Zhiwei Zhang,Zhengliang Zhang,Xubin Zhang,Zheng Wang,Fumin Wang,Guobing Li,Xu Zhang,Xingtao Wang,Qingzhao Liu
Water distillation as an effective method for detritiation and deuterium enrichment can be used to improve mass transfer efficiency by treating the packing surface. This study focuses on the effect of the wettability of the packings surface on the separation performance of the H 2 O-HDO system. Different hydrophilic effect coatings are prepared on the surface of copper packings by alkaline etching and oxidation method. The differences in mass transfer performance of packings with different contact angles are investigated. It is found that with the increase of hydrophilicity, the mass transfer performance of the packing is relatively improved. By combining empirical models of mass transfer and experimental data, a mathematical model for predicting the height equivalent of theoretical plate ( HETP ) is established to quantify the effect of wetting properties on the mass transfer process.
Heat accumulation has emerged as a critical issue that affects the performance and reliability of modern electronic devices in their evolving toward miniaturization, high power density and high integration. The application of thermal interface materials (TIMs) as a thermal management strategy is commonly employed to tackle this problem. Herein, we report the development and characterization of highly thermally conductive but electrically insulating Cu@Al 2 O 3 /epoxy composites. Stemming from the excellent thermal conductivity of Cu, the Cu@Al 2 O 3 /epoxy composites exhibit thermal conductivity of 1.32 W/m·K at 10 vol% filler content , which is nearly 7 times higher than that of the epoxy resin . Simultaneously, the Cu@Al 2 O 3 /epoxy composites still retain a high electrical resistivity of 2.3 × 10 13 Ω·cm, which is 6 orders of magnitude greater than that of Cu/epoxy composites without Al 2 O 3 barrier layers, because the dense nanoscale insulating Al 2 O 3 shell effectively inhibits the electron transfer . In addition, the Cu@Al 2 O 3 /epoxy composites possess lower dielectric constant and dielectric loss , and better mechanical properties than those of Cu/epoxy composites.
危险品化学品经营许可证（带存储）