International Journal of Applied Ceramic Technology
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2024
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IF 1.8
Meihan Ren,Xiao You,Mengli Xiao,Han Luo,Yudong Xue,Chunjing Liao,Haijun Zhou,Jinshan Yang,Xiangyu Zhang,Shaoming Dong
The reliable jointing of SiC f /SiC is considered to be a key factor limiting the application in the field of nuclear cladding. In this work, a jointing layer with interconnected SiC nanowires (SiCNWs) toughening network is prepared by a typical two-step routine. The high-viscosity slurry containing the precursor is pyrolyzed to form a porous SiC-based jointing layer, which is then densified by chemical vapor infiltration. Besides, SiC powders are introduced into the slurry to further increase the density of the jointing layer. The homogeneous SiC jointing material enables the strength and effectively avoids the mismatch between the thermal expansion coefficient of the jointing layer and SiC f /SiC composites, and the apparent shear strength of the jointing specimen reaches 7.211 MPa. It is found that the joint with SiCNWs shows better shear strength than the joint without SiCNWs, and the improved mechanical properties could be attributed to the pull-out and bridging of SiCNWs.
研究领域:
材料科学
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核工程
✓ 已验证
产品关联
DOI
高影响因子
JOURNAL OF THE EUROPEAN CERAMIC SOCIETY
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2023
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IF 5.7
Chuang-Tian Zhan,Sheng-Jin He,Wei-Ming Guo,Yuan-Bin Chen,Shi-Kuan Sun,Hua-Tay Lin
Combined with the thickness control of interlayers (∼10 µm and ∼60 µm), SiC nano-powders with Al 2 O 3 -Y 2 O 3 -MgO-CaO additive (NITE-SiC) were used as the joining materials to achieve the low-temperature joining of SiC ceramics. Some residual pores were observed in the interlayer with a thickness of ∼60 µm after joining at 1650 ℃, and the shear strength of SiC joints measured was 39.3 ± 5.5 MPa. Observations showed the fracture of joints occurred at the interlayer. When the thickness of the interlayer decreased to ∼10 µm, no cracks or porosity were observed at the interface region after joining at 1650 ℃. The shear strength of SiC joints increased to 69.5 ± 8.9 MPa, and the fracture originated from the matrix. The results demonstrated using NITE-SiC with Al 2 O 3 -Y 2 O 3 -MgO-CaO additive as the joining layer and reducing the thickness of the interlayer could lower the joining temperature and significantly improve the mechanical strength of joints.
研究领域:
材料科学
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陶瓷工程
✓ 已验证
产品关联
DOI
高影响因子
Crystals
·
2022
·Vol. 12
·期 9
·1286
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IF 2.67
Yu Yan,Qi Zhang,Zhijian Wang,Qifeng Du,Ruitao Tang,Xiaoyu Wang
The performance of monochromatic perovskite light-emitting diodes (PeLEDs) has undergone rapid development in recent years, while white PeLEDs are still in their infancy. The tandem devices prepared by connecting light-emitting units of different colors with intermediate connectors comprise one of the promising approaches for realizing white light emission. The intermediate connector plays a crucial role in determining the effectiveness of the light-emitting units. In this work, all-perovskite-based white LEDs are assembled by employing sky-blue (490 nm) and red (690 nm) perovskite emitters as active layers. With mixed p-type and n-type organic charge transport materials as the intermediate connector, the highest external quantum efficiency (EQE) of the device was 1.4%, the electroluminescence (EL) peak position of the blue light part was shifted to 512 nm, and the red light part was shifted to 673 nm. In contrast, with organic and inorganic charge transport materials as the intermediate connector, the devices exhibited better charge generation/injection capabilities and a record EQE of 8.5%. The EL peak position of the device prepared from the stored film was not shifted, implying that the organic/inorganic layer effectively suppresses halide migration. Our work paves the way for highly efficient tandem white PeLEDs.Keywords:tandem;white perovskite light-emitting diodes;organic/inorganic intermediate connector
研究领域:
材料科学
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光电
✓ 已验证
产品关联
DOI
高影响因子
Solar RRL
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2019
·Vol. 4
·期 4
·1900480
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IF 0
Wenwu Zeng,Cong Xie,Wen Wang,Sheng Li,Xueshi Jiang,Sixing Xiong,Lulu Sun,Fei Qin,Hongwei Han,Yinhua Zhou
Tandem solar cells are attractive because they can break the Shockley–Queisser efficiency limit of single-junction cells. However, it is still quite challenging to fabricate efficient nonfullerene tandem organic solar cells (OSCs) because of their complicated and vulnerable multilayers and interfaces. The interconnecting layer (ICL) between two subcells is the key part in efficient tandem solar cells, which should be designed properly based on the property of active layers. Herein, the incorporation of hydrogen molybdenum bronze (H x MoO 3 ) between the bottom active layer and PEDOT:PSS/ZnO to form a new ICL is proposed. The contribution of the H x MoO 3 is two fold: 1) it can well wet the hydrophobic active layer surface and form a uniform film. It provides a hydrophilic surface for the following deposition of PEDOT:PSS; 2) the H x MoO 3 has a high work function of 5.4 eV that is higher than PEDOT:PSS (5.0 eV) and can extract holes more efficiently from the active layer with the deep highest occupied molecular orbital energy level. Nonfullerene tandem solar cells with a high fill factor of 76.0% and power conversion efficiency of 15.03% are obtained with this ICL.
研究领域:
材料科学
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能源技术
✓ 已验证
DOI
JOURNAL OF THE EUROPEAN CERAMIC SOCIETY
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2019
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IF 4.029
Daoyao Ke,Anna Jiang,Mattia Biesuz,Mauro Bortolotti,Gianmarco Taveri,Xiaoyi Wang,Ming Xu,Jiang Li,Yagang Feng,Chunfeng Hu,Salvatore Grasso
We developed Cold Isostatic Joining (CIJ) which is an environmental friendly room temperature joining method. This technique extends cold sintering process to joining of glasses. By optimizing the CIJ conditions a shear stress (18 MPa) comparable to bulk fused silica was achieved. The technique surpasses other joining methods (e.g. adhesive bonding and brazing), because it is insensitive to thermal degradation . Unlike pressure-less silicate bonding, pressure assisted CIJ resulted in a thin joining interlayer (≈27 nm) which maintained its integrity after being heated up to 1000 °C. The in-line transmittance (92%) was identical to un-joined material over the full spectrum making the joining nearly undetectable. The mechanism of CIJ formation and joining were clarified using X-ray diffraction (XRD and pole figure), scanning electron microscopy (SEM) and in line transmittance measurements. The cold joining method could find applications in the field of optics and semiconductors for wafer and lens bonding.
研究领域:
材料科学
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光学工程
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半导体制造
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连接技术
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环境友好工艺
✓ 已验证
DOI
高影响因子
危险品化学品经营许可证（带存储）