Micromachines
·
2023
·Vol. 14
·期 9
·1663
·
IF 3.4
Yunsheng Fu,Xianglei Yu,Li Liu,Xianjie Tang,Junpeng Li,Guoyou Gan
Low-temperature lead-free silver pastes deserve thorough investigation for sustainable development and application of MgTiO3ceramics in electronic devices. In this study, a series of Bi2O3-B2O3-ZnO-SiO2-Al2O3-CaO glasses with suitable softening temperatures were prepared via melt quenching using a type of micrometer silver powder formed by silver nanoparticle aggregates. The composite pastes containing silver powder, Bi2O3glass powder and an organic vehicle were then screen-printed. The effects of glass powder concentration and sintering temperature on the microstructure of the surface interface were also investigated. The results showed that the silver paste for microwave dielectric ceramic filters (MgTiO3) possessed good electrical conductivity (2.28 mΩ/□) and high adhesion (43.46 N/mm2) after medium temperature (670 °C) sintering. Thus, this glass powder has great application potential in non-toxic lead-free silver pastes for metallization of MgTiO3substrates.Keywords:silver paste;MgTiO3;bonding strength;low-temperature sintering
研究领域:
材料科学
·
电子工程
✓ 已验证
产品关联
DOI
PubMed
高影响因子
CRYSTENGCOMM
·
2025
·
IF 2.6
Yi-Chen Guo,Xiao-Gang Liao,Qi Wu,Yu-Xuan Hao,Zi-Hao Wang,Wen-Yan Zhang,Yao-Yu Wang
Enhancing the conductivity of silver paste is crucial for achieving high photoelectric conversion efficiency of heterojunction solar cells. In this work, 1-tetradecanol-coated Ag2O was used as a silver precursor, replacing nano-silver powder in the conventional silver paste. Low-temperature sintering (200 °C) was utilized to establish a conductive pathway between flaky and spherical silver powder, resulting in a low-cost, low-temperature cured silver paste. The effect of 1-tetradecanol content on Ag2O was investigated, focusing on the electrical conductivity, silver paste rheological properties and adhesion properties of low-temperature cured silver paste film layers. The results showed that the volume resistivity of the paste containing 1-tetradecanol (10 wt%)-coated Ag2O after sintering at 200 °C for 30 min was 7.44 × 10−5 Ω cm, which was 35% lower than that of pure silver powder paste, indicating a significant enhancement in electrical conductivity. Furthermore, rheological performance tests demonstrated that the incorporation of Ag2O was an effective route for enhancing the thixotropy, recovery, and stability of the paste. Meanwhile, an adhesion experiment demonstrated that silver pastes with introduced Ag2O (≥5 wt%) exhibited a robust bonding to the ITO substrate under low-temperature curing, with an ASTM grade of 5B.
研究领域:
材料科学
·
能源技术
✓ 已验证
产品关联
DOI
高影响因子
JOURNAL OF ELECTRONIC MATERIALS
·
2019
·Vol. 48
·期 5
·2745-2753
·
IF 1.676
Zhan Haijiao,Guo Jiayu,Shen Jiali,Wang Xiaorong,Fan Zhonghua,Guo Bing,Liu Wei,Shen Hangyan
Silver microparticles have inspired much research interest due to their enhanced properties for use in optical, electric, catalytic, and magnetic applications. One such use is as electrically conductive filler for printed electronics. A manufacturing approach has been developed to prepare low-curing-temperature silver pastes. Firstly, silver flakes were synthesized directly by a one-step aqueous-phase reduction reaction, using silver nitrate as silver salt precursor and iron(II) sulfate heptahydrate as reducing agent. Various silver flake samples were synthesized by controlling experimental parameters such as the reaction temperature, surfactant concentration, and reducing agent concentration. The obtained silver powders were characterized by x-ray diffraction analysis, scanning electron microscopy, and dynamic light scattering measurements. The results revealed that the morphology of the silver powders was a plate-like structure with diameter of 1 μ m to 1.5 μ m and thickness of 30 nm. The prepared silver flakes were then used directly without ball milling to prepare low-curing-temperature silver pastes. The bulk resistivity of a line screen-printed using silver paste containing 48 wt.% (34 ± 5 vol.%) silver flakes and cured at 140°C for 30 min in air was about (1.773 ± 0.118) × 10 −6 Ω m. More importantly, the prepared screen-printed patterns exhibited excellent durability in terms of peel strength and folding endurance.
研究领域:
材料科学
·
纳米技术
·
电子工程
·
应用化学
·
先进制造
✓ 已验证
DOI
高影响因子
Materials Research Express
·
2024
·Vol. 11
·期 5
·055002
·
IF 1.8
Siqi Quan,Guoyou Gan,Xiang lei Yu,Xian jie Tang,Hu Sun,Zhuo Qian,Junpeng Li
The investigation of conductive silver pastes and inks has witnessed extensive research within the domain of printed electronics in recent years, primarily owing to the exceptional electrical conductivity and steadfastness intrinsic to silver. This paper introduces an approach for the fabrication of stable, cost-effective, and low-resistance conductive silver paste tailored for flexible printed circuits. This method facilitates the solidification of the conductive silver paste into a highly conductive silver film at a curing temperature of 250 °C. In the process of preparing the conductive silver paste, Ag flakes is subject to modification through the incorporation of Ag NPs, which are subsequently sintered at a low temperature curing setting. The sintering of Ag NPs serves to establish connections between adjacent particles of Ag flakes within the paste, thereby enhancing the conductivity and flexibility of the resulting conductive printed silver film. When the ratio of Ag NPs to Ag flakes is maintained at 10:90, the volume resistivity of the Ag NPs-modified film registers at 2.7 × 10−5 Ω.cm. This demonstrates a substantial 53.45% reduction in the volume resistivity of the conductive printed silver film modified with Ag NPs, compared to its Ag NPs-absent counterpart. Post 200 cyclic bending tests, it becomes evident that the resistance change rate in the Ag NPs-modified conductive printed silver film is a mere 12.5%, whereas the Ag NPs-modified silver film lacking Ag NPs displays a resistance change rate of 21.5%. This discrepancy underscores the capacity of Ag NPs-modified Ag flakes to fortify the bending resistance of the conductive printed silver film. Comprehensive data analysis substantiates that the improvements in electrical conductivity and bending resistance can be attributed to the superior bridging facilitated by the sintering process on the surface of the Ag NPs-modified Ag flakes.
研究领域:
材料科学
·
印刷电子技术
✓ 已验证
产品关联
DOI
高影响因子
Materials Research Express
·
2023
·Vol. 10
·期 4
·045201
·
IF 2.3
Yun Chuan Liu,Li Ying Zhang,Xiang Lei Yu,Wei Chao Li,Jun Peng Li,Guo You Gan
A high-temperature conductive silver slurry containing lead-free ZnO-B2O3-SiO2 glass for metallization of ceramic MgTiO3 substrate has been prepared. The ZnO-B2O3-SiO2 glass was obtained by high-temperature melting and cold extraction with a transition temperature (Tg) of 579 °C and thermal stability (∆T) of 105 °C as an inorganic bonding phase of high-temperature conductive silver paste. Then, silver paste with different glass powder content was sintered on ceramic MgTiO3 substrate between 730 °C and 930 °C in increments of 50 °C. Characterization of the prepared materials revealed that their resistivity increases with the increase in glass powder content and decreases with the increase in sintering temperature. Sintering temperature and glass content have significant effects on the resistivity and adhesion of the thick silver film. When the silver paste with a glass content of 1.1 wt% was sintered at 830 °C for 10 min, the resulting thick silver film had a low resistivity of 1.81 μΩ·cm (1.65 μΩ·cm for silver) and a good adhesive strength of 39.4 N mm−2. During the sintering process, the glass material melts and wets the silver powder, which promotes the sintering of the silver powder to form a dense network structure and improves the electrical conductivity of the silver film. In addition, the formation of ZnTiO3 by chemical reactions between the glass and the substrate was observed, which dramatically improved the bonding strength of the silver film. Therefore, lead-free silver paste containing ZnO-B2O3-SiO2 glass powder and MgTiO3 ceramics has broad development prospects in ceramic filters.
研究领域:
材料科学
·
电子工程
✓ 已验证
DOI
高影响因子
Materials
·
2022
·Vol. 15
·期 5
·1953
·
IF 3.748
Yujun Gao,Jingjing Feng,Feng Liu,Zhifu Liu
Silver paste is widely used for low-temperature co-fired ceramic (LTCC) electrodes. In this work, a kind of LTCC silver paste for fine-line screen-printing was developed by considering the effect of the organic vehicle on rheological behavior and screen-printing properties. A step-by-step volatilization mode was applied to screen the mixed organic solvent ofα-terpineol, 2-(2-butoxyethoxy) ethyl acetate (BCA) and dibutyl phthalate (DBP). Theα-terpineol:BCA:DBP ratio of 5:2:3 is selected by considering the volatility, viscosity, and pseudoplasticity of the organic vehicle. Both viscosity and pseudoplasticity of shear-thinning increase with the increase of ethyl cellulose (EC) organic binder content. Three interval thixotropy test (3ITT) was conducted to discuss the thixotropy of silver paste. The minimum printing line width of 13.27 µm is obtained using silver paste with 10 wt% EC, confirming that the homemade paste has good printability.
研究领域:
材料科学
·
电子工程
✓ 已验证
DOI
高影响因子
Materials
·
2024
·Vol. 17
·期 2
·445
·
IF 3.1
Xianglei Yu,Hu Sun,Zhuo Qian,Weichao Li,Wei Li,Fuchun Huang,Junpeng Li,Guoyou Gan
Silver powder, as the primary component of solar silver paste, significantly influences various aspects of the paste’s performance, including printing, sintering, and conductivity. This study reveals that, beyond the shape and size of the silver powders, their microstructure is a critical factor influencing the performance of both silver powders and silver pastes in solar cell applications. The growth process leads to the formation of either polycrystalline aggregated silver powder or crystal growth silver powder. Analyzing the performance characteristics of these different microstructures provides guidance for selecting silver powders for silver pastes at different sintering temperatures. Polycrystalline aggregated silver powder exhibits higher sintering activity, with a sintering initiation temperature around 450 °C. The resulting silver paste, sintered at 750 °C, demonstrates a low sheet resistance of 2.92 mΩ/sq and high adhesion of 2.13 N. This silver powder is suitable for formulating silver pastes with lower sintering temperatures. The solar cell electrode grid lines have a high aspect ratio of 0.37, showing poor uniformity. However, due to the high sintering activity of the silver powder, the glass layer dissolves and deposits more silver, resulting in excellent conductivity, a low contact resistance of the silver electrode, a low series resistance of the solar cell of 1.23 mΩ, and a high photoelectric conversion efficiency of 23.16%. Crystal growth silver powder exhibits the highest tap density of 5.52 g/cm3. The corresponding silver paste shows improved densification upon sintering, especially at 840 °C, yielding a sheet resistance of 2.56 mΩ/sq and adhesion of 3.05 N. This silver powder is suitable for formulating silver pastes with higher sintering temperatures. The solar cell electrode grid lines are uniform with the highest aspect ratio of 0.40, resulting in a smaller shading area, a high fill factor of 81.59%, and a slightly higher photoelectric conversion efficiency of 23.17% compared to the polycrystalline aggregated silver powder.
研究领域:
材料科学
·
能源技术
✓ 已验证
产品关联
DOI
PubMed
高影响因子
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
·
2024
·Vol. 35
·期 10
·1-12
·
IF 2.8
Xue Tiange,Huang Zeya,Zhang Xiaotian,Meng Meng,Yu Shixiang,Chen Tian,Fu Renli
In this paper, the effects of the composition and sintering process of the conductive silver paste on the packaging and electrical interconnection performance of the silicon carbide high temperature pressure sensor are studied in detail. At the same time, a self-built high temperature reliability test platform is used to test the electrical interconnection reliability of the conductive silver paste under high temperature environments. The results show that flake silver powder can not only effectively promote the density of the conductive silver paste, but also improve the grain boundary migration behavior of the conductive silver paste, thereby improving the electromigration resistance of the sintered silver. The prepared conductive silver paste has good compatibility with high temperature pressure sensor materials such as SiC, AlN, and Pt, and the adhesion strength reach 23.12 MPa, 26.35 MPa, and 19.22 MPa, respectively. When the silver paste does not contain flake silver, the sheet resistance of the sintered silver paste is the lowest at 650 °C, which is only 2.58 mΩ/□, and there is still room for improvement. The high temperature stability test shows acceptable performance, but in the high current test with a current density of 125 A/mm 2 , the failure time is only 105 min. After adding 20 wt% of flake silver powder, the sheet resistance of the silver paste can be further reduced to 1.50 mΩ/□ by 41.9%, and the failure time can be extended to 158 min, with a 50.5% increase.
研究领域:
材料科学
·
电子工程
✓ 已验证
产品关联
DOI
高影响因子
MOLECULES
·
2022
·Vol. 27
·期 22
·8030
·
IF 4.927
Youliang Cheng,Jin Zhang,Changqing Fang,Wenke Qiu,Hao Chen,Haonan Liu,Ying Wei
Conductive silver paste is a key material in the fields of printed circuits and printed electronic devices. However, the preparation of conductive silver paste with low-cost and volatile organic compounds (VOCs) is still a challenge. In this work, conductive silver pastes with excellent comprehensive performances were developed by using water-borne polyurethane (WPU) as the bonding phase and using the ternary mixture of Ag microflakes (Ag MFs), Ag nanowires (Ag NWs), and Ag nanoparticles (Ag NPs) as the conductive phase. WPU endowed conductive silver pastes with the adhesion along with releasing a few VOCs during the curing. Results showed that a small amount of Ag NPs or Ag NWs dramatically enhanced the electrical conductivity of silver paste paint film filled only with Ag MFs. The electrical resistivity for optimal ternary mixture conductive silver paste was 0.2 × 10−3Ω∙cm, and the conductive phase was composed of 20.0 wt% Ag MFs, 7.5 wt% Ag NWs, and 2.5 wt% Ag NPs. Meanwhile, the adhesive strength and hardness of silver paste paint film were effectively improved by increasing the curing temperature. The optimal overall performance of the conductive silver pastes was achieved at the curing temperature of 160 °C. Therefore, this work can provide a new route for preparing conductive silver pastes with high performances.Keywords:conductive silver paste;Ag microflakes;Ag nanoparticles;Ag nanowires;ternary fillers
研究领域:
材料科学
·
电子工程
✓ 已验证
DOI
PubMed
高影响因子
Materials Research Express
·
2020
·Vol. 7
·期 10
·105001
·
IF 1.929
Lin Tang,Guoyou Gan,Xianglei Yu,Chengbin Liu,Junhua Cheng
Due to the high conductivity and stability of silver, silver ink has been widely used in the field of printed electronics. However, since mechanical strain would cause the contact between key particles to be broken. Recently, higher requirements have been put on the bending resistance of silver paste. In this experiment, by preparing Ag NPs: Ag Flakes composite materials of 20:80 and 30:70 respectively, a new method for preparing stable modified flake silver powder is proposed, and the attachment and growth methods of Ag NPs reduced on micron flake silver powder is discussed. Flake silver powder, dispersant and reducing agent are added to the silver-ammonia complex, and the nano-silver particles are reduced on the flake silver powder by controlling the reaction conditions. When Ag+: Ag Flakes in the solution is 30:70, there is a clear interface between the silver particles and the silver flakes, and the size distribution range is between 10 and 100 nm; when Ag+: Ag Flakes is 20:80, the distance between the nano-silver particles and the silver plate crystal plane is about 0.222 nm and 0.260 nm, these spacings represent the (1–12) and (004) planes of Ag, respectively. The reduced silver particles grow on the surface of the silver sheet, the size is about 5 ∼ 60 nm, and form a sheet-point combination of shaped silver powder, which can be used to make conductive silver paste with cost and performance competitiveness. The reaction can be completed at room temperature (5 ∼ 25 °C) and atmospheric pressure (80 ∼ 100 kPa), the operation is simple, the reaction time is short, and it has a positive effect on the commercial production of printable highly conductive silver paste.
研究领域:
材料科学
·
纳米技术
·
电子材料
✓ 已验证
DOI
高影响因子
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
·
2024
·
IF 11.2
Mei-Ling Yang,Guo-Xiang Zhou,Ning Xie,Kun-Peng Lin,Yan-Zhao Zhang,Zhe Zhao,Yun-Peng He,Yu-Hang Zhang,Zhi-Hua Yang,De-Chang Jia,Yu Zhou
Electronic 3D printing possesses a remarkable molding ability and convenience in integrated circuits, flexible wearables, and individual automobile requirements. However, traditional 3D printing technology still struggles to meet the demands of high precision and high efficiency in the process of fabricating a curved surface circuit, particularly achieving precise silver circuit molding on irregular substrates. Here, a high-precision and muti-scaled conformal manufacturing method for silver circuits is presented through the digital light processing (DLP) of ultraviolet-curable silver paste (UV-SP) with adjustable photocuring properties, enabling the successful preparation of micro-scaled conductive structure on the sharply skewed hook face. The minimum modeling depth and width of the cured silver paste can be well controlled to 10 and 88 µm, respectively. Compared with traditional printing technology, the printing efficiency of complex patterns has increased by over 70 %. The printed silver circuit demonstrates an exceptionally high electrical conductivity, reaching as high as 1.16 × 10 7 S/m. Additionally, the UV-SP exhibits significant manufacturing efficiency and superior molding resolution compared to conventional direct ink writing and inkjet printing techniques, thereby contributing to the attainment of high precision and efficiency of conformal and micro-molding manufacturing in sensors, communication antennas, and other electronic devices based on curved substrates.
研究领域:
电子制造
·
材料科学
·
3D打印技术
✓ 已验证
产品关联
DOI
高影响因子
IEEE Transactions on Components Packaging and Manufacturing Technology
·
2024
·Vol. 14
·期 1
·10-17
·
IF 2.3
Bowen Zhang,Xinyan Lu,Haoxiang Ma,Di Wang,Yun-Hui Mei
The spontaneous aggregation and weak stability of nanosilver particles largely overshadowed the application of nanosilver paste as die-attach materials in wide bandgap (WBG) devices. Taking advantage of the self-decomposition of silver-ammonia complexes to form silver particles, a novel particle-free silver paste was successfully developed to achieve higher sintering driving force as well as bonding quality. The proposed silver paste not only promotes the decomposition of silver complex but also reduces the oxygen requirement during the decomposition process, which significantly increases the shear strength from 23.8 to 59.4 MPa. The crystallization behavior and microstructure evolution confirm that the temperature required for the formation of silver particles in the proposed silver paste was reduced to 150 °C. At the same time, the necking growth also occurred at the low temperature of 150 °C, which is much lower than previous research and successfully confirms the higher sintering driving force of the proposed silver paste. More importantly, the proposed sintered silver paste exhibited high thermal stability, and the overall shear strength degradation was only 29.5% after 1000 cycles of thermal shock test (TST). The high sintering driving force combined with the high thermal reliability of the proposed silver-complex paste enables the development of high-performance WBG semiconductors with superior mechanical and electrical properties.
研究领域:
材料科学
·
电子工程
✓ 已验证
产品关联
DOI
高影响因子
危险品化学品经营许可证（带存储）