POLYMER COMPOSITES
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2024
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IF 4.8
Haipeng Dong,Bo Yang,Yin Guo,Khegay Lyubov Nikolaevna,Ming Yan,Li Song,Baikang Zhu,Zhi Li,Yingxue Lin,Shaohua Chai,Lu Zhang,Hengcong Tao
Regulating the dielectric properties of base stations is crucial for advancing 5G technology. This study presents the preparation of a series of graphene/polypropylene (PP) composites by blending various types and concentrations of graphene with PP using a melt blending process. The effect of different graphene types (graphene oxide, multilayer graphene, and exfoliated graphene) and concentrations (0.1, 0.5, 1, and 2 wt%) on the composites was characterized using scanning electron microscope (SEM), X-ray diffraction (XRD), differential scanning calorimeter (DSC), impedance analyzer, rotational rheometer, and thermal gravimetric analyzer (TGA). Results show that high shear force and temperature during preparation ensure the mechanical and thermal properties of the composites. Specifically, the permittivity decreased by up to 18% with the incorporation of 1% multilayer graphene (MGE). The optimal performance was achieved with MGE compared to graphene oxide (GO) and exfoliated graphene (GE), as the composites exhibited enhanced mechanical strength, thermal stability, and lower permittivitys. This work suggests significant application prospects for PP composite materials in the 5G field due to the excellent characteristics of graphene. Highlights Graphene significantly reduces the permittivity of polypropylene. Strong interfacial bonding exists between moderate amounts of graphene and PP. Graphene boosts substrate crystallization to reduce permittivity. Composite permittivity rises with filler's permittivity increase.
研究领域:
材料科学
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电子工程
✓ 已验证
产品关联
DOI
高影响因子
CHINESE JOURNAL OF POLYMER SCIENCE
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2019
·Vol. 38
·期 3
·213-219
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IF 2.804
Qian Chao,Fan Zhen-Guo,Zheng Wei-Wen,Bei Run-Xin,Zhu Tian-Wen,Liu Si-Wei,Chi Zhen-Guo,Aldred Matthew P.,Chen Xu-Dong,Zhang Yi,Xu Jia-Rui
High-performance low- k and low-loss circuit materials are urgently needed in the field of microelectronics due to the upcoming Fifth-Generation Mobile Communications Technology (5G Technology). Herein, a facile design strategy for non-fluorinated intrinsic low- k and low-loss polyimides is reported by fully considering the secondary relaxation behaviors of the polymer chains. A new amorphous non-fluorinated polymer (TmBPPA) with a k value of 2.23 and a loss tangent lower than 3.94 × 10 −3 at 10 4 Hz has been designed and synthesized, which to the best of our knowledge is the lowest value amongst the non-fluorinated and non-porous polymers reported in literature. Meanwhile, TmBPPA exhibits excellent overall properties, such as excellent thermostability, good mechanical properties, low moisture absorption, and high bonding strength. As high-performance flexible circuit materials, all these characteristics are highly expected to meet the present and future demands for high density, high speed, and high frequency electronic circuit used in 5G wireless networks.
研究领域:
材料科学
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电子工程
✓ 已验证
产品关联
DOI
高影响因子
COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS
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2024
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IF 4.9
Fan Yang,Xiunan Li,Ye Sun,Wanying Yang,Dong Jiang,Jianxin Mu,Guibin Wang,Yanhua Yang
With the rapid development of 5 G technology, the heat dissipation of electronic devices has become an important challenge. It is particularly essential to construct efficient thermal transfer networks in order to obtain advanced materials with superior thermal conductivity as well as excellent electrical insulating properties. In this work, poly (ether ether ketone) (PEEK) was sulfonated to achieve its solubility for electrospinning. Multi-scale hybrid fillers containing hydroxylated boron nitride nanosheets (fBNNSs) and carboxylated multi-walled carbon nanotubes (fMWCNT) are aligned along the direction of sulfonated PEEK (SPEEK) fibers during electrospinning process where fMWCNT with high aspect ratio can be used as mediators to connect the dispersed fBNNSs resulting in synergistic effect to extensively improve the thermally conductive performance. The hydrogen bond interaction among sulfonic acid group, carboxy groups and hydroxy groups from the matrix and modified fillers can not only make the fillers disperse uniformly but also improve the interfacial properties, thus reducing the phonon scattering at the interface efficiently, to enhance the thermal conductivity significantly at relatively low filler loading. fBNNSs@fMWCNT/SPEEK composite exhibits excellent thermal conductivity (λ) of 5.25 W/(m·K) when the filler content reached by 26 wt% with the ratio of fBNNSs to fMWCNT of 25:1(wt:wt). Under the composition above, the excellent electrical insulating property (2.54×10 15 Ω·cm) is achieved as well. Furthermore, fBNNSs@fMWCNT/SPEEK fiber membrane can be used as thermally conductive filler to construct a "sandwich" structured composite with PEEK film. When the mass ratio is 1:1, the λ of composite is 3.1 W/(m·K), which is 1200% higher than that of PEEK. This work provides better understanding of PEEK based thermal conductive composites for the prospective application of thermal management materials in electrical insulating related fields.
研究领域:
材料科学
·
电子工程
✓ 已验证
产品关联
DOI
高影响因子
ACS Applied Polymer Materials
·
2024
·
IF 4.4
Kun Peng,Xinyan Yang,MD Zahidul Islam,Xiangyu Mei,Yuhao Jiang,Xiaoming Qi,Yaqin Fu
As 5G technology rapidly progresses, the demand for insulating dielectric materials with low dielectric constants, minimal dielectric loss, and enhanced thermal and mechanical properties has become increasingly critical. In order to combine the advantages of both fluoropolyimide (FPI) and polytetrafluoroethylene (PTFE), this study successfully developed an FPI/PTFE/FPI composite film with a sandwich structure that seamlessly integrated a commercial hydrophilic PTFE porous fibrous film and FPI. This structure capitalizes on the permeation effect of the FPI wet film to significantly improve interfacial interactions compared to traditional sandwich-structured composites. Consequently, the composite films have an excellent combination of properties. When the proportion of PTFE reaches 50%, the composite film remains stable across high-frequency bands (8.2 to 12.4 GHz), with an impressively low value of 1.5 at 9 GHz. The composite film also exhibits exceptional electrical breakdown strength (385.2 kV mm–1), tensile mechanical robustness (σb = 64 MPa, E = 2.1 GPa), thermal stability (Td5% = 496.1 °C, Tg = 306.2 °C), and a low coefficient of thermal expansion (51.7 ppm/K). Notably, the composite film still maintains good hydrophobic properties, with a water contact angle of 81.2° and a water absorption rate of 3.1%. This research also details an efficient coating method to fabricate flexible dielectric films, proposing a strategy for the development of advanced insulating materials suitable for high-frequency and high-speed communication applications.
研究领域:
材料科学
·
电子工程
✓ 已验证
产品关联
DOI
高影响因子
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