1 . This straightforward blending strategy provides an effective pathway to modulate the condensed structure of all organic polymers, offering promising potential for high-performance polymer dielectrics.
研究领域:
材料科学
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电子工程
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能源存储
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DOI
PubMed
高影响因子
DISPLAYS
·
2014
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IF 1.205
Xia Chen,Tao He,Hongwei Jiang,Biming Wei,Guofei Chen,Xingzhong Fang,Mingliang Jin,Robert A. Hayes,Guofu Zhou,Lingling Shui
We report a screen-printing fabrication process for large area electrowetting display (EWD) devices using polyimide-based materials. The poly(imide siloxane) was selected as hydrophobic insulator layer, and relatively hydrophilic polyimide as grids material. EWD devices that use poly(imide siloxane) as hydrophobic insulator fabricated with conventional methods showed good and reversible electrowetting performance on both single droplet level and device level, which showed its potential application in EWDs. The compatibility of polyimide-based materials (hydrophobic poly(imide siloxane) and hydrophilic polyimide) guarantee the good adhesion between two layers and the capability of printable fabrication. To this end, the hydrophilic grids have been successfully built on hydrophobic layer by screen-printing directly. The resulting EWD devices showed good switch performance and relatively high yield. Compared to conventional method, the polyimide-based materials and method offer the advantages of simple, cheap and fast fabrication, and are especially suitable for large area display fabrication.
研究领域:
材料科学
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显示技术
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DOI
高影响因子
Polymers
·
2021
·Vol. 13
·期 8
·1329
·
IF 4.329
Maijun Li,Zhibo Zheng,Zhiguang Zhang,Nanwen Li,Siwei Liu,Zhenguo Chi,Jiarui Xu,Yi Zhang
To improve the interfacial compatibility of mixed matrix membranes (MMMs) for gas separation, microporous polyimide particle (AP) was designed, synthesized, and introduced into intrinsic microporous polyimide matrix (6FDA-Durene) to form “all polyimide” MMMs. The AP fillers showed the feature of thermal stability, similar density with polyimide matrix, high porosity, high fractional free volume, large microporous dimension, and interpenetrating network architecture. As expected, the excellent interfacial compatibility between 6FDA-Durene and AP without obvious agglomeration even at a high AP loading of 10 wt.% was observed. As a result, the CO2permeability coefficient of MMM with AP loading as low as 5 wt.% reaches up to 1291.13 Barrer, which is 2.58 times that of the pristine 6FDA-Durene membrane without the significant sacrificing of ideal selectivity of CO2/CH4. The improvement of permeability properties is much better than that of the previously reported MMMs, where high filler content is required to achieve a high permeability increase but usually leads to significant agglomeration or phase separation of fillers. It is believed that the excellent interfacial compatibility between the PI fillers and the PI matrix induce the effective utilization of porosity and free volume of AP fillers during gas transport. Thus, a higher diffusion coefficient of MMMs has been observed than that of the pristine PI membrane. Furthermore, the rigid polyimide fillers also result in the excellent anti-plasticization ability for CO2. The MMMs with a 10 wt.% AP loading shows a CO2plasticization pressure of 300 psi.Keywords:mixed-matrix membranes;compatibility;microporous polyimide particle;polyimide matrix;permeability
研究领域:
材料科学
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化学工程
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DOI
PubMed
高影响因子
RSC Advances
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2014
·Vol. 4
·期 52
·27267-27276
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IF 3.708
Seongku Kim,Xingyuan Wang,Shinji Ando,Xiaogong Wang
A hydroxyl-terminated hyperbranched polyimide was synthesized via the A2 + B3 reaction between dianhydride and triamine monomers. The hydroxyl groups at the peripheral positions were then introduced by modification of the anhydride end groups via a reaction with 4-aminophenol. Based on the hydroxyl-terminated hyperbranched polyimide, HBPIBPADA-TAP(OH), we successfully fabricated hybrid ternary composites, which were comprised of a linear polyimide (PI6FDA-APB), HBPIBPADA-TAP(OH), and an inorganic SiO2 component. The material was designed to satisfy the requirement for cutting-edge insulators with a low dielectric constant and a high thermal stability. Because of the appropriate choice of the hybrid ternary composite systems with HBPIBPADA-TAP(OH) and inorganic silica, it is sensible to improve the dielectric properties and thermal resistant properties of unary systems or improve the disadvantages of the dielectric and optical properties of binary systems. For an optimized composition, the dielectric constant (Dk) of the PI6FDA-APB–HBPIBPADA-TAP(OH)-30%–SiO2-20% composite reaches the lowest value of 2.24 at 100 kHz. Research also showed that the optical transparency is significantly improved with the increase of the HBPIBPADA-TAP(OH) content in the composite. Compared with the binary linear PI 6FDA-APB–SiO2 composite, the transmittance increases from 1% to 75% at the wavelength of 450 nm. The incorporation of SiO2 can preserve the good thermal properties of the hybrid composites containing HBPIBPADA-TAP(OH). By adding 10% of HBPIBPADA-TAP(OH) to the PI6FDA-APB–SiO2-20% system, the coefficient of thermal expansion of the hybrid ternary composite is 20.9 ppm °C−1 in the temperature range from 100 to 150 °C, which is significantly lower than that of the linear polyimide (37.1 ppm °C−1 for PI6FDA-APB). Because of these optimized properties, hybrid ternary composites have the potential for use in applications in the micro-electronic insulator fields, such as interlayer dielectrics of advanced electronic devices.
研究领域:
材料科学
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电子工程
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DOI
高影响因子
JOURNAL OF APPLIED POLYMER SCIENCE
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2023
·Vol. 140
·期 17
·e53769
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IF 3
Yingyi Ma,Zian He,Yuhang Han
The dielectric and other properties of low-dielectric-constant materials after heating are crucial to their performance and use, but rarely studied. In this article, sandwich-type porous polyimide (PI) film in which porous structures located on both upper and lower surfaces of flat PI film was prepared through the simple, low-cost and green microemulsion method. The porous structures were preserved after heating due to the usage of thermally stable fluorine-contained PI (FPI) and PI as skeleton and substrate of the porous structure, respectively, but with the increase of pore size because of the removal of thermally unstable surfactant on the inner surface of the pores. More importantly, 2.89%–5.57% of reductions in the dielectric constant with the maintenance of low dielectric loss and water absorption and high mechanical strength were observed after heating. Therefore, the low dielectric properties of heated films were well preserved upon high humidity treatment. Moreover, the structure and properties of the heated films could be adjusted via controlling the parameters in the microemuslion method. These excellent properties after the high-temperature treatment facilitate the application of the sandwich-type porous PI film as dielectric materials in high-temperature environment.
研究领域:
材料科学
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电子材料
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DOI
高影响因子
Polymers
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2020
·Vol. 12
·期 2
·442
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IF 3.426
Guangtao Qian,Mengjie Hu,Shangying Zhang,Mengxia Wang,Chunhai Chen,Jianan Yao
To achieve polyimide-metal complexes with enhanced properties, 5-amine-2-(5-aminopyridin-2-yl)-1-methyl-benzimidazole (PyMePABZ) that contains stiff 2-(2′-pyridyl)benzimidazole (PyBI) was synthesized and exploited to construct the Cu(ΙΙ)-crosslinked polyimides (Cu-PIs). These Cu-PIs exhibited higher dielectric, thermal, and mechanical properties with an increase in Cu2+content. Among them, their dielectric constants (εrS) were up to 43% superior to that of the neat PI, glass transition temperatures (Tgs) were all over 400 °C, and 5% weight loss temperature (T5%) maintained beyond 500 °C. These data indicate that the metal coordination crosslinking provided a useful guide to develop high performance PIs which possess potential application as useful high temperature capacitors.Keywords:polyimide;metal coordination crosslinking;high performance
研究领域:
材料科学
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化学工程
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DOI
PubMed
高影响因子
Crystals
·
2020
·Vol. 10
·期 3
·173
·
IF 2.404
Panpan Zhang,Ke Zhang,Shuliang Dou,Jiupeng Zhao,Xiangqiao Yan,Yao Li
Several kinds of polyimide (PI) films stemmed out of 4, 4’–diaminodiphenyl ether, as well as various structurally various aromatic dianhydride, were prepared. The films’ mechanical, dielectric, and dynamic mechanical attributes were put under investigation. According the findings, the PI films’ performance is significantly different as a result of their diverse structure. PI’s dielectric constant and dielectric loss tangent of abides by the increasing order below: PMDA-PI>BTDA-PI>BPDA-PI. Moreover, the electric breakdown strength of BTDA-PI (478.90 kV/mm) presents a lot higher value compared to the one PMDA-PI (326.80 kV/mm) and BPDA-PI (357.07 kV/mm). In particular, BTDA-PI film possesses high electric breakdown strength about 478.90 kV/mm. In addition, PI’s glass transition temperature (Tg) are, respectively, 276 °C (BTDA-PI), and 290 °C (BPDA-PI), as well as 302 °C (PMDA-PI). Therefore, in virtue of their various structures and performances, practical applications of PI films can exert significant role in the electronics and microelectronics industries.Keywords:polyimide;film;dielectric properties;thermal properties
研究领域:
材料科学
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电子工程
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DOI
高影响因子
Polymers
·
2020
·Vol. 12
·期 9
·2048
·
IF 3.426
Yiwu Liu,Ao Tang,Jinghua Tan,Xianqing Zhao,Chengliang Chen,Ding Wu,Yuhui Li,Pan He,Hailiang Zhang
A high-barrier polyimide (2,7-CPI) was synthesized through the polymerization of pyromellitic dianhydride (PMDA) and a novel diamine (2,7-CDA) containing carbazole moiety. The synthesized diamine and polyimide were fully characterized by elemental analyses, FTIR and NMR. The 2,7-CPI displays very attractive barrier performances, with oxygen transmission rate (OTR) and water vapor transmission rate (WVTR) low to 0.14 cm3·m−2·day−1and 0.05 g·m−2·day−1, respectively. Meanwhile, 2,7-CPI also exhibits exceptional thermal stability with a glass transition temperature (Tg) of 467 °C, 5% weight-loss temperature (Td5%) of 550 °C under N2and coefficient of thermal expansion (CTE) of 3.4 ppm/K. The barrier performances of 2,7-CPI are compared with those of a structural analogue (2,7-CPPI) and a typical polyimide (Kapton). Their barrier performances with respect to microstructure were investigated by molecular simulations, wide angle X-ray diffraction (WAXD), and positron annihilation lifetime spectroscopy (PALS). The results show that 2,7-CPI possesses better coplanar structure and more number of intermolecular hydrogen bonds among the three PIs, which result in tight chain packing and thereby high crystallinity, low free volume, and decreased chains mobility. That is, the high crystallinity and low free volume of 2,7-CPI reduce the diffusion and solubility of gases. Meanwhile, the poor chains mobility further decreases the gases diffusion. The reduced diffusion and solubility of gases consequently promote the improvement of barrier properties for 2,7-CPI. The polyimide has a wide application prospect in the field of flexible electronic packaging industries.Keywords:polyimide;carbazole;barrier properties;molecular simulations
研究领域:
材料科学
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化学工程
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DOI
PubMed
高影响因子
APPLIED SURFACE SCIENCE
·
2023
·
IF 6.7
Xinyu Liu,Xiaoli Dong,Yu Wang,Jiaxin Gao,Nan Zheng,Xinxin Zhang
The photocatalytic production of H 2 O 2 using the abundant water and air on earth is promising. Herein, the flower-like polyimide/ZnIn 2 S 4 heterostructures were prepared by a simple two-step solvothermal method, where the tight interface formed between polyimide (PI) and ZnIn 2 S 4 microspheres facilitated the separation and migration of photo-generated charges. Under air condition, the photocatalytic H 2 O 2 production rate without any sacrificial agent is as high as 411.07 μmol g −1 h −1 , which is 15.4 and 3.2 times higher than that of the pristine PI and ZnIn 2 S 4 microspheres, respectively. Meanwhile, the PI/ZnIn 2 S 4 -2 has excellent reusability, and the H 2 O 2 production of PI/ZnIn 2 S 4 -2 maintained 80% of its original value after five cycles. Moreover, the as-prepared samples underwent comprehensive characterization using various techniques, and the photocatalytic mechanism was also studied in detail. Active species capture experiments showed that e − and ·O 2 − played the primary role in this reaction system. This work provides a novel idea for photocatalytic H 2 O 2 production in pure water and air.
研究领域:
材料科学
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环境科学
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DOI
高影响因子
ADVANCED MATERIALS
·
2024
·Vol. 36
·期 36
·2401733
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IF 27.4
Xin Wang,Xiaoming Chen,Qingyuan He,Yaozu Hui,Chaofan Xu,Baichuan Wang,Feihu Shan,Jie Zhang,Jinyou Shao
To obtain high-performance electromagnetic microwave (EM) absorption materials with broad effective absorption bandwidth ( EAB ) and reduced thickness, designing structures has proved to be a promising way. Herein, ultra-broadband multilayer bidirectional MXene/polyimide EM absorption aerogels containing multi-structures on scales ranging from the micro- to the macroscale are produced with the aid of electric and temperature fields. On the microscale, under the action of electric force and temperature gradient, the ordered structures made of aligned Ti 3 C 2 T x MXene nanosheets and the microscale layered aerogel walls enable the bidirectional aerogel to achieve a wide EAB of 8.58 GHz at a thickness of 2.1 mm. This is ascribed to the numerous aligned nanosheets and layered aerogel walls perpendicular to the incident EMs, facilitating the conversion of electromagnetic energy into electrical energy. Furthermore, on the macroscale, the multilayer bidirectional aerogel with non-gradient structures effectively resolves the conflict between impedance matching and energy loss, resulting in an ultrawide EAB of 9.41 GHz at a thickness of 3 mm. This innovative design of electric-field-assisted multilayer bidirectional aerogels with multiscale structural coupling may provide feasible and effective pathways for the development of advanced EM absorption materials.
研究领域:
材料科学
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电磁学
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DOI
PubMed
高影响因子
MATERIALS LETTERS
·
2017
·
IF 2.572
Xin Wang,Yi Liu,Yongfeng Gong,Xinkun Suo,Hua Li
Liquid flame sprayed polyimide-copper coatings were developed for marine antifouling applications. Mixture of polyimide precursor and copper particles was prepared as the starting feedstock for making the composite coatings. Synthesis of polyimide was achieved during the spraying and polyimide acts as binder to fix copper particles. Copper particles were enwrapped by polyimide matrix and distribute evenly in the coatings. Further electrochemical testing revealed excellent corrosion resistance of the coatings in artificial seawater. The coatings resist effectively colonization of E. coli and Bacillus sp. bacteria on their surfaces, suggesting their remarkable antifouling performances. The results shed light on construction of polymer-based antifouling layers for widespread marine applications.
研究领域:
材料科学
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海洋工程
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生物学
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DOI
高影响因子
Polymers
·
2022
·Vol. 14
·期 21
·4604
·
IF 4.967
Zhiqing Wu,Fan Lei,Zhiqiang Zhan,Jiangshan Luo,Gao Niu,Zhaoguo Li,Tao Yi,Shufan Chen,Bo Yang,Qiubo Fu,Zhiming Zhang
The exploding foil initiator (EFI) system has been extensively used in ignition and detonation sequences and proved to be of high safety and reliability. Polyimide is considered the ideal flyer material for EFI due to its excellent performance, including thermal stability, outstanding mechanical properties, high radiation resistance, and excellent dielectric properties. In this study, we prepared the EFI based on a polyimide (ODPA-ODA) flyer, which is spin-coated and solidified on patterned copper film in situ. The electric explosion test shows that the prepared EFI has good working performance, and the 4000 V working voltage drove the flyer to reach a maximum velocity of 5096 m/s. The polyimide morphology and chemical structure after the electric explosion was observed by microscope, SEM, XPS, and FTIR, which showed that the polyimide flyer underwent thermal deformation and complex chemical reactions during an electric explosion. A large number of polyimide bonds broke to form new carbonyl compounds, and the opening of aromatic rings was accompanied by the formation of aliphatic hydrocarbon chains. The morphology and chemical structure analysis after the electric explosion test will lay a foundation for us to further understand the working principle and evolution process of polyimide (ODPA-ODA) flyer.Keywords:exploding foil initiator;polyimide;flyer;plasma;morphology;chemical structure
研究领域:
材料科学
·
爆炸物理
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DOI
PubMed
高影响因子
危险品化学品经营许可证（带存储）