Aqueous solution-processed, self-flattening AlOx:Y dielectrics for fully-transparent thin-film transistors
Dielectrics fabrication on rough substrates, always leading to microstructural defects and detrimental dielectric properties eventually, is a great challenge for academic endeavors in this field. We report here on self-flattening AlO x :Y dielectric thin films processed by a facile aqueous solution method. The obtained AlO x :Y dielectrics are dense, large-area uniform, and amenable to accurate control of film thickness by repeating the deposition cycles. In particular, an atomically smooth surface with a RMS of 0.10 nm was realized for the AlO x :Y film with a thickness of 14.5 nm on Si wafer, yielding a low leakage current density of 7.9 × 10 -8 A cm -2 @2 MV/cm, a dielectric constant of 8.8 @100 Hz, and an attenuated dielectric dispersion property. The interactions between pre-baked YO x underlayer and later-dropped AlO x precursor were comprehensively investigated, in order to understand the film growth mechanism and the origin of self-flattening effect. Fortunately, this self-flattening effect is also applicable to other substrates. A RMS of 0.81 nm was achieved on ITO glasses , and the height distribution profile of the film surface was found to follow symmetric Gaussian distribution. This preparation routine was also examined by device verification in the fully-transparent thin-film transistors. The combination of ease of preparation and attractive physical properties would provide a green-route solution platform for dielectric synthesis, for interface engineering, and for well-performed devices on rough substrates.
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