Ni 0.5 Ti 0.5 NbO 4 was firstly reported as filler to adjust dielectric properties of polymer matrix composites for printed circuit board (PCB) application. In this study, the Ni 0.5 Ti 0.5 NbO 4 filler was modified using γ-aminopropyl triethoxy silane (KH550). The effects of KH550 on particle lipophilicity and Bisphenol-A cyanate ester resin (BADCy) curing behavior were studied. BADCy/Ni 0.5 Ti 0.5 NbO 4 composites were fabricated by the traditional casting method. The dielectric properties and moisture absorption of the composites were tested. Results show that most hydrophilic groups on the surface of Ni 0.5 Ti 0.5 NbO 4 powder are replaced by lipophilic groups after modification, which results in the obvious improvement of Ni 0.5 Ti 0.5 NbO 4 filler dispersion in BADCy. Beyond that, surface modification also greatly affects the curing behavior of BADCy resin. The BADCy/Ni 0.5 Ti 0.5 NbO 4 -KH550 composites exhibit excellent dielectric properties as well as low moisture absorption. Furthermore, the dielectric constant can be accurately predicted using Effective Medium Theory (EMT model) when the morphology factor is 0.1407.
A simple method, which include cold isostatic pressing and vacuum assisted infiltration, that can significantly improve the filler content, was employed to fabricate Bisphenol-A cyanate ester resin (BADCy)/Ni 0.5 Ti 0.5 NbO 4 composites with high-k and ultra-low-loss. Results show that briquetting pressure and sintering temperature for fabricating Ni 0.5 Ti 0.5 NbO 4 porous preforms have a great influence on the properties of BADCy/Ni 0.5 Ti 0.5 NbO 4 composites. The optimal process for the fabrication of BADCy/Ni 0.5 Ti 0.5 NbO 4 composites is fixing the briquetting pressure at 90 MPa and sintering temperature at 700 °C. The dielectric constant and loss of the composites are 22.79 and 4.17 × 10 −3 at 9041 MHz, respectively. Properties of this kind of composites can meet the requirements for high-k and ultra-low-loss PCB application.
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