Polyimides (PIs) with remarkable mechanical, thermal, dielectric properties have been extensively employed in electronic package of integrated circuit industry. However, PI is imidized at high temperature (>350 °C) traditionally, which limits its application in thin-film transistor and fan-out wafer level package (FOWLP). In this work, active curing catalyst of 5-aminobenzimidazole is introduced in covalent bond to get a low temperature curable polyimide with superior comprehensive properties. The results prove that PI-3 can be imidized completely at 200 °C in 2 h and the imidization index could be as high as 1.03. Besides, the PI films exhibit excellent thermal stability of which the temperature for 5% weight loss is as high as 526 °C and glass transition temperature is 428 °C which is obtained by dynamic mechanical analyzer. Moreover, the tensile test shows the tensile strength of PI-3 is 91 MPa and elongation at break is about 15%. All these results prove the superior performance of the low temperature curing PIs, showing great potentials in the advanced package in the FOWLP and the others.
Ning Li,Chao Ma,Mao Ye,Xiangyu Guo,Zhihua Qiao,Chongli Zhong
Mixed-matrix membranes (MMMs) have arisen as an energy-saving and efficient candidate for CO 2 separation that can mitigate the greenhouse effect. However, challenges still remain in achieving good filler-polymer compatibility and high separation performance. Herein, a mechanochemistry method is proposed to synthesize an amine-functionalized ultramicroporous ZIF-62 (ZIF-UC-6) with good CO 2 affinity. Amino functional groups and open metal sites are introduced into ZIF-UC-6, which significantly improve its CO 2 adsorption capacity of ZIF-62. According to the ideal adsorption solution theory (IAST) calculation, the CO 2 /CH 4 and CO 2 /N 2 selectivity of ZIF-UC-6 is ∼80 and ∼140, respectively. Besides, when ZIF-UC-6 is incorporated into Pebax, hydrogen bonds can form between filler and polymer, which can increase the interfacial compatibility in the MMMs. The optimized membrane possesses a CO 2 permeability of ∼560 barrer, together with high CO 2 /CH 4 and CO 2 /N 2 selectivity of 41.8 and 86.2, surpassing the corresponding upper bounds. Moreover, the prepared MMMs have good pressure resistance and long-term stability. This work demonstrates an effective route for developing MMMs with good interfacial compatibility and high CO 2 separation performance for potential industrial applications.
Cun-Xiang Wang,Dong-Qiang Lin,Tao Liu,Shan-Jing Yao
Hydrophobic charge-induction chromatography (HCIC) is a highly promising technology for antibody separation. HCIC resins ABI-B-6FF were prepared with 5-aminobenzimidazole (ABI) as the functional ligand. The effects of ligand density on the adsorption of human immunoglobulin G (hIgG) and bovine serum albumin were focused. It was found that the adsorption capacity and dynamic binding capacity (DBC) were improved with the increase of ligand density. The adsorption capacity and DBC of hIgG reached 128.07 mg/g gel and 67.63 mg/g gel. The results indicated that ABI-B-6FF resin has a promising potential for the application of antibody purification.
Zhufeng Hu,Yuchen Tong,Min Wang,Bing Sun,Huijuan Bai,Junbo Xu,Chao Yang
The preparation of polyimide matrix composites with low curing temperature and high mechanical properties is of great importance. In this study, a low-cost and multi-functional nanofiller, 5-aminobenzimidazole grafted graphene oxide (5-ABZ@GO) has been designed. By nucleophilic attack on 5-aminobenzimidazole basic groups and doping of GO, the above requirements of polyimide composites were skillfully realized. The results show that when the addition of 5-ABZ@GO is 1%, the 5-ABZ@GO/PI nanocomposites can achieve complete imidized at 200°C. Moreover, the nanocomposite prepared by imidization at 200°C has good mechanical and thermal properties (tensile strength is 141.64 MPa, modulus is 6.05 GPa, T 5% is as high as 543.5°C), which is better than the PI composites prepared at 320°C. This study provides an innovative approach to preparing polyimide composites that meet mechanical performance requirements while utilizing comparatively lower curing temperatures, low curing temperature polyimide resins provide a new path for integrated composites with structure–function integration.
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