COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING
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2021
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IF 7.664
Bin Wu,Jiaojiao Li,Xu Li,Gang Qian,Peng Chen,Ru Xia,Jiasheng Qian
Polymer-based thermal conductivity composites composed with nanoscale fillers are promising thermal conductors to dissipate accumulated heat of integrated circuits in electronic devices, while interfacial thermal resistance (ITR) and disordered conductive pathways caused by the size effect of fillers limit their heat transfer performance. Herein, gravitational-driven ice-templated oriental arrangement of ionic liquid (IL) modified microscale carbon fibers (CFs) were conducted to improve thermal conductivity via both weakening phonons scattering effect and forming horizontal orientation heat transfer pathways in composites. The cation-π interaction between CFs and the hydrogen bonding between CFs and epoxy resin induced by IL effectively reduced ITR in composites. As a result, the composite including 22.3 vol% CFs reached a maximum in-plane thermal conductivity of 7.98 W m −1 K −1 . The mechanical properties of the composite were also developed. This insight provides a strategy for the construction of high-performance composites with potential applications in thermal management materials.
研究领域:
材料科学
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热管理材料
✓ 已验证
DOI
高影响因子
CHEMICAL ENGINEERING JOURNAL
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2023
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IF 15.1
Taoqing Huang,Tian Wang,Jun Jin,Min Chen,Limin Wu
Polymer-hexagonal boron nitride (BN) composite has become an ideal thermal interface material (TIM) for electronic devices because of its high thermal conductivity and superior electronic insulation. However, owing to the 2D shape and chemical inertness of BN filler, the vertical alignment of BN and the huge thermal resistance are current challenges, which hinder the efficient heat transfer of polymer/BN composites. Herein, by a novel non-solvent induced phase separation process combined “ in-situ welding” strategy, we present the fabrication of silicone rubber film with finger-like continuous BN-welded filler skeleton, which reveals a high through-plane thermal conductivity of 15.4 W m −1 K −1 at only ∼ 15 wt% BN. Finite element simulation and nonlinear model analyses theoretically confirm that the filler-to-filler interfacial thermal resistance (ITR) is halved after in-situ welding process. In addition, thanks to the excellent compressibility and conformability of silicon rubber matrix, the contact thermal resistance (<70 Kmm 2 W −1 ) of this composite film is much lower than that of the commercial thermal pad under different pressure. The proposed strategy opens up a novel and high-throughput preparation strategy for the high-performance TIM for modern electronic devices.
研究领域:
材料科学
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电子工程
✓ 已验证
产品关联
DOI
高影响因子
Nanomaterials
·
2022
·Vol. 12
·期 3
·446
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IF 5.719
Zhengdong Wang,Tong Zhang,Jinkai Wang,Ganqiu Yang,Mengli Li,Guanglei Wu
Thermally conductive and electrically insulating materials have attracted much attention due to their applications in the field of microelectronics, but through-plane thermal conductivity of materials is still low at present. In this paper, a simple and environmentally friendly strategy is proposed to improve the through-plane thermal conductivity of epoxy composites using a 3D boron nitride (3D-BN) framework. In addition, the effect of filler sizes in 3D-BN skeletons on thermal conductivity was investigated. The epoxy composite with larger BN in lateral size showed a higher through-plane thermal conductivity of 2.01 W/m·K and maintained a low dielectric constant of 3.7 and a dielectric loss of 0.006 at 50 Hz, making it desirable for the application in microelectronic devices.Keywords:3D boron nitride skeleton;size effect;epoxy composites;through-plane thermal conductivity
研究领域:
材料科学
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热传导工程
✓ 已验证
产品关联
DOI
PubMed
高影响因子
Scientific Reports
·
2021
·Vol. 11
·期 1
·1-11
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IF 4.38
Wang Zhengdong,Meng Guodong,Wang Liangliang,Tian Liliang,Chen Siyu,Wu Guanglei,Kong Bo,Cheng Yonghong
Dielectric materials with good thermal transport performance and desirable dielectric properties have significant potential to address the critical challenges of heat dissipation for microelectronic devices and power equipment under high electric field. This work reported the role of synergistic effect and interface on through-plane thermal conductivity and dielectric properties by intercalating the hybrid fillers of the alumina and boron nitride nanosheets (BNNs) into epoxy resin. For instance, epoxy composite with hybrid fillers at a relatively low loading shows an increase of around 3 times in through-plane thermal conductivity and maintains a close dielectric breakdown strength compared to pure epoxy. Meanwhile, the epoxy composite shows extremely low dielectric loss of 0.0024 at room temperature and 0.022 at 100 ℃ and 10 −1 Hz. And covalent bonding and hydrogen-bond interaction models were presented for analyzing the thermal conductivity and dielectric properties.
研究领域:
材料科学
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电子工程
✓ 已验证
DOI
高影响因子
Materials Today Communications
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2022
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IF 3.662
Jiangang Zhou,Congzhen Xie,Rui Wang,Huasong Xu,Bin Gou,Licheng Li
Thermally conductive polymeric materials have attracted great interest from academia and industry for several decades. Herein, we report a facile method to fabricate BNNS/PP composites with excellent properties, especially the in-plane thermal conductivity . SEM and XRD results show the orderly dispersion and high orientation of BNNS along the in-plane direction. Attractively, the in-plane thermal conductivity of BNNS/PP composites after 20 times of folding and hot pressing is dramatically improved to 4.08 W/mk at a BNNS content of only 19.1 vol%, which is 20 times higher than that of pure PP and 480% higher than that of single hot pressing composite at the same filler content. In addition, The Hashin-Shtrikman (HS) model and finite element simulations are introduced to interpret the improvement of in-plane thermal conductivity of BNNS/PP composites after repeated hot pressing. Meanwhile, the influence of parallel orientation and layered distribution of BNNS on the mechanical and dielectric properties of BNNS/PP composites has been investigated. This facile method presents a novel approach to design and fabricate polymer composites with excellent in-plane thermal conductivity.
研究领域:
材料科学
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热传导工程
✓ 已验证
产品关联
DOI
高影响因子
JOURNAL OF MATERIALS SCIENCE
·
2024
·Vol. 59
·期 9
·3829-3838
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IF 3.5
Li Jing,Meng Yuanchao,Li Ning,Miao Jianyin,Li Wenjun,Yu Yinghao
Highly integrated and high-power devices place higher demands on the heat dissipation capability of heat sink components, and graphene meets the heat dissipation requirements due to its extremely high thermal conductivity of 5300 Wm −1 K −1 and good mechanical properties. Graphene by redox is one of the most promising methods for large-scale preparation of graphene; however, the quality of graphene prepared by different reduction processes varies. Herein, this paper presents a fast and efficient reduction process. Benzene was added as a reduction aid to increase the temperature from room to 2000 °C in 30 s and complete the reduction process. By this method, we obtained graphene with low defects and high thermal conductivity. The reduction process restored the lattice destroyed by the oxidation process, and the repaired material showed a higher crystallinity with a measured I D /I G of 0.18 (Ph-rGO-0, 0.58) and in-plane thermal conductivity of 510 ± 10 Wm −1 K −1 . The in-plane thermal conductivity was increased by 262 Wm −1 K −1 compared with the film without benzene addition (Ph-rGO-0), which showed better homogeneous temperature performance and heat dissipation performance in practical applications. These results show the great potential for the application of graphene films prepared by this method in the field of heat dissipation materials.
研究领域:
材料科学
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纳米技术
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热管理
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化学工程
✓ 已验证
DOI
高影响因子
ACS Applied Nano Materials
·
2020
·
IF 0
Ya Li,Xu Li,Md Mofasserul Alam,Dongbo Yu,Jibin Miao,Ming Cao,Peng Chen,Ru Xia,Bin Wu,Jiasheng Qian
With the increasing integration of electronic devices, there are growing demands for excellent thermal conductivity of thermal management materials on account of severe heat accumulation in practical applications. Graphene has been widely used in thermal conductivity nanocomposites because of its high in-plane thermal conductivity; however, inadequate through-plane thermal conductivity has become a major obstacle for extensive application. To deal with this issue, in this study, the Ag nanowire (AgNW) decorated reduced graphene oxide (rGO/AgNW) filler was prepared by in situ growth of AgNW between the interspacing of graphene nanosheets. As a result, the through-plane thermal conductivity of the nanocomposites reached 2.51 W/(m K), which was 260% more than pure graphene and 200% as high as those with Ag nanoparticle (AgNP) decorated rGO (rGO/AgNP). The enhancement that was attributed to AgNW created a “highway” of heat transfer pathways between the graphene layers and generated the synergistic effect of heat transfer with graphene. The nonequilibrium molecular dynamics simulation further revealed that the synergistic effect of boosting through-plane thermal conductivity was originated from the stronger excitation effect of low-frequency phonon (LFP) mode of AgNW. It would activate the LFP mode of the interface carbon atoms by resonance with AgNW and thus improve the phonon vibrational density of states of rGO/AgNW to realize more thermal transmit across the interface. It was expected that our rGO/AgNW hybrid structure as a thermal conductivity filler is of great promise for the high-efficiency through-plane heat transfer.
研究领域:
材料科学
·
热管理技术
✓ 已验证
产品关联
DOI
危险品化学品经营许可证（带存储）