Materials
·
2019
·Vol. 12
·期 17
·2793
·
IF 2.972
Hongyu Dong,Xin Li,Yi Dong,Shaoqing Guo,Liangfu Zhao
In a conventional electrically conductive adhesive (ECA) preparation process, typical ECAs are made by adding an appropriate amount of electrically conductive fillers, such as silver, into a polymer matrix, such as epoxy resin, to form a uniformly dispersed mixture by mixing and stirring operations. However, during the preparation process, secondary pollution and mass loss are caused by the vigorous mixture process. At the same time, the stirring operation introduces many small and stable bubbles, which affect the electrical conductivity of the ECAs. In light of these problems with the conventional preparation of ECAs, we developed a novel ECA preparation method that employs a powder spraying process: silver flakes are sprayed into the epoxy resin with a certain mass fraction to form formulated pastes. The as-prepared ECAs exhibited excellent properties compared with those prepared by the conventional process. This proves that the powder spraying process is feasible and superior to the conventional process.Keywords:electrically conductive adhesives;silver flakes;electrical resistivity
研究领域:
材料科学
·
电子工程
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DOI
PubMed
高影响因子
Materials Research Express
·
2024
·Vol. 11
·期 5
·055002
·
IF 1.8
Siqi Quan,Guoyou Gan,Xiang lei Yu,Xian jie Tang,Hu Sun,Zhuo Qian,Junpeng Li
The investigation of conductive silver pastes and inks has witnessed extensive research within the domain of printed electronics in recent years, primarily owing to the exceptional electrical conductivity and steadfastness intrinsic to silver. This paper introduces an approach for the fabrication of stable, cost-effective, and low-resistance conductive silver paste tailored for flexible printed circuits. This method facilitates the solidification of the conductive silver paste into a highly conductive silver film at a curing temperature of 250 °C. In the process of preparing the conductive silver paste, Ag flakes is subject to modification through the incorporation of Ag NPs, which are subsequently sintered at a low temperature curing setting. The sintering of Ag NPs serves to establish connections between adjacent particles of Ag flakes within the paste, thereby enhancing the conductivity and flexibility of the resulting conductive printed silver film. When the ratio of Ag NPs to Ag flakes is maintained at 10:90, the volume resistivity of the Ag NPs-modified film registers at 2.7 × 10−5 Ω.cm. This demonstrates a substantial 53.45% reduction in the volume resistivity of the conductive printed silver film modified with Ag NPs, compared to its Ag NPs-absent counterpart. Post 200 cyclic bending tests, it becomes evident that the resistance change rate in the Ag NPs-modified conductive printed silver film is a mere 12.5%, whereas the Ag NPs-modified silver film lacking Ag NPs displays a resistance change rate of 21.5%. This discrepancy underscores the capacity of Ag NPs-modified Ag flakes to fortify the bending resistance of the conductive printed silver film. Comprehensive data analysis substantiates that the improvements in electrical conductivity and bending resistance can be attributed to the superior bridging facilitated by the sintering process on the surface of the Ag NPs-modified Ag flakes.
研究领域:
材料科学
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印刷电子技术
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产品关联
DOI
高影响因子
JOURNAL OF ELECTRONIC MATERIALS
·
2019
·Vol. 48
·期 5
·2745-2753
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IF 1.676
Zhan Haijiao,Guo Jiayu,Shen Jiali,Wang Xiaorong,Fan Zhonghua,Guo Bing,Liu Wei,Shen Hangyan
Silver microparticles have inspired much research interest due to their enhanced properties for use in optical, electric, catalytic, and magnetic applications. One such use is as electrically conductive filler for printed electronics. A manufacturing approach has been developed to prepare low-curing-temperature silver pastes. Firstly, silver flakes were synthesized directly by a one-step aqueous-phase reduction reaction, using silver nitrate as silver salt precursor and iron(II) sulfate heptahydrate as reducing agent. Various silver flake samples were synthesized by controlling experimental parameters such as the reaction temperature, surfactant concentration, and reducing agent concentration. The obtained silver powders were characterized by x-ray diffraction analysis, scanning electron microscopy, and dynamic light scattering measurements. The results revealed that the morphology of the silver powders was a plate-like structure with diameter of 1 μ m to 1.5 μ m and thickness of 30 nm. The prepared silver flakes were then used directly without ball milling to prepare low-curing-temperature silver pastes. The bulk resistivity of a line screen-printed using silver paste containing 48 wt.% (34 ± 5 vol.%) silver flakes and cured at 140°C for 30 min in air was about (1.773 ± 0.118) × 10 −6 Ω m. More importantly, the prepared screen-printed patterns exhibited excellent durability in terms of peel strength and folding endurance.
研究领域:
材料科学
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纳米技术
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电子工程
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应用化学
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先进制造
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DOI
高影响因子
RSC Advances
·
2020
·Vol. 10
·期 55
·33112-33118
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IF 3.119
Su Ding,Qingfeng Cai,Jintao Mao,Fei Chen,Li Fu,Yanfei Lv,Shichao Zhao
Transient electronics have been widely researched to solve the electronic waste (E-waste) issue. Although various transient materials and devices have been reported, the fabrication technique for transient conductors always uses expensive sputtering or evaporation processes. In this study, a silver flake (AgF) and polyvinyl pyrrolidone (PVP) composite is prepared for conductive and transient tracks. The AgF/PVP composite tracks are highly conductive with a resistivity of 8.9 mOhm cm after sintering at 80 °C for only 3 minutes. Impressively, the AgF/PVP tracks disintegrate in water in 3 minutes due to the fast dissolution of the water-soluble PVP. The transient behavior of the AgF/PVP tracks has potential in transient electronics as demonstrated in a light emitting diode (LED) circuit and antenna.
研究领域:
材料科学
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电子工程
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DOI
PubMed
高影响因子
RSC Advances
·
2017
·Vol. 7
·期 84
·53219-53225
·
IF 3.108
Jiayue Wen,Yanhong Tian,Zhipeng Mei,Weizhen Wu,Yanqing Tian
Herein, we report an innovative application of doping conjugated-polypyrrole nanoparticles (PPy NPs) into electrically conductive adhesives (ECAs) to prepare low-electrical resistivity interconnecting materials. PPy NPs were synthesized via a facile one-step chemical oxidative polymerization method at room temperature with the average diameter as small as 86.8 nm. Particles' diameters and dispersity were manipulated under different polymerization conditions through the adjustment of weight percentages and molecular weights of polyvinylpyrrolidone (PVP) as the surfactants. Results showed that higher concentrations of PVP and the longer chains of PVPs resulted in smaller diameters of PPy NPs. We also found that a suitable portion of ethanol in the polymerization mixtures gives rise to a better dispersity than that observed in mixtures without ethanol. When a small amount of PPy NPs was added into traditional epoxy resin-based and silver-flakes-filled ECAs, the resistance measurements showed an enhancement in the electrical conductivity, or in other words, a reduction in resistivity significantly. For example, the electrical resistivity of 70 wt% silver-filled ECAs was reduced from 1.6 × 10−3 Ω cm to 9.4 × 10−5 Ω cm by using only 2.5 wt% PPy NPs as the dopants. Thus, our results confirmed new applications of PPy NPs in the field of ECAs for decreasing the resistance, reducing the dosage of silver in ECAs, and achieving flexible devices. Finally, flexible electrical patterns were printed on paper and polyimide substrates were used as conducting circuits to light LED devices.
研究领域:
材料科学
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电子工程
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DOI
高影响因子
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES
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2022
·
IF 3.848
Weiwei Zhang,Jintao Wang,Hao Liu,Zheng Zhang,Jianqiang Wang,Luobin Zhang,Haozhong Wang,Fengyi Wang,Fangcheng Duan,Jiahao Liu,Mingyu Li,Chunjin Hang,Hongtao Chen
Coupling agents are widely used in order to improve the properties of electrically conductive adhesives (ECAs). The effects of different coupling agents on the characteristics of epoxy-based ECAs were investigated in terms of thermal, rheological, electrical and mechanical properties. Results showed that the ECAs had favourable flow, adhesion and good conductivity. In particular, the ECAs filled with Ag flakes treated with the silane coupling agent 3-aminpropyltriethoxysilane (KH-550) exhibited the lowest electrical resistivity (5.22 × 10 −4 Ω cm) and the highest shear strength (20.32 MPa) among the ECAs. Besides, it had the minimum viscosity 154 Pa s at 5 rpm/25 °C. It was also found that the adding of coupling agents had different effects on the aging electrical and shear strength of the ECAs. According to this study, the use of KH-550 had a significant electrical conductivity improvement and shear strength increase before and after aging. In addition, a strong adhesion/bonding between the conductive fillers and the resin matrix was revealed by scanning electron microscopy studies.
研究领域:
材料科学
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化学工程
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产品关联
DOI
高影响因子
ACS Applied Materials & Interfaces
·
2020
·
IF 8.758
Su Ding,Zhi Jiang,Fei Chen,Li Fu,Yanfei Lv,Yahui Qian,Shichao Zhao
Transient conductors are one of the most important components in transient electronics, which attract great attention because of their environment-friendly and biocompatible characters. To meet the requirement for wearable electronics, good stretchability and mechanical durability are needed for the transient conductors. However, it remains challenging to achieve stretchability and transient behavior simultaneously because of a lack of the proper elastomer. Herein, we demonstrate the first highly stretchable and transient conductor from a composite material of Ag flakes and gelatin hydrogel. It shows a maximum stretchability of more than 100% with minimal resistance increase and a good cyclic durability of 1000 cycles of deformation at 20%. The above mentioned good mechanical properties come from the rational design of the conductor with a seamless interface between the hydrogel and Ag flakes. When the conductor is immersed in water at 60 °C, it can be quickly dissolved within 90 s, and the transient behavior can be controlled by tuning the content of the hydrogel in the conductors and dissolving temperature. These properties make the conductor a good wiring candidate for stretchable and transient electronics.
研究领域:
材料科学
·
电子工程
✓ 已验证
产品关联
DOI
PubMed
高影响因子
MATERIALS & DESIGN
·
2019
·
IF 5.77
Yun Mou,Hao Wang,Yang Peng,Jiaxin Liu,Hao Cheng,Qinglei Sun,Mingxiang Chen
Poor flexibility and high contact resistance of conductive films are primary roadblock for the incorporation of Ag flake ink into practical applications. In this work, a novel and inexpensive Ag flake/ion composite ink was prepared to directly achieve the thick conductive films with excellent performances at 100 °C. The effect of Ag ion content on the resistivity and microstructures of the modified conductive film was investigated, and the flexibility and relative resistance change of the modified conductive film were measured by the cyclic bending test and compared with the traditional Ag flake ink. Consequently, the modified conductive film sintered from Ag flake/ion-0.5 in. exhibits low electrical resistivity of 4.83 × 10 −5 Ω·cm, which is 42.9% lower than the Ag flake film sintered from the Ag flake ink, and the modified conductive film still displays smaller changes in resistivity and relative resistance after the cyclic bending tests. The enhanced conductivity and flexibility are attributed to the bridging effect of Ag nanoparticles (NPs) generated from the in–situ decomposition of Ag ion ink. These results demonstrate that the low-cost Ag flake/ion composite ink provides a tempting prospect for fabricating high-quality flexible printed electronics at low temperature.
研究领域:
材料科学
·
电子工程
✓ 已验证
DOI
高影响因子
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING
·
2024
·
IF 8.1
Chengwei Jiang,Chunfang Zi,Jing Li,Changxiang Hao,Shaoyong Cai,Yiqi Xu,Fengyu Su,Ge Cao,Yanqing Tian
While extensively employed in electronic packaging, the prevailing electrically conductive adhesives (ECAs) are currently constrained by their lack of flexibility, excessive manufacturing costs, and limited multifunctionality. In this work, the antimony-doped tin oxide flexible conductive adhesives (AFCAs) were prepared by incorporating the antimony-doped tin oxide (ATO) nanoparticles into a thermoplastic polyurethane (TPU) matrix along with silver flakes. The ATO nanoparticles acted as conductive bridges for sliver flakes to enhance the electrical conductivity and mechanical integrity of the composites. The AFCAs formulated with a mere 60 % Ag and 7 % ATO nanoparticles exhibited an exceptionally low volume resistivity of 2.01 × 10 -5 Ω·cm. After 10,000 mechanical bending cycles, the resistance change of AFCAs was only 8 %. Remarkably, the AFCA films also demonstrated excellent infrared stealth capabilities by infrared thermal imaging. This study demonstrates a facile strategy to develop high-performance and multifunctional AFCAs for flexible electrics with excellent electrical stability and infrared stealth capabilities.
研究领域:
材料科学
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电子工程
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DOI
高影响因子
Journal of Materials Chemistry A
·
2022
·Vol. 10
·期 41
·21874-21883
·
IF 14.511
He Liu,Xueying Jia,Ruonan Liu,Kun Chen,Zhaoyang Wang,Tong Lyu,Xiaoyu Cui,Yue Zhao,Ye Tian
Bioinspired hydrogels with both outstanding actuation and conductivity still remain challenging. Here, we use a simple and universal method to fabricate an octopus-tentacle inspired multifunctional gradient hydrogel with both ultrafast thermo-responsive actuation and ultrahigh conductivity. The gradient network structure, formed by rapid precipitation of nanosilver flakes producing hydrophilic differences between two sides within the hydrogel, endows the hydrogel with ultrafast actuation (52.3° s−1). In addition, nanosilver flakes also provide the hydrogel with ultrahigh conductivity (>1231 S m−1) due to the formation of conductive pathways by rapid hydrogel volume shrinkage under thermal stimulation. Meanwhile, the hydrogel exhibits high sensitivity (gauge factor 14.66 within a wide strain range of 500%) and strong antibacterial properties. With these great properties, we firstly assemble the hydrogel as soft actuators (gripper and jack), where the gripper can firmly grasp and release the target object within only 8 s and 1 s, respectively. Secondly, we use the hydrogel as a wearable electronic device that enables precise detection of human motion and physiological signals. Finally, we realize smart circuit switches by combining great actuation and conductivity. Our multifunctional hydrogel offers promising opportunities for intelligent biomaterials, soft robotics and flexible sensors.
研究领域:
生物材料
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柔性传感器
·
智能仿生材料
·
软体机器人
✓ 已验证
产品关联
DOI
高影响因子
RSC Advances
·
2019
·Vol. 9
·期 34
·19501-19507
·
IF 3.049
Yuqiu Shen,Zhenxing Chen,Yong Zhou,Zuomin Lei,Yi Liu,Wenchao Feng,Zhuo Zhang,Houfu Chen
Solvent-free electrically conductive composites have been applied to flexible electronics to obtain high electrical conductivity. However, some of the proposed composites have low electrical conductivities and are unable to meet the requirements of commercial printable electronics. In this study, solvent-free electrically conductive Ag/EVA (ethylene vinyl acetate) composites for paper-based printable electronics were prepared by a thermal melting method. The properties of these electrically conductive Ag/EVA composites, including particle sizes, morphologies and phase purities of the flake silver flake powders, were investigated using a particle size analyzer, scanning electron microscopy (SEM) and X-ray diffraction (XRD), respectively. The results showed that nanometer-thick flake silver flake powders with smooth and flat surfaces were made by the nanofilm transition technique. These obtained powders were able to form smooth face-to-face contacts, which facilitated the formation of an excellent conductive network in the conductive system. Dynamic mechanical analysis (DMA) was conducted to investigate the mechanical properties of EVA and Ag/EVA composites. A Fourier transformation infra-red (FTIR) spectrometer, laser micro-Raman spectrometer and thermogravimetric analyzer were used to analyze the organic functional groups, glass transition temperatures and thermal weight losses of the EVA resin and solvent-free electrically conductive composites. The solvent-free electrically conductive Ag/EVA composite, which contained 55 wt% of the as-prepared flake silver flake powders, was found to have an extremely low volume resistivity of 1.23 × 10−4 Ω cm as well as excellent bending performance and adhesion. These features indicate the great potential of these composites for application in printed electronics.
研究领域:
材料科学
·
电子工程
✓ 已验证
产品关联
DOI
PubMed
高影响因子
ACS Applied Electronic Materials
·
2022
·
IF 4.494
Weiwei Zhang,Jiahao Liu,Hao Liu,Jianqiang Wang,Luobin Zhang,Jintao Wang,Haozhong Wang,Fengyi Wang,Xinjie Wang,Fuwen Yu,Ziwen Lv,Zheng Zhang,Chunjin Hang,Mingyu Li,Hongtao Chen
Silver (Ag) flakes are widely used as conductive fillers in the electrically conductive adhesives (ECAs). However, there are organic lubricants on the Ag surface such as oleic acid and stearic acid, a kind of surfactant commonly used in the production of Ag flakes, which will deteriorate the conductivity and mechanical properties of the ECAs. In this study, glutaric acid was used to remove the organic lubricants, which can increase the electrical conductivity and mechanical properties of the ECAs. FTIR, Raman, and XPS tests revealed that the glutaric acid was chemically adsorbed on the Ag surface by single-dentate coordination and then reacted with organic lubricants, explaining the action mechanism by which the glutaric acid enhanced the electrical and mechanical properties of the ECAs. In addition, the effects of glutaric acid on the thermal stability, bulk resistivity, shear strength, and viscosity of the ECAs were investigated. When the glutaric acid reached 0.12 wt %, the minimum bulk resistivity of the ECAs was 1.52 × 10–4 Ω·cm, the shear strength was 24.57 MPa, and the viscosity was 149 Pa·s. This provides a method for fabricating high-performance ECAs.
研究领域:
材料科学
·
化学
·
电气工程
✓ 已验证
产品关联
DOI
高影响因子
危险品化学品经营许可证（带存储）