JOURNAL OF THE EUROPEAN CERAMIC SOCIETY
·
2014
·
IF 2.307
Yinsheng Li,Jie Yin,Haibo Wu,Ping Lu,Yongjie Yan,Xuejian Liu,Zhengren Huang,Dongliang Jiang
In order to attain high thermal conductivity , SiC was doped with ultra-low amounts of B and C as sintering additives using boric acid together with d -fructose as boron–carbon sources. The contents of in situ generated B and C were both tailored as low as 0.4 wt.%, which can significantly reduce the impurities induced phonon scattering effect. The SiC ceramics were pressureless densified at 2150 °C for 1 h, and some samples experienced subsequent annealing at 1950 °C for 4 h. High thermal conductivities of 180.94 W/(m K) for the as-sintered SiC ceramics and 192.17 W/(m K) for the annealed specimens at room temperature were achieved. The reasons for the high thermal conductivity in the polycrystalline SiC ceramics were specified, based on the close correlation with microstructure.
研究领域:
材料科学
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陶瓷工程
✓ 已验证
产品关联
DOI
高影响因子
COMPOSITES PART B-ENGINEERING
·
2022
·
IF 11.322
Chengzong Zeng,Chaofan Ma,Jun Shen
Gallium (Ga)-based liquid metal (LM) paste is deemed to have potential and extensive applications in the thermal management of electronics. However, some non-metallic carbon-based materials such as diamond or carbon fiber (CF) cannot be wetted by Ga, which is difficult to prepare composites using manual stirring without surface modification. Here, the repeated compression method of the forced wetting was successfully used to prepare the Ga-based LM composites containing carbon-based materials without surface modification. New oxide skin of LM will generate during repeating compression. The bonding mechanism between diamond (/CF) and Ga is that Ga oxide is attached to the diamond (/CF) and then being wetted and coated by Ga. Diamond and CF can be separated and recycled from Ga-based paste. A high thermal conductivity value of 129 W m −1 K −1 was obtained by inducing the distribution of CF using diamond particles, in which liquid Ga was the connecting phase. The density of Ga can be reduced by 21% and the thermal conductivity of the Ga-based paste over 100 W m −1 K −1 can be maintained. The successful development of the Ga-based LM/diamond/CF composite indicates that excellent thermal conductivity can be achieved by inducing the distribution of anisotropic particles using isotropic particles.
研究领域:
材料科学
·
热管理技术
✓ 已验证
产品关联
DOI
高影响因子
CERAMICS INTERNATIONAL
·
2024
·
IF 5.1
Xidong Wang,Yanrong Liang,Jiawei Liu,Qianxiong Wen,Cong Zhao,Xiaojuan Liang,Zhaopin Chen,Weidong Xiang
Phosphors in glass films (PiFs) is considered ideal conversion materials for laser lighting, but heat dissipation issue is the main challenge limiting its development. Therefore, it is urgent to find more excellent heat dissipation materials. Herein, we proposed to use AlN with high thermal conductivity as the substrate, and innovatively introduced TiO 2 coating to improve the interface reflection ability and solve the possible problems of shedding and cracking. After a series of optimizations, the LSN PiG-TiO 2 -AlN (PTA) color converter obtained a high thermal conductivity of 29W m −1 k −1 and a low surface temperature. At an input power of 5.2W, the luminous efficiency can reach 175 lm/W and the relative initial intensity can still be maintained by 95.3% at 200 °C. Benefiting from the extremely strong heat dissipation capacity of the AlN substrate, the LSN PTA color converter maintains its relative luminous intensity at 95 % of the initial intensity after 24 h of continuous illumination, which is the best value recorded so far. In addition, LSN PTA is combined with CaAlSiN 3 :Eu 2+ phosphor to achieve high-quality white light with a CRI of 82.5. The above results indicate that LSN PiG-TiO 2 -AlN color converters have a promising research prospect in the field of laser lighting.
研究领域:
材料科学
·
光学工程
✓ 已验证
产品关联
DOI
高影响因子
Journal of Energy Storage
·
2023
·
IF 9.4
Junchi Wang,Wenyao Guo,Xiaoling Ma,Xiaobo Yan,Hui Yao,Min Guo,Guoning Li,Shijie Li,Ping Cui,Mingzhi Yu,Hui Li
Stearic acid (SA) is recognized as a promising phase change material (PCM). Nevertheless, poor thermal conductivity and leakage are great challenges for SA in practical application. To this end, the shape stabilized PCM (CTX/SA) with high thermal conductivity is fabricated by impregnating SA into the in situ N-doped carbon (CTX) derived from chitin (CH). The thermal storage performance of CTX/SA is investigated to acquire the optimal carbonization temperature for CTX. Meanwhile, characterizations of FTIR, XRD, SEM, and N 2 isothermal adsorption-desorption are conducted to reveal the influence of CTX on thermal storage performance. The synthesized CT800/SA exhibits high thermal conductivity of 0.461 W/(m·K) and thermal storage efficiency of 92.84 % with a low supercooling degree of 1.06 °C. CT800/SA also has desirable thermal stability and reliability even after 200 repeated thermal cycles. Moreover, the photothermal conversion of CT800/SA is 74.12 %.
研究领域:
材料科学
·
能源工程
✓ 已验证
产品关联
DOI
高影响因子
JOURNAL OF PHYSICS D-APPLIED PHYSICS
·
2023
·Vol. 56
·期 44
·445501
·
IF 3.4
Rui Yang,Hao-ou Ruan,Si-di Fan,Kai-xuan Sun,Sheng-hui Wang,Xiang Yu,Fang-cheng Lü
Encouraged by the goal of achieving net-zero carbon emission by 2050, the exploration of insulating material becomes one of the core projects to the electrical equipment innovations. The rise of composites enables the insulating material to be endowed with more functions. By this concern, adopting the coupling agents is one of the effective methods to improve the compatibility of composites, which highly strengthens the desired properties. The functional groups of coupling agents, nevertheless, could not always show a positive impact to access enhanced properties. In this work, four types of silane coupling agents including amino-propyl, glycidyletheroxy-propyl (GP), vinyl, and methacryloxy-propyl functional groups are employed to modify the aluminum nitride (AlN) fillers, and the modification effects on the insulating and thermal conductivity of the AlN/poly(m-phenylenedicarbonyl-m-phenylenediamine) (PMIA) composite paper are systematically investigated and compared. The results show that a proper coupling agent is beneficial to the uniform dispersion of the inorganic filler in the organic matrix and highly contributes to their interface quality, where the heat transfer path is established that boosts the heat dissipation. By tailoring the trap depth and density toward deeper and higher, the carrier transport is highly confined which enhances the breakdown strength to a large extent. Therefore, high breakdown strength and thermal conductivity of 182.9 kV mm−1 and 0.302 W (m·K)−1, respectively, are achieved in the GP modified AlN/PMIA paper, which are 16.7% and 167.4% higher than that of pure PMIA paper.
研究领域:
材料科学
·
电气工程
✓ 已验证
DOI
高影响因子
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
·
2024
·
IF 11.2
Wei Wang,Jian Bao,Changhao Wang,Guoqiang He,Xin Wang,Diming Xu,Biaobing Jin,Zhongqi Shi,Moustafa Adel Darwish,Yawei Chen,Qixin Liang,Meirong Zhang,Di Zhou
The advancement of millimeter-wave communication desires the ceramic substrate with low permittivity ( ԑ r ) to meet the requirements of high transmission rates, low latency and wide bandwidth. However, the thermal conductivity of most low- ԑ r ceramics is too low to deal with heat dissipation in millimeter-wave applications. In this paper, we reported novel dielectric ceramics Li M SiO 4 ( M = Ga, Sc and Y) with excellent performances of low ԑ r (< 10) and high thermal conductivity (> 6 W mK −1 ). Their dielectric properties in both microwave and THz were investigated, where the LiGaSiO 4 ceramic achieved the lowest ԑ r of ∼5.2, the LiScSiO 4 ceramic presented extremely low loss ( Q × f ∼ 96,700 GHz, Q = 1/dielectric loss, f is resonant frequency), and the LiYSiO 4 ceramic showed a positive temperature coefficient of f (TCF ∼ +32 ppm °C −1 ). The distinct dielectric behavior was subsequently studied by structure-performance relationship in terms of M -site cations and bond parameters using bond valence theory, Phillips–Van Vechten–Levine chemical bond theory and so on. Moreover, a 36 GHz microstrip array antenna was designed and simulated using the LiGaSiO 4 ceramic substrate, obtaining high realized gain, high radiation efficiency and low sidelobe. The result demonstrated the great potential of LiMSiO 4 -type dielectric ceramics in millimeter-wave communications.
研究领域:
材料科学
·
电子工程
·
通信技术
✓ 已验证
DOI
高影响因子
Nanoscale
·
2024
·
IF 5.8
Han Cheng,Bo Tang,HuaYang Bao,Fan Shan,ChunXu Lu
The phase change microcapsules (NePCMs) with high latent heat values, thermal conductivity and stability were synthesized by coating stearic acid (SA) phase change material (PCMs) with Zinc tungstate (ZnWO4) as the shell material. The prepared ZnWO4 and microcapsule samples are characterized through various techniques, and their thermophysical properties under different core-shell ratios and emulsifiers are compared. The highest phase transition enthalpy reaches 83.63 J g-1 when the core-shell ratio is 1:1 and the sodium dodecylbenzenesulfonate (SDBS) is adopted as the emulsifier. Based on SEM and TEM results, the regular spherical shape and complete core-shell structure of the microcapsule can be found, and the particle size ranges between 100-300 nm. The thermal conductivity of the SA has increased by 141.18%~238.43% after by using the ZnWO4 as the shell material. Moreover, thermogravimetric and leak-proof performance tests demonstrated that microcapsule samples possess a high thermal stability. There was no leakage from the six microcapsule samples after heating, proving their potential application for thermal energy storage (TES) under long-term high-temperature conditions. In addition, the cost of ZnWO4 prepared by this method can be reduced about 40%. According to UV absorption and fluorescence spectrum evaluation, ZnWO4 and microcapsule samples have good photoluminescence and UV absorption properties, making the sample can be widely employed in fluorescent construction, coatings and textile industries with a lower cost.
研究领域:
材料科学
·
能源工程
·
化学工程
✓ 已验证
产品关联
DOI
PubMed
高影响因子
Materials Research Express
·
2019
·Vol. 6
·期 7
·075314
·
IF 1.449
Lu Chen,Chao Xiao,Yunlu Tang,Xian Zhang,Kang Zheng,Xingyou Tian
A multilayered thermally conductive composite with ternary system of heat conductive fillers-thermally conductive films-epoxy matrix was prepared through a facile process of layer-by-layer stacking, pre-curing and hot-pressing. The thermally conductive films (boron nitride nanosheets/cellulose nanofiber) with high in-plane thermal conductivities were employed as the heat conductive medium, while the platelet-shaped hexagonal boron nitride and the particle-shaped aluminum nitride were utilized as heat conductive fillers for enhancing the perfection of the thermally conductive network. A horizontally heat conductive network was constructed within the epoxy matrix under the joint contribution of the horizontally aligned hexagonal boron nitride platelets and the parallelly spread thermally conductive films through hot-pressing. The aluminum nitride particles acted as linking points, filling the gaps between hexagonal boron nitride platelets, while constructing the thermally conductive path in the vertical direction. Thanks to the introduction of thermally conductive films and the good orientation of boron nitride platelets, the in-plane thermal conductivities of the composites increased with increasing of film layer number. With film layer number of 9, and filler content of 30 wt% (aluminum nitride/boron nitride (1:1)), the in-plane thermal conductivity of the composite was as high as 8.53 W m−1 * K, which showed an enhancement of 4165% than that of the pure epoxy matrix, and an improvement of 613% compared to that of the composite without multilayered structure. Meanwhile, the out-of-plane thermal conductivity exhibited a slightly deceased tendency as film layer number increased, but it still reached 0.87 W m−1 * K with film layer number of 9, which was 335% higher than that of the pure epoxy. In addition, the multilayered composite also possessed good thermal stability, enhanced stiffness, as well as low dielectric constant and dielectric loss, which shows a potential application in thermal management for packaging of integrated circuit and microelectronic devices.
研究领域:
材料科学
·
热管理技术
✓ 已验证
DOI
高影响因子
CHEMICAL PHYSICS LETTERS
·
2022
·
IF 2.719
Weiqiu Huang,Bing Zhu,Jiahui Zhu,Xufei Li,Xinya Wang,Baoyou Yan,Fei Yi,Zhen Zhang
Novel AC (termed as A-AC/SiC) with high thermal conductivity was prepared by using emulsified asphalt as precursor and polycarbosilane (PCS) as thermal conductive addition by in-situ reaction. The specific surface area and total pore volume of sample A-AC/SiC-20 was up to 1346 m 2 ·g −1 and 0.89 cm 3 ·g −1 respectively. The SEM and FIIR showed that PCS had been successfully loaded into the A-AC and formed the uniform cross-linking structure, while its thermal conductivity increased by nearly 300 % than that of the parent A-AC. Moreover, it also exhibited high adsorption capacity up to 3.46 mmol·g −1 and excellent recyclability for n-hexane vapor.
研究领域:
材料科学
·
环境工程
✓ 已验证
产品关联
DOI
高影响因子
Nature Communications
·
2025
·Vol. 16
·期 1
·1-15
·
IF 15.7
Xu Wenjun,Cui Jiarong,Ma Yao,Hu Zhanpeng,Qi Yuyang,Li Xinying,Zhong Yuchen,Luo Tao,Chu Xuyang,Wu Linjing,Ling Weisong,Zhou Wei
Thermal management using a vapor-liquid two-phase circulation system is challenging in compact and complex-shaped electronic devices. In this study, we design and fabricate a heat pipe that can adapt to various shapes, regardless of space constraints. The heat pipe is capable of bending or twisting in three dimensions, making it suitable for electronic devices of arbitrary shapes. It effectively transfers heat from in-plane chips to out-of-plane spaces through flexible circulation pathways. This two-phase heat cycle system achieves an ultra-high thermal conductivity of up to 11,363 W/m·K. The flexible and adaptive design strategy enables efficient heat transfer in complex and compact environments.
研究领域:
热管理技术
·
电子工程
·
材料科学
✓ 已验证
产品关联
DOI
PubMed
高影响因子
Metals
·
2023
·Vol. 13
·期 4
·819
·
IF 2.9
Yongqian Peng,Yicong Ye,Cuijuan Yu,Zhen Wang,Yuanxi Xu,Yongguo Du
This paper proposes a new silver nanoscale joining material, silver nanowire film, as an alternative joining approach for high-power and large-size chip packaging. The silver nanowire film was prepared by pressing filtration with silver nanowire that was synthesized using the polyol method. We found that the tensile strength of the film reached 3.40 MPa and the content of the silver reached up to 99.0 wt%. This paper further studies the influence of the size of silver nanowires on the performance of silver nanowire film. The experimental results show that the silver nanowire films prepared with silver nanowires with longer lengths and smaller diameters displayed better performances. The silver nanowire film with the best performance was prepared using silver nanowire with a diameter of 88 nm and a length of 29 μm. The thermal resistance of the sintered silver nanowire film that was hot-pressed at 250 °C 10 MPa was only 1.28 K∙W−1. The shear strength of the sintered joint was 56.4 MPa, and the fracture that occurred in the sintered silver nanowire film displayed a good plasticity.Keywords:electronic packaging;nano-silver;low-temperature sintering;shear strength;high thermal conductivity
研究领域:
材料科学
·
电子工程
✓ 已验证
产品关联
DOI
高影响因子
ENERGY & FUELS
·
2024
·
IF 5.2
Xiaochao Zuo,Yanting Zhang,Yili Tang,Xinyi Zhang,Quan Li,Aidong Tang,Huaming Yang
With the rapid development of electronics toward integration and miniaturization, efficient and accurate removal of excess energy from electronics has become a major challenge. In this study, a novel expanded graphite-based composite phase change film (EL) with high thermal conductivity was synthesized to facilitate the heat dissipation of electronic devices. The expanded graphite was compressed into a thin film and then impregnated with lauric acid (LA) to form EL. The effect of pressure on the thermal performance of EL was investigated. The results show that the latent heat storage capacity of composite phase films increases with the decrease in pressure. The melting and cooling enthalpy of EL-0 reach up to 111.6 and 107.9 J/g, respectively. Meanwhile, the corresponding in-plane thermal conductivity and axial thermal conductivity reach up to 21.28 W/(m·K) and 9.70 W/(m·K), which are 54.6 and 24.9 times those of the pure LA, respectively. It is interesting that the introduction of a phase change material (PCM) improves the axial thermal conductivity in comparison with the expanded graphite film without the PCM. The obtained EL exhibits excellent leakage-proof property and long-term thermal reliability. Last, the EL utilized in the thermal management of the graphics processing unit of the laptop running decreased the temperature by 5.0 °C, implying a potential application in the thermal management of electronics.
研究领域:
材料科学
·
热管理工程
✓ 已验证
产品关联
DOI
高影响因子
危险品化学品经营许可证（带存储）