Microsystems & Nanoengineering
·
2024
·Vol. 10
·期 1
·1-12
·
IF 7.3
Dong Helei,Lu Meimei,Wang Weifeng,Tan Qiulin
Hypersonic vehicles and aircraft engine blades face complex and harsh environments such as high heat flow density and high temperature, and they are generally narrow curved spaces, making it impossible to actually install them for testing. Thin-film heat flux sensors (HFSs) have the advantages of small size, fast response, and in-situ fabrication, but they are prone to reach thermal equilibrium and thus fail during testing. In our manuscript, an ITO–In 2 O 3 thick film heat flux sensor (HFS) is designed, and a high-temperature heat flux test system is built to simulate the working condition of a blade subjected to heat flow impact. The simulation and test results show that the test performance of the thick-film HFS is improved by optimizing the structure and parameters. Under the condition of no water cooling, the designed HFS can realize short-time heat flux monitoring at 1450 °C and long-term stable monitoring at 1300 °C and below. With a maximum output thermopotential of 17.8 mV and an average test sensitivity of 0.035 mV/(kW/m 2 ), the designed HFS has superior high-temperature resistance that cannot be achieved by other existing thin (thick) film HFSs. Therefore, the designed HFS has great potential for application in harsh environments such as aerospace, weaponry, and industrial metallurgy.
研究领域:
航空航天工程
·
材料科学
·
传感器技术
✓ 已验证
产品关联
DOI
PubMed
高影响因子
ADVANCED FUNCTIONAL MATERIALS
·
2025
·
IF 19
Wenjie Liu,Pengli Li,Zhantao Pei,Kunming Shi,Jie Chen,Fei Liu,Hua Bao,Gang Zheng,Xingyi Huang
The rapid increase in power density and the more limited space in compact electronic devices necessitate highly thermally conductive yet electrically insulating tapes for heat dissipation. However, state-of-the-art tapes have an in-plane thermal conductivity ( κ // ) lower than 70 W m −1 K −1 when the thickness exceeds 200 µm, limiting their applications in high heat flux devices. Herein, a multilayer, highly thermally conductive yet electrically insulating tape (MTCEIT) is developed by sandwiching graphene paper within boron nitride nanosheet-filled polymer nanocomposite adhesives and in series combining it with a boron nitride flake-filled polymer composite film. At ≈300 µm thickness, the MTCEIT exhibits an ultrahigh κ // of 121.22 W m −1 K −1 , while maintaining a volume electrical resistivity of 5.07 × 10 11 Ω·cm and a Weibull characteristic breakdown strength of 36.9 kV mm −1 . The multilayer structure endows the MTCEIT with exceptional electrical insulation and highly efficient heat dissipation capability, which can reduce the equilibrium temperature of a central processing unit (CPU) by 9 °C in a thin laptop and stabilize the video frame rate (fluctuation ≤ 0.1 fps) of an ultrathin smartphone without forced cooling. This study provides an innovative solution to the challenge of dissipating high heat flux in compact electronic devices.
研究领域:
材料科学
·
热工学
·
电子封装
·
纳米复合材料
·
能量耗散
✓ 已验证
产品关联
DOI
高影响因子
ADVANCED FUNCTIONAL MATERIALS
·
2025
·
IF 19
Wen Zhang,Wenchao Chen,Xiaoqin Ma,Yanfu Feng,Xiangpeng Geng,Qin Gong,Dekai Guan,Yaxin Liu,Bin Ma
The thermal management of highly integrated chips under high thermal flux density is hindered by disordered high-thermal-conductivity matrices that reduce phonon transport efficiency. To address this challenge, this study employs directional freezing to systematically align multi-walled carbon nanotubes, thereby establishing efficient thermal conduction pathways. Subsequent vacuum impregnation with the CaCl 2 ·6H 2 O phase change material (PCM) yields a composite material with pronounced anisotropic thermal conductivity—6.86 W·m −1 ·K −1 along the axial direction and 0.08 W·m −1 ·K −1 along the radial direction. This structural design not only enhances axial heat transfer and accelerates thermal equilibrium, but it also significantly suppresses PCM leakage via nanoconfinement and capillary effects, accelerating its phase transition by reducing subcooling to 11.41 °C. When employed for the transient thermal management of CPUs, the proposed material effectively directs heat flow, resulting in a 24 °C reduction in peak core temperature and a 19.5 °C reduction in peak surface temperature. Furthermore, this material demonstrates excellent thermal stability over 20 thermal cycles, with a maximum temperature fluctuation of only 5.2 °C. This study thus presents an effective strategy for the development of high-performance, structurally controllable PCM-based thermal interface materials.
研究领域:
材料科学
·
热工工程
·
电子器件散热
·
纳米复合材料
·
能量存储与管理
✓ 已验证
产品关联
DOI
高影响因子
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
·
2025
·
IF 14.3
Xinhui Geng,Ping Hu,Fei Wang,Wuju Wang,Liancai Xun,Chengfan Yuan,Xinghong Zhang
The increasing flight velocities of hypersonic vehicles require breakthroughs in active cooling technology to ensure the oxidation and ablation resistance of key thermal structures such as nose cones and windward surfaces. To achieve such a goal, we pioneered the active cooling approach by introducing arranged active cooling channels in the C f /HfB 2 -SiC composite, through which the temperature of the C f /HfB 2 -SiC composite could be significantly reduced under high heat flux tests. Intriguingly, with the increase of heat flux, the amplitude of temperature reduction exhibited a significant increasing trend. Specifically, under the heat flux of 4 MW/m 2 , the surface temperature of the C f /HfB 2 -SiC composite was reduced from exceeding 2000 to 1500 °C, achieving a temperature reduction of over 500°C. The composite sample also maintained excellent structural integrity under 2–4 MW/m 2 heat flux over a test time of 300 s. These results not only highlighted the substantial advantages of the aligned channel active cooling strategy but also provided a new avenue for developing ceramic matrix composites and structures in extreme environmental applications.
研究领域:
材料科学
·
航空航天工程
·
热防护系统
·
陶瓷基复合材料
·
高温材料
✓ 已验证
产品关联
DOI
高影响因子
危险品化学品经营许可证（带存储）