Combining sintering additive with field assisted sintering, stereolithographical dense Si 3 N 4 ceramics was successfully fabricated. Owing to a large amount of polymer during the stereolithography, the green parts have the characteristics of low powder loading and high porosity. Adjusting the process parameters such as sintering temperature and soaking time can effectively improve the density of the specimens. The stress exponent n of all specimens is in a range of 1 and 2, which is derived from a modified sintering kinetics model. The apparent activation energy Q d of stereolithographic Si 3 N 4 ceramics sintered with applied pressures of 30 MPa, 40 MPa, and 50 MPa is 384.75, 276.61 and 193.95 kJ/mol, respectively, suggesting that the densification dynamic process is strengthened by raising applied pressure. The grain boundary slipping plays a dominating role in the densification of stereolithographic Si 3 N 4 ceramics. The Vickers hardness and fracture toughness of stereolithographic Si 3 N 4 ceramics are HV10/10 (1347.9±2.4) and (6.57±0.07) MPa·m 1/2 , respectively.
To elucidate how CeO2 additives enhance the activity and stability of Cu-SSZ-13 SCR catalysts, we investigated two CeO2/Cu-SSZ-13 composite catalysts with Cu loadings of 1.0 and 2.5 wt %. These catalysts were characterized using an array of techniques, including XRD, SEM, TEM, NMR, H2-TPR, NH3-TPD, DRIFTS, DFT and SCR reactions under both steady-state and transient kinetic analysis conditions. Our findings demonstrate that CeO2 promotes low-temperature SCR by forming exchanged, isolated Ce-ions, which enhance Cu-ion coupling efficiency. External surface CeO2 particles can convert NO + O2 to surface nitrates, but these species primarily act as spectators below ∼250 °C, and do not contribute to the enhancement of low-temperature SCR activity. In contrast, these surface CeO2 particles can synergizes with Brønsted acid sites (BAS) to elevate high-temperature SCR activity. Furthermore, hydrothermal stability and sulfur resistance are improved by the presence of external surface CeO2 particles, a benefit that applies irrespective of Cu loading.
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