JOURNAL OF ALLOYS AND COMPOUNDS
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2025
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IF 6.3
Junqi Li,Feiyu Qin,Yiping Lv,Xin Yang,Tianhang Wu,Xiaoling Wang,Wenhui Xu,Nianjie Liu,Jun Wang,Lei Hu,Jun Sun,Xiangdong Ding
Thermal expansion mismatch among packing epoxy, silicon chip and copper microbump, generates severe thermal stress in 3D packaging and system in package . This inherent issue generally leads to warpage and interface crack of integrated circuit (IC). Furthermore, low thermal conductivity is equally disadvantageous to heat dissipation in electronic packing materials, especially for high power density IC. Consequently, the thermal expansion mismatch and low thermal conductivity concurrently result in the dilemma of IC and speed up structural failure. Conventionally, amorphous silica with the low thermal expansion is incorporated into the epoxy to design an epoxy molding compound in order to reduce the giant thermal expansion of epoxy. However, commercial epoxy/silica composites cannot effectively solve the critical issues of thermal expansion mismatch and low thermal conductivity. Here, the Cu 2 V 2 O 7 (CVO) with negative thermal expansion (NTE) was introduced into epoxy to design the unconventional Epoxy/CVO composites, which demonstrates suppressed thermal expansion and high thermal conductivity . When the mass fraction of CVO researches up to 60 %, the linear coefficient of thermal expansion of this composite decreases from 94.5 ppm·K ‐1 of epoxy down to a low value of 25.8 ppm·K ‐1 . Concurrently, this composite achieves a high thermal conductivity of 1.31 W·m ‐1 ·K ‐1 . Moreover, the resistivity, tensile strength , elastic modulus and thermal hardness are measured to be 9.3 × 10 10 Ω·m, 13.7 MPa, 7.4 MPa and 80.2 HD, respectively, close to the values of the ideal epoxy molding compound. This work develops an untraditional Epoxy/NTE composite and offers a systematic investigation of their thermal, mechanical and dielectric properties , which is highly helpful for the development of advanced electronic packaging materials.
研究领域:
材料科学
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高分子化学
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热力学
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电子封装
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功能复合材料
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产品关联
DOI
高影响因子
IONICS
·
2024
·Vol. 30
·期 3
·1615-1625
·
IF 2.4
Dong Jinxiu,Cui Shichuang,Wang Fei,Wei Wei,Yin Ziluo,Zhang Yuqing,Zhu Quanyao
Electrochromism (EC) is a color control technique for providing visual information, in which vanadium pentoxide (V 2 O 5 ) is a promising material for electrochromic applications due to its excellent ionic intercalation/deintercalation properties and cathodic/anodic color-changing properties. However, its poor cycling stability and color change response rate limit its practical application. Metal–organic frameworks (MOFs) combine the rigidity and flexibility of inorganic–organic materials and can meet the requirements of EC materials such as cycle stability, electrical conductivity, and stress-interference resistance. We report here a strategy to modify V 2 O 5 with Cu-MOF. Cu-doped V 2 O 5 and carbon skeleton (Cu 2 V 2 O 7 @C) composites were prepared for electrochromism. In this scheme, Cu doping can facilitate lithium ion migration by broadening and stabilizing the structure of V 2 O 5 , and the distribution of the carbon skeleton can broaden the contact of the active material with the electrolyte and improve the electron conduction. Combining these merits, it exhibits excellent long-term cycle stability (the capacity retention rate reaches 91.78% after 2000 cycles), the light transmission modulation is greatly improved compared with V 2 O 5 (Δ T = 69%, doubled), and the response time is reduced by 30.43%. This study provides a new perspective for improving the light modulation ability and long-term use stability of vanadium oxide EC materials and promotes the development of MOF materials in the field of electrochromism.
研究领域:
材料科学
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电化学
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产品关联
DOI
高影响因子
CERAMICS INTERNATIONAL
·
2026
·
IF 6
Yiping Lv,Feiyu Qin,Jijuan Wu,Xin Jin,Xiaoya Bai,Jun Sun,Xiangdong Ding,Lei Hu
Thermomechanical reliability in highly integrated 3D packaging is critically challenged by the coefficient of thermal expansion (CTE) mismatch among constituent materials. Employing negative thermal expansion (NTE) materials enables precise CTE tailoring of epoxy molding compounds (EMCs). This study reports a synergistic approach by incorporating NTE Cu 2 V 2 O 7 (CVO) with highly thermally conductive fillers (Al 2 O 3 and diamond) into a Bisphenol F epoxy to form a low thermal expansion EMC with high thermal conductivity. For the composite containing 70 wt % CVO, the CTE 1 (below the glass transition temperature, T g ) is 20.9 × 10 −6 °C −1 , while the CTE 2 above T g is 73.2 × 10 −6 °C −1 . Remarkably, the composite with 40 wt % CVO and 40 wt % diamond achieves a significantly lower CTE 1 of 16.5 × 10 −6 °C −1 and CTE 2 of 25.3 × 10 −6 °C −1 . Compared to epoxy with the CTE 1 and CTE 2 of 76.1 × 10 −6 °C −1 and 174 × 10 −6 °C −1 , it achieves a substantial reduction up to 78 % in CTE 1 and 86 % in CTE 2 . Moreover, these CTE 1 and CTE 2 closely match those of Cu bump (17 × 10 −6 °C −1 ) and RDL in IC, thereby mitigating thermal stress induced by CTE mismatch. Notably, this composite achieves a remarkably high thermal conductivity of 2.00 W m −1 °C −1 at room temperature, surpassing the ideal value of 1 W m −1 °C −1 and showing a 733 % enhancement over epoxy. This work presents an unconventional method to design advanced EMC by incorporating both NTE and highly conductive fillers. This strategy helps to achieve the low thermal expansion and high thermal conductivity simultaneously, potentially offering insights for high-end electronic packaging materials.
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DOI
高影响因子
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