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Micromachines · 2023 ·Vol. 14 ·期 9 ·1663 · IF 3.4

Study on Low-Temperature Conductive Silver Pastes Containing Bi-Based Glass for MgTiO3 Electronic Power Devices

Yunsheng Fu,Xianglei Yu,Li Liu,Xianjie Tang,Junpeng Li,Guoyou Gan

Low-temperature lead-free silver pastes deserve thorough investigation for sustainable development and application of MgTiO3ceramics in electronic devices. In this study, a series of Bi2O3-B2O3-ZnO-SiO2-Al2O3-CaO glasses with suitable softening temperatures were prepared via melt quenching using a type of micrometer silver powder formed by silver nanoparticle aggregates. The composite pastes containing silver powder, Bi2O3glass powder and an organic vehicle were then screen-printed. The effects of glass powder concentration and sintering temperature on the microstructure of the surface interface were also investigated. The results showed that the silver paste for microwave dielectric ceramic filters (MgTiO3) possessed good electrical conductivity (2.28 mΩ/□) and high adhesion (43.46 N/mm2) after medium temperature (670 °C) sintering. Thus, this glass powder has great application potential in non-toxic lead-free silver pastes for metallization of MgTiO3substrates.Keywords:silver paste;MgTiO3;bonding strength;low-temperature sintering

研究领域: 材料科学 · 电子工程
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Materials Research Express · 2023 ·Vol. 10 ·期 4 ·045201 · IF 2.3

The silver paste containing ZnO-B2O3-SiO2 glass sintered at high temperature with low solid content formed high performance conductive thick film on MgTiO3 microwave ceramics

Yun Chuan Liu,Li Ying Zhang,Xiang Lei Yu,Wei Chao Li,Jun Peng Li,Guo You Gan

A high-temperature conductive silver slurry containing lead-free ZnO-B2O3-SiO2 glass for metallization of ceramic MgTiO3 substrate has been prepared. The ZnO-B2O3-SiO2 glass was obtained by high-temperature melting and cold extraction with a transition temperature (Tg) of 579 °C and thermal stability (∆T) of 105 °C as an inorganic bonding phase of high-temperature conductive silver paste. Then, silver paste with different glass powder content was sintered on ceramic MgTiO3 substrate between 730 °C and 930 °C in increments of 50 °C. Characterization of the prepared materials revealed that their resistivity increases with the increase in glass powder content and decreases with the increase in sintering temperature. Sintering temperature and glass content have significant effects on the resistivity and adhesion of the thick silver film. When the silver paste with a glass content of 1.1 wt% was sintered at 830 °C for 10 min, the resulting thick silver film had a low resistivity of 1.81 μΩ·cm (1.65 μΩ·cm for silver) and a good adhesive strength of 39.4 N mm−2. During the sintering process, the glass material melts and wets the silver powder, which promotes the sintering of the silver powder to form a dense network structure and improves the electrical conductivity of the silver film. In addition, the formation of ZnTiO3 by chemical reactions between the glass and the substrate was observed, which dramatically improved the bonding strength of the silver film. Therefore, lead-free silver paste containing ZnO-B2O3-SiO2 glass powder and MgTiO3 ceramics has broad development prospects in ceramic filters.

研究领域: 材料科学 · 电子工程
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