ACS Catalysis
·
2024
·
IF 11.3
Xiaofeng Liu,Yuanyuan Sun,Hao Ren,Yan Lin,Mingbo Wu,Zhongtao Li
Electrochemically driven carbon–carbon coupling utilizing renewable electricity under ambient conditions has emerged as an innovative approach for synthesizing high-value chemicals, which still faces inherent challenges such as low conversion rates and poor selectivity. While electroreducing furfural to hydrofuroin can produce high-quality biofuel, its efficiency need to be promoted. Herein, Cu–Sn bimetallic catalyst has been developed with a conversion rate of furfural of >97% and hydrofuroin selectivity of >67% through equilibrium of the interfacial intermediate *H and *fur-CHOH, which exhibits the greatest state-of-the-art overall performance. Characterization and theoretical calculation reveal that Cu serves as the active site for generating *fur-CHOH, whose electron density can be decreased by introducing Sn, and results in a higher *fur-CHOH coverage and a lower energy barrier of dimerization. Moreover, adding Sn also enables sluggish *H formation to balance interfacial *fur-CHOH and *H, leading to reduced hydrogenation byproducts. The as-developed approach provides valuable insights for optimizing other C–C electrocoupling reactions for the synthesis of high-value chemicals.
研究领域:
化学
·
材料科学
·
催化反应
✓ 已验证
产品关联
DOI
高影响因子
Materials
·
2022
·Vol. 15
·期 3
·914
·
IF 3.748
Jintao Wang,Xinjie Wang,Lin Zhang,Luobin Zhang,Fangcheng Duan,Fengyi Wang,Weiwei Zhang,Jianqiang Wang,Zheng Zhang,Chunjin Hang,Hongtao Chen
A 3–5 μm Cu@Sn core-shell powder was prepared by chemical plating. Based on the mixture of this Cu@Sn and Ag NPs (nanoparticles), a soldering material for third-generation semiconductors was prepared. The joints prepared with this soldering material had a shear strength of over 40 MPa at 25 °C. This joint did not fail after more than 600 thermal cycles from −40 °C to 140 °C. The special feature of this joint is that the energy potential difference between nanoparticles and micron particles generated in the surface force field during reflow promoted the surface pre-melting of the particles by releasing the excess energy. By this mechanism, it was possible to reduce the porosity of the sintered layer. At the same time, due to the high surface activity energy of nano-silver, the diffusion of the Sn atoms was promoted, further enhancing the bond strength.Keywords:TLP;Cu@Sn;integrated packaging;soldering
研究领域:
材料科学
·
电子封装技术
✓ 已验证
产品关联
DOI
PubMed
高影响因子
CHEMICAL ENGINEERING JOURNAL
·
2022
·
IF 16.744
Wei Chen,Huawu Xu,Xiaoling Ma,Lin Qi,Zhiming Zhou
Selective hydrogenation of phenylacetylene is the most effective way to remove a small amount of phenylacetylene from styrene, but it is still a challenge to develop catalysts with high activity and selectivity. Herein, a series of non-precious bimetallic Ni 3 M/SiO 2 (M = Zn, Sn, Cd, Fe, Co, Cu, or Mo) and trimetallic Ni 3 Cu–Sn/SiO 2 catalysts were prepared and applied to selective hydrogenation of phenylacetylene. A trade-off between activity and selectivity was observed on Ni 3 M/SiO 2 , where Ni 3 Cu/SiO 2 showed the best hydrogenation activity because of the hydrogen spillover effect of the Ni–Cu alloy, while Ni 3 Sn/SiO 2 exhibited the highest selectivity to styrene due to the active-site isolation effect of the Ni–Sn alloy. Impressively, trimetallic Ni 3 Cu–Sn/SiO 2 offered superior catalytic performance (94 % styrene selectivity at >99 % phenylacetylene conversion) as compared to bimetallic catalysts, owing to the synergistic effect among Ni, Cu, and Sn. In the case of Cu and Sn co-doping, the hydrogen spillover on the Ni–Cu alloy was deeply suppressed by Sn, which enabled an effective modification of the geometric and electronic structures of Ni to favor styrene desorption. The hydrogenation activity of Ni 3 CuSn 0.3 /SiO 2 can be readily enhanced by increasing the metal loading and further improved by elevating the reaction temperature and pressure, but meanwhile the high selectivity is little affected. This work demonstrates a multi-metal synergistic strategy to break the activity–selectivity trade-off of Ni-based bimetallic catalysts in the selective hydrogenation of alkynes.
研究领域:
催化化学
·
材料科学
✓ 已验证
DOI
高影响因子
Scientific Reports
·
2025
·Vol. 15
·期 1
·1-17
·
IF 3.9
Ge Rui,Tang Jing,Li Weijun,Liang Ping
In this study, a Cu-Sn superhydrophobic coating was fabricated on the surface of X70 steel via the electrodeposition method, resulting in an optimal contact angle of 164.2 ± 1.2°. Compared to the X70 substrate, the Cu-Sn coating exhibits superior corrosion resistance. In a 3.5 wt% NaCl solution, the polarization resistance ( R p ) is 71,037 Ω·cm 2 , approximately 48 times higher than the substrate; the corrosion current ( I corr ) is 2.23 × 10 − 7 A/cm 2 , roughly two orders of magnitude lower than that of the substrate. This enhancement is attributed to the addition of Sn, which combines with Cu to form a Cu-Sn alloy with a micro-nano structure, effectively improving the hydrophobicity and corrosion resistance of the coating. However, excessive SnSO 4 can hinder the formation of the micro-nano structure, leading to aggregation on the coating surface. In addition, the coating exhibits excellent self-cleaning properties and mechanical stability. After undergoing rigorous mechanical stability tests, including tape peeling, sandpaper abrasion, water drop impact, and sand erosion, the contact angle remains above 155°. These results are significant for addressing the issue of long-term durability and stability of superhydrophobic coatings in industrial applications and provide new prospects for the deposition of metals or alloys.
研究领域:
材料科学
·
电化学
·
表面工程
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产品关联
DOI
PubMed
高影响因子
MATERIALS & DESIGN
·
2016
·
IF 3.997
Tianqi Hu,Hongtao Chen,Mingyu Li
This paper presents a novel die attach material that withstands high working temperatures of up to 676 °C after < 40 min of reflow at 250 °C. The die attach material was preform compressed with Cu@Sn core-shell structured microparticles . When the reflow temperature reached 232 °C, the outer Sn layer melted and connected the inner Cu cores. After reflow soldering at 250 °C for 8 min, the outer Sn completely transformed into network-like Cu-Sn intermetallic compounds (IMCs), which have a higher remelting temperature than Sn (415 °C for Cu 6 Sn 5 and 676 °C for Cu 3 Sn). Consequently, the inner Cu cores were interconnected by the formed network-like Cu-Sn IMCs with a high remelting temperature of at least 415 °C. If the sample was reflowed at 250 °C for 40 min, the outer Cu 6 Sn 5 layer completely transformed into Cu 3 Sn, and the resulting bondline could sustain a higher temperature. The shear strengths of the resulting bondlines after reflow soldering at 250 °C for 8 and 40 min were 29.35 and 18.78 MPa at 400 and 500 °C, respectively.
研究领域:
材料科学
·
电子工程
·
冶金学
✓ 已验证
产品关联
DOI
高影响因子
MICROPOROUS AND MESOPOROUS MATERIALS
·
2018
·
IF 3.649
Yiping Tang,Chaoqi Bi,Duo Zhang,Guangya Hou,Huazhen Cao,Liankui Wu,Guoqu Zheng,Qingliu Wu
To overcome the shortcomings of poor conductivity and large volume change, we proposed a novel three-dimensional ordered macroporous Cu/Sn (3DOM Cu/Sn) composite material as the anode of lithium-ion batteries (LIB). Electron microscopies and X-ray diffraction revealed that this new 3DOM Cu/Sn composite has the surface of the 3DOM Cu framework covered with a uniform layer of Sn nanoparticles . As a binder-free anode of LIB without conductive additives, this 3DOM Cu/Sn composite demonstrated an extremely high rate capability of about 707 mAh/g at 5C, which is 4 times higher than that of bare Cu/Sn anode, and excellent durability of 851 mAh/g up to 250 cycles. The post-test analysis showed that extraordinarily electrochemical performances of this composite anode are ascribed to the unique 3DOM microstructure.
研究领域:
材料科学
·
电化学
·
能量存储
✓ 已验证
产品关联
DOI
高影响因子
RARE METALS
·
2025
·
IF 11
Zhang Qi,Zhang Zhiqiang,Zeng Fangyuan,Li Wenjie,Liu Jinhao,Ai Shubo,Zheng Yun,Li Zhe,Shao Huaiyu,Liu Zhi-Quan
Kirkendall voids (KVs) at the Cu/Sn interface are a typical failure in integrated circuits, leading to solder joint cracking and electrical disconnection. Although the formation of KVs has been attributed to the difference in atomic diffusion rates at the Cu/Sn interface, the role of Cu intrinsic "quality" parameters (crystal defects) in this process remains unclear. This work systematically investigated the effects of Cu crystal defects on KVs: Cu substrates with different lattice defects and grain boundaries were prepared using proprietary electrodeposition additives, and the number of defects was quantitatively characterized by micro-strain, geometric dislocation density, and geometric phase analysis. The thermal aging experiments further showed that the formation of intermetallic compounds and KVs was related to crystal defect energy. When the grain boundary energy was higher than the lattice energy, the additional driving force resulted in short-circuit diffusion, causing local Cu depletion and voids. The low-crystal-defect samples maintained the local Cu/Sn interdiffusion equilibrium, resulting in fewer voids after 1000 h. This study emphasizes that regulating the crystal defects can reduce KVs and provides a new insight for improving the integrated solder joint’s reliability.
研究领域:
材料科学
·
微电子学
·
固体物理
·
应用物理学
✓ 已验证
产品关联
DOI
高影响因子
COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS
·
2014
·
IF 2.354
Weimin Cao,Wei Li,Renhe Yin,Wei Zhou
Highly stable Cu–Sn core–shell nanoparticles with an average size of 30 nm are synthesized by displacement reaction, which is triggered by the complexation of thiourea with copper nanoparticles. A thin Sn metal shell of 2–3 nm thickness has been fabricated onto the surface of Cu nanoparticles, resulting in the Cu–Sn core–shell structure. SEM, HR-TEM, EDS, DLS, UV–vis, IR, XPS and TGA measurements have been employed to characterize the special core–shell structure, and to confirm the stability of nanoparticles toward oxidation. It has been found that the thin Sn shell prevents the Cu core from oxidation. The effect of thiourea on the Sn reduction is also discussed. Conductive ink prepared using the nanoparticles shows high stability over a long period of storage, and are hopeful to be applied for inkjet printing technology.
研究领域:
材料科学
·
化学
✓ 已验证
产品关联
DOI
高影响因子
Science China-Materials
·
2020
·Vol. 64
·期 5
·1087-1094
·
IF 6.098
Wang Rui,Shi Faxing,He Xin,Shi Jinqiang,Ma Tao,Jin Song,Tao Zhanliang
The uneven deposition of lithium (Li) on current collectors causes serious dendrite growth and volume expansion. Commercial foamed copper (Cu) current collectors are unsuitable for Li anodes because of their large volume and mass and lithiophobic nature. Herein, a three-dimensional (3D) copper@tin (Cu@Sn) nanocone current collector with small volume, light weight, and lithiophilic nature was prepared by a simple electrodeposition method. The synergy of the nanoconical structure and lithiophilic Sn promotes the even deposition of Li and effectively inhibits the formation of Li dendrites. The resultant half batteries exhibit high Coulombic efficiency of 97.6% after 100 cycles at 1 mA cm −2 , and the symmetrical Li battery demonstrates a prolonged lifespan of over 600 h at 1 mA cm −2 . The full battery based on organic liquid electrolyte with LiFePO 4 also exhibits a long lifespan of 550 cycles with high capacity retention of 95.1% at 1 C. Moreover, 3D Cu@Sn nanocone-based solid-state batteries exhibit excellent electrochemical performance and show no decay after 500 cycles at 1 C. Our work provides a strategy for fabricating 3D current collectors for high-energy-density Li metal batteries.
研究领域:
材料科学
·
电化学
·
储能
·
纳米技术
·
锂离子电池
✓ 已验证
DOI
高影响因子
MATERIALS CHARACTERIZATION
·
2026
·
IF 6.2
Bi Wang,Jian Huang,Lili Wang,Chengxu Lin,Caihang Liang,Qi Feng,Hongbo Qin
Herein, Cu@Sn core–shell particles were prepared and used to formulate a novel transient liquid phase sintering composite paste. Composite joints fabricated from this paste achieved low-temperature bonding while offering excellent mechanical strength and high-temperature service capability. Cu@Sn particles with a uniform Sn shell were produced via electroless tin plating, and the effect of the Cu@Sn: Sn mass proportions on the shear strength of the joints was systematically evaluated. The joints prepared by sintering the paste with a Cu@Sn: Sn mass proportion of 6:4 at 260 °C under 10 MPa pressure for 15 min achieved a shear strength of 106.84 MPa at 25 °C and retained 94.26 MPa at 300 °C. Microstructural characterization revealed that appropriate addition of Sn particles effectively regulated the formation and distribution of intermetallic compounds (IMCs) and markedly reduced the porosity of the sintered layer. The formation of fine-grained Cu 3 Sn substantially enhanced the joint strength; meanwhile, the development of subgrains and low-angle grain boundaries on the Cu substrate side of the substrate/sintered layer interface improved the interfacial bonding. The accumulation of dislocations at the soft Cu particles against the hard IMC phases generated back stress and increased strain hardening, promoting hetero-deformation induced strengthening in the heterostructured materials. Twin boundaries observed in some Cu cores also acted as barriers to dislocation motion, promoting dislocation storage while preserving the plasticity of the Cu phase, thereby further increasing the strength of the Cu@Sn composite joints.
✓ 已验证
产品关联
DOI
高影响因子
Batteries & Supercaps
·
2025
·
IF 4.7
Chang He,Qiao Jiang,Zhehan Yi,Jin Yu,Pinxiang Li,Shandong Tan,Ji Liang,Feng Hou
Aqueous zinc-ion batteries (AZIBs) are currently highly promising rechargeable batteries offering affordable prices and high reliability. However, the uncontrolled expansion of zinc dendrites, hydrogen evolution reaction, and adverse reaction greatly affect their potential sustainable application. Herein, Cu–Sn nanoparticle alloy-modified carbon nanofibers (Cu/Sn–C) are constructed as a buffer interface region onto the zinc anode. The high density of zincophilic sites of the Cu/Sn–C contributes a homogeneous Zn deposition behavior, ameliorates potential separator penetration of zinc dendrites, and weakens corrosions and adverse reactions. As a result, Cu/Sn–C exhibits a low zinc nucleation overpotential of 33.2 mV and dendrite-free zinc deposition. Besides, a symmetric cell with Cu/Sn–C@Zn anode exhibits outstanding cycling lifespan with over 3500 h at 1 mA cm −2 for 1 mAh cm −2 . Furthermore, Cu/Sn–C@Zn//Mn x V 2 O 5 full battery also achieves stable cycling at 5 A g −1 . This work provides a significant avenue for enhancing the reliability of the Zn anode, thereby facilitating the advancement of widespread applications for the next-generation AZIBs. Graphical Cu–Sn nanoparticle alloy-modified carbon nanofibers (Cu/Sn–C) are constructed as a buffer interface region onto the Zn metal anode. The abundant zincophilic sites of the Cu/Sn–C contribute a homogeneous Zn deposition behavior and weaken side reactions. Therefore, Cu/Sn–C presents a superior rate capability and long-term cycling stability.
✓ 已验证
产品关联
DOI
高影响因子
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
·
2025
·Vol. 36
·期 22
·1-13
·
IF 2.8
Ma Kangrui,Wu Jiawen,Wei Derong,Chen Jin,Rong Xuanting,Ding Ruyun,Gu Jia,Ma Xuetiao,Zheng Hui
With the development and use of the electronic and electrical equipment, solving electromagnetic pollution has become a top priority for human health. In this work, ternary co-doped (Ca 2 ⁺, Cu 2 ⁺, Sn 4 ⁺) ions were incorporated into M-type hexagonal barium ferrite (Ba 1-x Ca x Fe 11.6 Cu 0.2 Sn 0.2 O 27 ), and the effects of varying Ca 2 ⁺ doping levels on the crystal structure, surface morphology, and electromagnetic characteristics were thoroughly investigated. Structural characterizations confirms that Ca 2+ substitutes Ba 2+ sites, decreasing the grain size and lattice values while increasing the lattice strain. At x = 0.15, the Ba 1-x Ca x Fe 11.6 Cu 0.2 Sn 0.2 O 27 ferrite achieves the maximum value of saturation magnetization of 67.7 emu/g, the highest RL min value of -44.2 dB@14.3 GHz and effective absorption bandwidth of 3.04 GHz, showing potential as an effective material for absorption applications.
研究领域:
材料科学
·
电磁学
·
固体物理学
·
环境科学
✓ 已验证
产品关联
DOI
高影响因子
危险品化学品经营许可证（带存储）