ACS Applied Materials & Interfaces
·
2013
·
IF 5.008
Mingxi Chen,Congcong Zhang,Lingzhi Li,Yu Liu,Xichuan Li,Xiaoyang Xu,Fengling Xia,Wei Wang,Jianping Gao
A facile approach to prepare SnO2/rGO (reduced graphene oxide) hybrid nanoparticles by a direct redox reaction between graphene oxide (GO) and tin powder was developed. Since no acid was used, it is an environmentally friendly green method. The SnO2/rGO hybrid nanoparticles were characterized by ultraviolet–visible spectroscopy, Raman spectroscopy, thermogravimetric analysis, X-ray diffraction analysis, and X-ray photoelectron spectroscopy. The microstructure of the SnO2/rGO was observed with scanning electron microscopy and transmission electron microscopy. The tin powder efficiently reduced GO to rGO, and the Sn was transformed to SnO2 nanoparticles (∼45 nm) that were evenly distributed on the rGO sheets. The SnO2/rGO hybrid nanoparticles were then coated on an interdigital electrode to fabricate a humidity sensor, which have an especially good linear impedance response from 11% to 85% relative humidity.
研究领域:
材料科学
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纳米技术
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环境科学
✓ 已验证
产品关联
DOI
PubMed
高影响因子
ADVANCED POWDER TECHNOLOGY
·
2022
·
IF 4.969
Zhiwei Wang,Mingqiang Cheng,Jiaojiao Bu,Lei Cheng,Juanjian Ru,Yixin Hua,Ding Wang
Tin is one of the vital substances in the material and chemical industry. Deep eutectic solvent (DES) possesses excellent physicochemical properties for metal preparation. In this study, the electrochemical behavior of Sn(II) and metallic tin preparation in choline chloride-ethylene glycol (ChCl-EG) DES were investigated. Linear sweep voltammetry is carried out to study the effects of substrate material (Ni, Cu, Pt, C, Fe, Al, W, glassy carbon (GC) and Ti), temperature (313–353 K) and SnCl 2 concentration (10–100 mM) on the electrochemical behavior of Sn(II)/Sn. Results demonstrate that metallic tin is easier to be prepared on the Ni electrode, and increasing temperature and SnCl 2 concentration both facilitate the reduction of Sn(II). Electrospray ionization mass spectrometry (ESI-MS) shows that the main form of Sn(II) is [SnCl 3 ] - . Chronoamperometric tests indicate that with the increase of applied potential, the nucleation of Sn(II) on the nickel electrode becomes close to the instantaneous nucleation. Simultaneously, the nucleation rate and the number of active sites on the electrode surface increase significantly. Pure tin with a dendritic structure could be prepared with higher current efficiency of 96.4% and lower energy consumption of 320.5 kW·h·t −1 without any additives. All these studies provide a fundamental basis for the preparation of tin powders in ChCl-EG DES.
研究领域:
材料科学
·
电化学
✓ 已验证
DOI
高影响因子
JOURNAL OF SOLID STATE ELECTROCHEMISTRY
·
2021
·Vol. 25
·期 3
·1111-1120
·
IF 2.647
Wang Zhiwei,Ru Juanjian,Hua Yixin,Bu Jiaojiao,Geng Xiao,Zhang Wenwen
Tin (Sn) powders with pyramid chain and dendrite structures are successfully prepared by electrodeposition in choline chloride-ethylene glycol deep eutectic solvent (ChCl-EG DES) at 343 K. Cyclic voltammetry demonstrates that increasing SnCl 2 concentration from 30 to 70 mM is favorable for the reduction of Sn(II) ions to metallic Sn on Ni electrode. The roles of current density (10–30 mA·cm −2 ) and SnCl 2 concentration (30–70 mM) on the current efficiency and energy consumption are discussed during the electrodeposition of Sn powders. Experimental results show that the current efficiency and energy consumption are 88.7% and 347.1 kW·h·t −1 , respectively at 20 mA·cm −2 and 50 mM SnCl 2 . Besides, the micromorphology and crystal structure of Sn powders are analyzed by FESEM and XRD. Morphology analysis manifests that pyramid chains and dendrites in length of 30–220 μm are the dominate morphologies and the formation mechanism of the pyramid chain is also discussed. Moreover, XRD analysis and crystal texture reveal that metallic Sn is obtained with a body-centered tetragonal crystal structure. The (101) plane is the preferred at higher current density, while the (200) plane gets the strongly preferred orientation as SnCl 2 concentration increases. Graphical abstract
Sn powders electrodeposited from SnCl 2 -ChCl-EG solution and growth mechanism of the pyramid chain structure.
研究领域:
材料科学
·
电化学
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产品关联
DOI
高影响因子
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
·
2020
·Vol. 167
·期 8
·082504
·
IF 3.721
Zhiwei Wang,Juanjian Ru,Yixin Hua,Ding Wang,Jiaojiao Bu
High-pure Sn powders (99.99 wt%) with controllable morphologies are prepared by electrodeposition at various temperatures (313–353 K) in choline chloride-ethylene glycol deep eutectic solvent (ChCl-EG DES). The electrochemical behavior of Sn(II)/Sn on nickel electrode has been investigated by cyclic voltammetry. Results demonstrate that the reduction of Sn(II) ions in ChCl-EG DES is a quasi-reversible process controlled by diffusion. The diffusion coefficients of Sn(II) ions are in the range of 0.893–3.189 × 10−7 cm2·s−1 at 313–353 K. Besides, the current efficiency and corresponding energy consumption during the electrodeposition of Sn powders at 353 K are calculated about 87.78% and 289.02 kW·h·t−1, respectively. The morphologies of Sn powders are gradually transformed from dendritic (27–43 μm) to tower cone-shaped and pagoda-shaped (40–155 μm) with the increasing of reaction temperature. Furthermore, the electrochemical performances of the as-prepared Sn electrodeposits as anodes for lithium ion batteries are also discussed. The Sn electrode obtained at 313 K in ChCl-EG DES, with uniform morphology and the finest size, shows a high discharge capacity of 1050 mA·h·g−1 at 0.1 A·g−1.
研究领域:
材料科学
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电化学
·
能源存储
✓ 已验证
DOI
高影响因子
JOURNAL OF POLYMER SCIENCE PART A-POLYMER CHEMISTRY
·
2012
·Vol. 50
·期 24
·4995-4999
·
IF 3.919
Zhihai Hao,Hou Chen,Delong Liu,Lijun Fan
Sn(0)-mediated single electron transfer-living radical polymerization (SET-LRP) of acrylonitrile (AN) with carbon tetrachloride (CCl 4 ) as initiator and hexamethylenetetramine (HMTA) as ligand in N, N -dimethylformamide (DMF) was studied. The polymerization obeyed first order kinetic. The molecular weight of polyacrylonitrile (PAN) increased linearly with monomer conversion and PAN exhibited narrow molecular weight distributions. Increasing the content of Sn(0) resulted in an increase in the molecular weight and the molecular weight distribution. Effects of ligand and initiator were also investigated. The block copolymer PAN- b -polymethyl methacrylate with molecular weight at 126,130 and polydispersity at 1.36 was successfully obtained. © 2012 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2012
研究领域:
高分子化学
·
聚合反应
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功能高分子
·
材料化学
·
有机合成
✓ 已验证
DOI
高影响因子
WASTE MANAGEMENT
·
2025
·
IF 7.1
Shun Dai,Shiyu Wang,Haochen Wang,Fengyin Zhou,Simin Xu,Yongxin Wu,Muya Cai,Xinyi Li,Shuaibo Gao,Wei Li,Bowen Deng,Dihua Wang,Huayi Yin
Current methods for recovering copper (Cu), lead (Pb) and tin (Sn) from photovoltaic (PV) solder ribbons usually completely dissolve or melt the solder ribbons and then recover each element, which are reagent-intensive and generate large amounts of secondary waste. Herein, we develop an environmentally sustainable method for recovering Cu, Pb and Sn from End-of-Life (EoL) PV solder ribbons. First, above 95 % of pure Cu is recovered in the acetic acid (HAc) and hydrogen peroxide mixture (H 2 O 2 ), by which the Pb-Sn coating is selectively dissolved and separated from the Cu substrate. Second, the small portion of dissolved Cu 2+ is separated by solvent extraction (e.g., Lix84-I) and then is recovered by the electrolysis with a recovery rate of 99 %. Third, the dissolved Pb is recovered by electrochemical deposition with a recovery rate of 99 %, and Sn is recovered as Sn/SnO 2 powders. The selective recovery relies on the core–shell structure of ribbons and the different dissolution rates of Cu, Pb and Sn in the HAc, and the use of the HAc instead of HCl and HNO 3 leads to a cleaner process. Overall, the green recovery of solder ribbons will contribute to resource conservation and the circular economy of the EoL photovoltaic modules (PVMs).
研究领域:
资源回收与循环利用
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环境科学
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材料科学
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可持续化学
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废弃物管理
✓ 已验证
产品关联
DOI
PubMed
高影响因子
DALTON TRANSACTIONS
·
2025
·
IF 3.3
Sourav Mondal,Ya-Shan Huang,Zhong-Ming Sun,John E. McGrady
We report here the synthesis and structural characterisation of the [Ru@Sn12]4- anion, a new member of the icosahedral M@E12 family of endohedral Zintl clusters. The cluster is approximately icosahedral, but a signicant variance in the Ru-Sn and Sn-Sn bond lengths is a result of back-bonding from the Ru center to the Sn12 cage. We use density functional theory to place the structural chemistry of [Ru@Sn12]4- into the wider context of the M@E 12 family.
✓ 已验证
产品关联
DOI
PubMed
高影响因子
Journal of Materials Chemistry C
·
2025
·
IF 5.1
Guanghao Sang,Xin Zhang,Wei Li,Yuqing Li,Yijiang Chen,Xilong Zhang,Huize Song,Yuntao Cui,Zhongshan Deng
With the increasing integration density of chips and the consequent rise in surface heat flux, there is a growing demand for thermal interface materials (TIMs) that combine high thermal conductivity and long-term reliability. In this work, CuGa2 microparticles were synthesized via melt atomization and subsequently incorporated into gallium-based liquid metal to fabricate composite TIMs. Experimental results demonstrate that when the CuGa2 mass fraction reaches 50%, the composite achieves a maximum thermal conductivity of 74.92 ± 1.04 W/(m·K), approximately 3 times higher than that of conventional gallium-based liquid metal. This enhancement is primarily attributed to metallic bonding at the interface between liquid gallium and the CuGa2 intermetallic compound, where free electrons serve as the dominant heat carriers across the interface. Furthermore, the addition of CuGa2 improves the coating ability of the TIM while reducing its fluidity, thereby reducing the risk of leakage. Long-term testing over 35 days revealed no compositional changes or segregation hardening, confirming the excellent stability of the composite. Overall, Ga/CuGa2 TIMs strengthened by metallic bonding present a promising solution for reliable heat dissipation in high heat flux applications.
研究领域:
材料科学
·
热管理
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电子封装
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纳米材料与复合材料
✓ 已验证
产品关联
DOI
高影响因子
Journal of Cleaner Production
·
2025
·
IF 10
Tao Jiang,Ming Cheng,Yujiao Wang,Shaoqiang Guo,Wentao Zhou,Yafei Wang
The selective removal of neutron-absorbing fission products from spent nuclear fuel is critical for enhancing neutron economy and enabling efficient recycling. In this work, we present a novel two-step dry reprocessing strategy that integrates NH 3 /HCl gas mixture treatment with liquid Sn extraction to achieve phase-selective separation of Sm, Nd, Ru, Rh, and Pd from simulated U 3 O 8 -based spent fuel. Thermodynamic analysis and experimental validation reveal that decomposition of NH 4 Cl at elevated temperatures serves as the generator of NH 3 /HCl gas mixture capable of selectively chlorinating Sm 2 O 3 and Nd 2 O 3 into soluble chlorides while reducing U 3 O 8 to UO 2 and converting RuO 2 , Rh 2 O 3 , and PdO to their metallic states (Ru, Rh, Pd). Subsequent dissolution tests in LiCl-KCl confirm that Sm and Nd are almost completely removed, with chlorination efficiencies of nearly 100%, while uranium loss can be minimized by controlling direct NH 4 Cl contact. The coupled liquid Sn extraction at 1173 K enabled the recoveries of metallic Rh, Rh, and Pd with a promising extraction efficiency. This integrated approach significantly simplifies the partitioning of key neutron poisons (Sm, Nd, Ru, Rh, Pd) compared to conventional aqueous or pyrochemical routes, reduces secondary waste, and preserves uranium in its UO 2 form.
研究领域:
核化学
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放射化学
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核燃料循环
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材料化学
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湿法冶金
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热力学分析
✓ 已验证
产品关联
DOI
高影响因子
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
·
2025
·Vol. 36
·期 22
·1-11
·
IF 2.8
Mi Xiaona,Xu Jian,Yu Mingjie,Gao Yiming,Zhang Dewei,Zhang Qinfang
Ternary copper-based Cu 3 SbSe 4 compound has emerged as a promising thermoelectric material. However, its practical application is limited by relatively low thermoelectric performance, primarily due to inferior electrical properties. In this work, the Cu 3 SbSe 4 -based composites with incorporated 2D MXenes ( i.e. , Ti 3 C 2 T x ) were synthesized by combining mechanical alloying with spark plasma sintering technique. The introduction of 2D Ti 3 C 2 T x nanosheets significantly enhanced the Seebeck coefficient, which is ascribed to the energy-dependent carrier scattering. Resultantly, an optimized PF ~ 1.1 mWm −1 K −2 can be realized in the bulk composite with x = 1.5. All composite samples exhibited low thermal conductivity in high temperature, attributed to enhanced interfacial phonon scattering. As a result, the best ZT value of 0.59 at 623 K is obtained for the bulk Cu 3 Sb 0.98 Sn 0.02 Se 4 /1.5 vol % Ti 3 C 2 T x composite, which increases by 31% compared with that of the matrix. This study demonstrates that incorporation of 2D MXenes into ternary copper-based compounds is an effective strategy to enhance their TE performance.
研究领域:
材料科学
·
凝聚态物理
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功能材料
·
能源材料
✓ 已验证
产品关联
DOI
高影响因子
ACS Applied Materials & Interfaces
·
2025
·
IF 8.2
Xiaowei Wu,Hong Wu,Jie Liu,Sikang Zheng,Qihong Xiong,Kaiqi Zhang,Hanjun Zou,Guiwen Wang,Guang Han,Guoyu Wang,Xu Lu,Bin Zhang,Xiaoyuan Zhou
SnSe-based compounds, as promising thermoelectric materials, are well-known for their intrinsically low thermal conductivity and outstanding thermoelectric performance. However, the suboptimal electrical transport capacity for n-type polycrystalline SnSe significantly hinders the improvement of its thermoelectric performance. In this work, an effective approach for enhancing the thermoelectric performance of n-type SnSe polycrystalline materials through ZnCl2 doping has been investigated. The enhanced density of state effective mass, which is related to the introduction of an impurity level and the facilitation of multivalley degeneracy after ZnCl2 doping, can significantly improve the electrical transport coefficient. Additionally, multiple defects caused by ZnCl2 doping, such as multiscale precipitates, amorphous tin chloride, and twin boundaries, effectively decrease the lattice thermal conductivity, leading to a subsequently enhanced quality factor. As a result, the SnSe0.95–2%ZnCl2 sample achieves a maximum zT of ∼1.3 at 873 K parallel to the pressing direction, being 4 orders higher than that of the pristine SnSe0.95 sample and better than that of most other halide-doped SnSe samples. This study presents a cost-effective and environmentally friendly strategy for improving the thermoelectric properties of n-type polycrystalline SnSe.
研究领域:
材料科学
·
热电学
·
半导体物理
·
能源材料
✓ 已验证
产品关联
DOI
PubMed
高影响因子
ACS Applied Energy Materials
·
2025
·
IF 5.5
Chao Wu,Xin Miao,Aojie Zhang,Mingxing Guo,Jianxiang Lin,Anjun Jin,Wenhao Fan,Shaoping Chen
Despite the excellent thermoelectric properties of Te, the element diffusion and reaction at the interface with the metal electrodes introduce a large contact resistivity (ρc), significantly reducing the conversion efficiency (η) of the device. Therefore, suitable barrier layers are being sought to optimize the connection between Te and metal electrodes. In this study, a Sn–Te alloy barrier layer is reported based on interfacial reaction. The results indicate that there is no reaction layer or microscopic defects at the interface of the SnTe/Te0.985Sb0.015 device. Additionally, the η of the single-leg device is approximately 4.7% at a temperature difference of 230 K. Notably, this ηmax is 100% higher than that of the Ni/Te0.985Sb0.015/Ni device. Meanwhile, the interface exhibits good thermal stability, with no significant changes observed in ρc, η, and interface microstructure after aging at 523 K for 18 days. This work provides valuable insights into optimizing the interface between thermoelectric materials and metal electrodes, which could lead to the development of more efficient and stable thermoelectric devices.
研究领域:
材料科学
·
热电学
·
能量转换
·
固体物理
✓ 已验证
产品关联
DOI
高影响因子
危险品化学品经营许可证（带存储）