Thermal stability is the main problem affecting the application of inorganic fluorescent materials in high-power LED devices. Here, we have synthesized a green light-emitting phosphor Na 2 Ca 1-x Ge 6 O 14 : xTb 3+ with high luminescence thermal stability mainly through high temperature solid-state reaction. By changing the concentration of doping ions, the traps concentration of the material can be increased, so that the thermal stability of the material can be improved, which is attributed to the traps compensating greater than the thermal quenching effect. This method of utilizing traps to improve thermal stability provides a potential synthesis strategy for improving high-power white LED used in automotive.
With the rapid development of new-generation wireless communication technologies and portable intelligent electronic devices, the development of composites with excellent thermal conductivity and electromagnetic shielding properties has become an urgent challenge. In this work, a unique fibers-induced segregated-like structure strategy for fabricating thermoplastic polyurethane/polydopamine/silver (TPU/PDA/Ag) composites film with high thermal conductivity (TC) and excellent electromagnetic interference (EMI) shielding performance is demonstrated via electrospinning-electroless depositing-pressing technology. The TPU/PDA/Ag composites film exhibit excellent in-plane TC of 20.9 W/(m⋅K) at 75 wt% Ag loading, which shows excellent thermal management capability as heat spreaders of high-power light-emitting diode (LED) modules in practice. Meanwhile, the composites film presents outstanding EMI shielding efficiency of 109 dB (8.2–12.4 GHz) with a thickness of 45 μm and prominent EMI shielding reliability after 1000 cycles of bending. In addition, the composites film shows good tensile strength (12.1 MPa), elongation at break (108.0%), and toughness (11.59 MJ/m 3 ). The obtained TPU/PDA/Ag composites film achieves the desired balance among thermal conductivity, EMI shielding, and mechanical properties , indicating broad application prospects in new-generation wireless communication technologies and portable intelligent electronic devices.