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Ag@GF
CARBON · 2024 · IF 10.5

Synergistic magnetic/dielectric loss and layered structural design of Ni@carbon fiber/Ag@graphene fiber/polydimethylsiloxane composite for high-absorption EMI shielding

Lu Xu,Ranran Si,Qi Ni,Jiaan Chen,Jiale Zhang,Qing-Qing Ni

Simultaneously achieving excellent shielding effectiveness (SE) and high absorption rate of flexible electromagnetic interference (EMI) shielding materials has become a growing demand for the new generation of highly integrated electronic devices. This study constructed a double-layer polydimethylsiloxane (PDMS) EMI shielding composite film, with the upper layer using Ni-plated carbon fiber (Ni@CF) as the high absorption loss part and the lower layer using Ag-plated graphene fiber (Ag@GF) as the reflection attenuation part. Due to the synergistic magnetic/dielectric loss effect in the upper layer, high electrical conductivity in the lower layer, and the shielding mechanism of “absorption-reflection-reabsorption” induced by the double-layer structure, this composite film achieves efficient EMI shielding performance and high absorption characteristics in the X-band. The EMI SE values of the 2 mm thick film containing 0.03 wt% Ni@CF and 1.2 wt% Ag@GF reach 33.7 dB, while shielding effectiveness of reflection ( SE R ) and absorption ( SE A ) is 0.8 dB and 32.9 dB, respectively. This result means that the composite film only reflects 17.2 % of the microwaves while shielding 99.9 % and absorbs nearly 82.7 %, exhibiting a significant absorption-dominated shielding mechanism. This flexible and efficient shielding film with a high absorption rate suits portable and wearable intelligent electronic products to reduce secondary electromagnetic pollution.

研究领域: 材料科学 · 电子工程
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JOURNAL OF ALLOYS AND COMPOUNDS · 2018 · IF 3.779

Effects of nanotube content on thermal and mechanical properties of NT@Cu/Ag@GF/Al composites

Xiaopeng Han,Ying Huang,Qiao Gao,Rui Fan,Xuanyi Peng

NT@Cu and Ag@GF supported the aluminum (Al) composites had been synthesized by vacuum gas pressure infiltration and their microstructure, Coefficient of thermal expansion (CTE), thermal and mechanical properties were investigated. Cu particles encapsulated with NT had been designed to improve the dispersion of NT and form a carbon conductive network. The chemical plating process was used to enhance the wettability between graphite flakes (GF) and Al matrix and eliminate the harmful interfacial reactions. The composites of NT3 had displayed excellent in-plane thermal conductivity (TC) of 378.48 W/mK and stable CTE in high temperature application environment. What's more, the bending strength had been enhanced to approximately 85.15 Mpa. In this study, the innovative way can be applied to fabricate NT@Cu/Ag@GF/Al composites.

研究领域: 材料科学 · 热力学
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