JOURNAL OF COLLOID AND INTERFACE SCIENCE
·
2011
·
IF 3.068
Jingpeng Yuan,Yongchao Lai,Junling Duan,Quanqin Zhao,Jinhua Zhan
A mono-6-thio-β-cyclodextrin-modified silver film was synthesized via galvanic displacement on copper foil. The prepared silver films could enrich non-polar polychlorinated biphenyls (PCBs) molecules from hydrophilic phase using thiolate β-cyclodextrins (SH-β-CDs) as receptors. The components of as-prepared Ag-coated-Cu (Ag–Cu) film were confirmed by powder X-ray diffraction (XRD). Both surface-enhanced Raman spectroscopy (SERS) and energy dispersive X-ray spectroscopy (EDS) measurements gave strong evidences that the thiolated β-cyclodextrins (SH-β-CDs) had been immobilized on the surface of silver film. Compared to the substrates prepared in the absence of SH-β-CD, the surface morphology of the CD-modified Ag films was obviously changed. The interfacial enrichment and the capability of substrates to form inclusion complexes with PCBs molecules were tested by using PCB-15 (4,4′-dichlorobiphenyl) as the probe molecules via SERS technique. The measured SERS spectra could distinguish the PCB-15 molecules at micro-molar level according to the most intense CCC bending in-plane mode of PCBs. The enhancement factor (EF) of the SERS substrates for PCB-15 was 1.2 × 10 5 , which was comparable with a number of previous reports.
研究领域:
分析化学
·
材料科学
✓ 已验证
DOI
高影响因子
ACS Applied Materials & Interfaces
·
2020
·
IF 8.758
Yi-Min Zhu,Jie Tang,Xin Jin,Ting-Rui Pan,Yu Chang,Zhen-Guo Yang
To solve the problems of a conventional subtractive process for preparing conductive circuits, numerous alternative additive processes have been investigated, such as screen or inkjet printing, selective electroless plating, laser-induced forward transfer, etc. They all lead to a simpler procedure, less pollution, and finer line width but are still faced with difficulties like low conductivity and thickness, poor adhesion, and high cost. PDMS is a kind of material with low surface energy, leading to low adhesion with adhesive. Under these circumstances, a simple template transfer process for additively preparing conductive circuits is reported. The process to form the template includes the preparation of a photolithographic mask on the carrier copper foil and adsorption of PDMS anti-adhesion coating. Followed by metal deposition through electroplating on the template, the conductive circuits are transferred to the target substrate. Thus, the designed conductive circuits on various substrates including paper and cloth are formed. The template can be used again after being reimmersed into PDMS anti-adhesion coating. The components and the concentration of the coating are carefully discussed, and the mechanism of anti-adhesion is also researched by EIS and XPS. The copper circuits show a line width of 10 μm, a peeling strength of 7.11 N/cm, and a resistivity of 1.93 μΩ·cm, which is similar to that of bulk copper. With low pollution and cost, high versatility, and good electrical and adhesion performance, the template transfer process shows a good application prospect in the large-scale production of flexible electronics like sensors, RFID tags, etc.
研究领域:
材料科学
·
电子工程
✓ 已验证
DOI
高影响因子
Materials Research Express
·
2014
·Vol. 2
·期 1
·015501
·
IF 0
Guijuan Wei,Zhaojie Wang,Xixia Zhao,Juan Feng,Shutao Wang,Jun Zhang,Changhua An
In the present study, we have fabricated superhydrophobic CuO nanostructured surfaces by a simple solution-immersion process and a subsequent chemical modification with various thiol groups. The morphology of the CuO nanostructures on the copper foil could be easily controlled by simply changing the reaction time. The influences of reaction time and the thiol groups on hydrophobic properties have been discussed in detail. It is shown that the chemically modified CuO nanostructured surfaces present remarkable superhydrophobic performance and non-sticking behaviour. Furthermore, a lower corrosion current density (icorr) and a higher corrosion potential (Ecorr) of the prepared superhydrophobic surface was observed in comparison with the bare Cu foil by immersing in a 3.5 wt% NaCl solution, indicating a good corrosion resistance capability. Our work provides a general, facile and low-cost route towards the preparation of superhydrophobic surface, which has potential applications in the fields of self-cleaning, anti-corrosion, and oil–water separation.
研究领域:
材料科学
·
化学工程
✓ 已验证
产品关联
DOI
ACS Applied Materials & Interfaces
·
2020
·
IF 8.758
Minsong Huang,Zhenguo Yao,Qingping Wu,Yongjian Zheng,Jianjun Liu,Chilin Li
Anode interface modification is crucial for the stabilization of Li–metal batteries (LMBs), which have been considered as the most promising system for the electric vehicle market owing to their high energy density (500 W h kg–1). However, the biggest challenge for LMBs lies in the preservation of anode reversibility, including plated Li morphology control and dendritic Li inhibition during cycling. Here, we propose a nanostructure modulation strategy of Li grains and plating to activate the anode kinetics of LMBs without the compromise of anode stability. This modulation is triggered by the rapid deposition of ultrathin polydopamine coating on the Cu foil (PDA@Cu), which results in an unusual interlaced growth of vertical or lie-down two-dimensional Li nanoflakes on PDA. The high binding energy (>3 eV) between Li atoms and rich imino/carbonyl groups enables a superior lithiophilicity of PDA to homogenize the Li-ion flowing and Li-mass electroplating with negligible nucleation overpotential. The high Coulombic efficiency (98%) and low voltage hysteresis (∼20 mV) are stabilized for at least 300 cycles in the Li–PDA@Cu cell architecture. This PDA@Cu electrode can even tolerate much higher current densities of 5 and 10 mA cm–2 for 170 and 100 cycles, respectively. The interlaced network of Li nanosheets reinforces the electric contact and therefore charge transfer at the anode–electrolyte interface characterized by small interfacial resistance (<3 Ω cm2) and activation energy (0.28 eV). A viewpoint of robustness loss or mechanical heterogeneity in Li plating is discussed to disclose the evolution from column-like Li grains to porous Li sponges and then to compactly stacked Li nanoflakes with porosity shrinkage.
研究领域:
材料科学
·
电化学
✓ 已验证
DOI
PubMed
高影响因子
Journal of Materials Research and Technology-JMR&T
·
2025
·
IF 6.6
Peng Xu,Weiwei Lu,Qianqian Zhu,Hao Hu,Haitao Liu,Binfeng Fan,Qingfu Wang,Xiangkui Yang,Kexing Song
To meet the stringent requirements of electrodeposited copper foil, graphene (Gr) has been recognized for its potential as an outstanding reinforcement agent, capable of significantly improving the mechanical and functional characteristics of copper foils. However, the effectiveness of Gr is often hindered by its poor dispersion and the weak interfacial bond strength with the metal matrix. In this study, we present a novel strategy that utilizes ionic liquid (IL) as a functionalizing agent to stabilize Gr for enhancing its reinforcement capabilities. This method has been demonstrated to successfully prepare copper foils with superior mechanical properties. Firstly, the impact of IL-functionalization on the dispersion, stability, morphology, and charge state of Gr was investigated. Subsequently, the IL-functionalized Gr (IL-Gr), serving as a reinforcement, was co-deposited with Cu 2+ ions to fabricate copper foil. The results revealed that the surface functionalization resulted in a well-dispersed and positively-charged Gr in solution. Under optimized conditions, the copper foil exhibited remarkable improvements compared to those prepared without IL-Gr. Specifically, the surface roughness decreased from 3.582 to 2.834 μm, while the tensile strength and elongation values of the copper foil increased from 253.7 MPa and 2.29% to 471.5 MPa and 7.19%, respectively. Further characterizations indicated that this simultaneous enhancement in both tensile strength and elongation could be ascribed to the refining grains (0.23 μm) and an increase in the density of Σ3 twin boundaries (23.4%), resulting from the cathode polarization of IL-Gr. Overall, our innovative and facile approach provides an effective method for fabricating high-performance electrodeposited copper foils.
研究领域:
材料科学
·
电化学
✓ 已验证
产品关联
DOI
高影响因子
Micromachines
·
2021
·Vol. 12
·期 10
·1236
·
IF 2.891
Kaiqiang Yang,Jianlong Liu,Ruirui Jiang,Yubin Gong,Baoqing Zeng,Zichuan Yi,Qingguo Gao,Jianjun Yang,Feng Chi,Liming Liu
The nucleation of graphene at different locations in the quartz boat was studied, and the lowest nucleation density of graphene in the quartz boat was found. The nucleation density of graphene is the lowest at the bottom of the quartz boat near the gas inlet side. Based on the above results, a simple and reproducible way is proposed to significantly suppress the nucleation density of graphene on the copper foil during the chemical vapor deposition process. Placing the copper foil with an area of 1.3 cm × 1 cm in the middle of the bottom of the quartz boat or further back, and placing two copper pockets in front of the copper foil, an ultra-low nucleation density of ~42 nucleus/cm2was achieved on the back of the copper foil. Single-crystal monolayer graphene with a lateral size of 800 μm can be grown on the back of copper foils after 60 min of growth. Raman spectroscopy revealed the single-crystal graphene to be in uniform monolayers with a low D-band intensity.Keywords:single-crystal graphene;nucleation density;quartz boat;copper foils;copper pockets
研究领域:
材料科学
·
化学
✓ 已验证
产品关联
DOI
PubMed
高影响因子
JOURNAL OF ELECTROANALYTICAL CHEMISTRY
·
2024
·
IF 4.1
Ziyi Guo,Cuizhu Ye,Yi Shen
Nitrate reduction reaction (NO 3 - RR), an emerging technology for clean and efficient nitrate removal, is of great significance to reduce water pollution. In this study, NO 3 - RR activity was assessed on the copper foils, and the effects of various variables including initial pHs, temperatures, and nitrate concentrations on the NO 3 - RR were investigated. The copper foils displayed excellent NO 3 - RR activity with a high ammonium selectivity of 45% at pH = 1 and a conversion rate of 55% at pH = 13. The conversion of nitrate to nitrite was the rate determining step at pH = 7 and pH = 13. Oxalic ions displayed significant inhibition effects on NO 3 - RR by copper foils in the acidic and alkaline electrolytes. In particular, the inhibition effect of oxalate ions on NO 3 - RR approached to 50% with a nitrate/oxalate ratio of 2:1 in acidic media, which is likely attributed to the formation of complexes between oxalate ions and the copper surface. Such an inhibition effect is not noted in the neutral electrolyte. Structural characterizations including atomic force microscopy, Raman spectroscopy and Fourier transform infrared spectroscopy elucidated that the oxalate ions occupied a large number of the copper sites on the surface of copper foil to form competitive adsorption with nitrate. The experimental parameters for NO 3 - RR by copper foils were comprehensively analyzed, affording new insights on the complex interactions between the copper, nitrate, and oxalate.
研究领域:
环境科学
·
电化学
✓ 已验证
产品关联
DOI
高影响因子
ACS Applied Materials & Interfaces
·
2016
·
IF 7.145
Yu Chang,Zhen-Guo Yang
The traditional subtractive process to fabricate conductive patterns is environmentally harmful, wasteful, and limited in line width. The additive process, including direct printing of conductive paste or ink, direct printing of catalytic ink, laser-induced forward transfer, etc., can solve these problems. However, the current additive process also faces many difficulties such as low electrical and adhesion properties, low pattern thickness, high cost, etc. Benzotriazole (BTA), as widely used corrosion inhibitor, can be adsorbed onto a copper surface. The electroplated copper film on BTA-adsorbed copper foil shows poor adhesion. On the basis of this phenomenon, a novel template transfer process to additively fabricate conductive patterns has been developed. A permeant antiadhesive mask is printed on carrier copper foil, and then, BTA is adsorbed onto the exposed area of the carrier foil, thus forming the template. The template is electroplated to grow conductive patterns in the exposed parts, and then can be adhered to the flexible substrate. The substrate is peeled off, with the transfer of the conductive patterns to the substrate, to form the designed conductive patterns on PET. By reimmersing the template into BTA solution, the template can be used again. The mechanism of BTA adsorption and the reason for the low peeling strength are researched using Raman spectra, XPS and electrochemical impedance spectroscopy. Copper patterns more than 20 μm in thickness can be prepared on PET, the resistivity of the prepared copper patterns is 2.01 μΩ cm, which is about the same as bulk copper, and the peeling strength of the pattern on PET is measured to be 6.97 N/cm. This template transfer process, with no waste, low pollution, high electrical and adhesion properties, and low cost, shows high potential in the large scale manufacturing of electronic devices, such as RFID circuitry, FPCs, etc.
研究领域:
材料科学
·
电子工程
✓ 已验证
DOI
高影响因子
JOURNAL OF MATERIALS SCIENCE
·
2025
·
IF 3.9
Yang Lei,Lu Xige,Zhong Shuiping,Zhu Huanlin,Weng Wei,Tan Wen,Chi Xiaopeng
Copper foil roughness is widely regarded as an important factor affecting the performance of lithium-ion batteries, but relevant research still lacks systematic and in-depth analysis. In this paper, 6 μm copper foil is prepared by electrodeposition and compared with purchased 6 μm copper foil. The influence of different roughness on the battery performance is analyzed by the distribution of relaxation time (DRT). The results show that the roughness of homemade copper foil (1.69 μm) is slightly higher than that of purchased copper foil (1.53 μm). The initial charging specific capacity of the homemade copper foil electrode reaches 372.51 mAh g −1 , significantly higher than that of the purchased copper foil electrode (323.89 mAh g −1 ). DRT is used to analyze the electrochemical reaction kinetics of the batteries, it is found that the copper foil with a certain roughness can enhance its binding with the active substance, ensure stable and rapid conductive contact, reduce the side reaction caused by uneven lithiation, and minimize the increase in the impedance of each part during the electrode cycle, thereby ensuring stable battery operation. This study provides new insights into the application of copper foil in batteries and verifies the feasibility of homemade 6 μm copper foil.
研究领域:
材料科学
·
电化学
·
能源存储
✓ 已验证
DOI
高影响因子
ACS Applied Materials & Interfaces
·
2023
·
IF 9.5
Yi Liu,Guoan Tai,Chuang Hou,Zitong Wu,Xinchao Liang
Borophene has drawn tremendous attention in the past decade for a wide range of potential applications owing to its unique structural, optical, and electronic properties. However, applications of borophene toward next-generation nanodevices are mostly theoretical predictions, while experimental realization is still lacking due to rapid oxidation of intrinsic borophene in an air environment. Here, we have successfully prepared structurally stable and transferrable few-layer β12-borophane on copper foils by a typical two-zone chemical vapor deposition method, where bis(triphenylphosphine)copper tetrahydroborate was used as the boron source in a hydrogen-rich atmosphere to stabilize its structure through hydrogenation. The crystal structure of the as-prepared β12-borophane is in good agreement with previous reports. A fabricated photodetector based on β12-borophane–silicon (n-type) Schottky junction shows good photoelectric responses to light excitations in a wide wavelength range from 365 to 850 nm. Especially, the photodetector exhibits a good photoresponsivity of around 0.48 A W–1, a high specific detectivity of 4.39 × 1011 jones, a high external quantum efficiency of 162%, and short response and recovery times of 115 and 121 ms under an ultraviolet light with the wavelength of 365 nm at a reverse bias of 5 V. The results show great potential applications of borophane in next-generation nanophotonic and nanoelectronic devices.
研究领域:
材料科学
·
纳米技术
✓ 已验证
产品关联
DOI
PubMed
高影响因子
Waste and Biomass Valorization
·
2023
·
IF 3.2
Li Zhi-jian,Wang Wei,Jiang Long-jin,Chang Zhi-dong,Ma Xi-ping,Luo Xin
In order to extend the duration of the electrolyte solution in which copper granules recovered from waste printed circuit board are refined through electrolysis to obtain copper foil with high purity and which is contaminated by the accumulation of metallic impurities along with the refinery of waste printed circuit board, the leaching and electrowinning processes are used to pretreat the copper granules. The effects of impurities of copper granules as well as H 2 SO 4 mole ratio, leaching temperature, liquid-solid ratio, and operation time on the removing efficiencies of Zn, Sn, Fe and Al, were studied. The results showed that more than 95% of impurities can be removed when the mole ratio of impurities to H 2 SO 4 was 1:4, the temperature was 70 °C, the liquid-solid ratio was 20 mL/g, along with the leaching time of 180 min. After 1440 min electrolysis of the pretreated granules with the electric current density of 40 mA/cm 2 , the purity of refined copper foil maintained at 99% in contrast with 95% which copper granules are without pretreatment. The maximal concentration of the accumulated ions of impurities is less than 60 mg/L, which suggests that sulfuric acidic pretreatment is a promising approach to increase the duration of the electrolyte solution.
研究领域:
环境科学
·
材料科学
✓ 已验证
产品关联
DOI
高影响因子
JOURNAL OF APPLIED ELECTROCHEMISTRY
·
2020
·Vol. 51
·期 3
·489-501
·
IF 2.384
Yu Weiyi,Lin Chaoyu,Li Qingyang,Zhang Jinqiu,Yang Peixia,An Maozhong
As a crucial material for fabrication of lithium-ion battery current collector, the properties of electrodeposited copper foil are closely related to the battery performances. How to improve its properties is thus of great importance for battery design and manufacturing. In this paper, we reported a novel composite additive, consisting of collagen, glycerol, hydroxyethyl cellulose, and sodium polydisulfide dipropane sulfonate, for electrodeposition of high-quality copper foil from conventional acid copper sulfate bath. Meanwhile, a pulse superimposed on direct current was used during the preparation process of copper foil. It was demonstrated that the additive could improve the foil’s performances, through changing the kinetic parameters of copper electrodeposition in sulfate bath. The optimized bath has a higher allowable current density during superimposed current electrodeposition, in contrast to the situation in direct current electrodeposition. This may then lead to an increase in deposition rate of copper foil, and a further improvement in surface roughness, grain size, residual stress, as well as elongation. Specially, the superimposed current offers a number of adjustable parameters for modulating copper foil’s properties in a wide range. Graphic abstract
研究领域:
材料科学
·
电化学
·
能源工程
✓ 已验证
DOI
高影响因子
危险品化学品经营许可证（带存储）