Applied Nanoscience
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2015
·Vol. 6
·期 4
·575-580
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IF 0
Wang E. Y.,Li Xuezhao,Duan Y. N.
A new process to fabricate copper pattern on PET substrate is developed in the experiment. Functional ink with ion-adsorption nanoparticles was printed on PET substrate to form the pattern adsorption film. Catalytic ion was adsorbed by amino groups in the adsorption film to catalyze the electroless plating process of copper. The mercapto groups were introduced to the film to enhance the reliability of patterns. In addition, the specific solvent was used in the ink to increase the surface roughness of adsorption film which leads to a better adhesion of the patterns. The conductivity of prepared copper patterns is the same as bulk copper and the patterns show good adhesion on PET substrate.
研究领域:
材料科学
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纳米技术
✓ 已验证
产品关联
DOI
ACS Applied Materials & Interfaces
·
2014
·
IF 5.9
Yu Chang,Chao Yang,Xin-Yao Zheng,Dong-Yu Wang,Zhen-Guo Yang
A novel patterning–adsorption–plating process to additively fabricate copper patterns is developed. Functional ink with ion-adsorption nanoparticles was inkjet printed on PET substrate to form the patterned adsorption film. Catalytic ion was adsorbed by amino groups in the adsorption film, and catalyzed the electroless plating of copper. The mercapto groups introduced to the film enhance the reliability of the patterns. Specific solvent used in the ink increase the surface roughness of the adsorption film, leading to a better adhesion of the patterns. The prepared copper patterns show excellent conductivity about the same with bulk copper and good adhesion on PET.
研究领域:
材料科学
·
电子工程
✓ 已验证
产品关联
DOI
PubMed
高影响因子
Journal of Manufacturing Processes
·
2024
·
IF 6.1
Qing Wang,Pengfei Su,Zhenyu Lei,Mingxiang Chen,Xiaobing Luo
The copper pattern electroplating rate significantly impacts electronic packaging substrate preparation efficiency. The direct current (DC) electroplating technique has great potential in economy and convenience but faces challenges in improving the electroplating rate and coating properties, thus making electroplating additives the most critical parameters for controlling the electroplating process and coating properties. Convection and cathodic polarization are two essential parameters influencing the additives' interactions, but the electrolyte flow field distribution is complicated by the changed pattern size, and most electrolyte formulas cannot withstand such strong cathodic polarization. Therefore, we presented a novel electrolyte formula for ultra-high-rate DC copper pattern electroplating and employed three-dimensional flow field simulation to investigate the flow field distribution throughout the patterns. An ultra-high current density of 8 A/dm 2 was applied, ensuring a stable electroplating process. The pattern size-stimulated electrolyte flow rate trend was discovered by simulations. The mechanism of simultaneously achieving ultra-high-rate electroplating and coating property improvement was thoroughly investigated. An ultra-high rate of 150 μm/h and the dense, uniform copper pattern coating were achieved synchronously with weak convection and strong cathodic polarization. Utilizing the ultra-high-rate copper electroplating method offers a viable approach to expedite the production of electronic packaging substrate with enhanced efficiency.
研究领域:
材料科学
·
电子工程
✓ 已验证
产品关联
DOI
高影响因子
Surfaces and Interfaces
·
2025
·
IF 6.3
Yabing Zhang,Xiaofeng Dai,Hongbin Shi,Tao Wang
In this work, we demonstrate the catalytic application of magnetic core-shell copper-coated-nickel (Ni@Cu) nanoparticles (NPs) for dimethylamine borane (DMAB) reduced electroless plating copper to fabricate flexible, highly conductive copper patterns. The Ni@Cu NPs, with size of 40 to 46 nm and saturation magnetization of 9.13 emu/g, exhibited strong magnetism, which can be separated by a magnet. Furthermore, the NPs possessed superparamagetism, which meant that the NPs could quickly redisperse in a solvent once the external magnetic field was removed. The core-shell structure of Ni@Cu NPs offered distinct advantages: the nickel core facilitated straightforward magnetic separation, while the copper shell ensured effective dispersion and robust catalytic activity. As the catalyst seeds for electroless plating copper, the Ni@Cu NPs exhibited superior catalytic activity for preparing conductive, adhesive, antioxidative, and bendable flexible copper patterns. The resistivity of the obtained conductive copper patterns was quite low, approximately 1.2 times that of bulk copper. The surface of the copper patterns was smooth, with a relative roughness of 2.67 %, and remained stable under 2000 cycles bending test and 50 cycles 3 M tape test, without any increase in sheet resistance or detachment of the conductive coating. The results of this research will provide new perspectives and basics for the low-cost and large-scale preparation of flexible printed circuits, and will promote the development of the flexible electronics industry towards high efficiency and environmental friendliness.
研究领域:
材料科学
·
电子工程
✓ 已验证
产品关联
DOI
高影响因子
APPLIED SURFACE SCIENCE
·
2021
·
IF 6.707
Yabing Zhang,Teng Zhang,Hongbin Shi,Qing Liu,Tao Wang
Flexible conductive copper patterns with low electric resistance, good adhesion, and high stability were successfully prepared on heat-sensitive polyethylene terephthalate (PET) substrate by combining the inkjet print with copper nanoparticles (Cu NPs) conductive ink and electroless plating (ELP) copper at room temperature. The Cu NPs served as the catalysts to promote copper ions electroless deposition on PET surface. Dimethylaminoborane (DMAB) was used as the reductant to place poisonous formaldehyde in the electroless plating process. The Cu patterns had a strong adhesion with PET substrate modified by 3-Mercaptopropyltriethoxysilane (MPTES) and would not fall even after 4000 cycles bending test. The electric resistivity of patterns could be as low as 5.43 μΩ·cm, which is about three times that of bulk copper. The minimum sheet resistance of the patterns was 54 mΩ/sq and had little change in the atmosphere for five months, that showed the patterns had an excellent anti-oxidation performance.
研究领域:
材料科学
·
电子工程
✓ 已验证
产品关联
DOI
高影响因子
ELECTROCHIMICA ACTA
·
2018
·
IF 5.116
Yi Cheng,Jie Tang,Yi-Min Zhu,Yu Chang,Zhen-Guo Yang
Fabrication of conductive patterns by selective electroless plating is a widely studied process in recent years for its advantages of lower waste, simpler process, less pollution and lower cost compared to the traditional subtractive process. But the poor adhesion of the as-fabricated patterns is the prior problem of this process, which limits the thickness of the conductive patterns in sub micrometer range and thus degrades the electrical properties of the patterns. Many chemical and physical modifications have been used to increase the chemical bonding or physical interaction between substrates and deposited metal, but the effects are limited, especially after thick metal is deposited. However, increasing the interfacial mechanical anchor is an effective alternative to enhance the adhesion but has often been neglected. In our previous work, we have developed a novel patterning-adsorption-plating (PAP) process to additively fabricate copper patterns on flexible polymer substrates. In this paper, polystyrene (PS) microspheres are added into the ion-adsorption ink as templates to fabricate three-dimensional (3D) porous polysiloxane films. Thereafter, the as-fabricated copper patterns show excellent conductivity competitive to that of bulk copper and good adhesion with a distinct increase of mechanical anchor.
研究领域:
材料科学
·
电子制造技术
✓ 已验证
DOI
高影响因子
危险品化学品经营许可证（带存储）